Methods and apparatus for heating a liquid

Patent metadata

Field	Value
Publication number	US-12449084-B2
Application number	US-202418665202-A
Country	US
Kind code	B2
Filing date	May 15, 2024
Priority date	Sep 17, 2021
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.

First claim

The invention claimed is:

1. An apparatus for heating a liquid, comprising:
a valve assembly configured to receive the liquid;
a pipe system downstream from the valve assembly and configured to allow flow of the liquid, wherein the pipe system comprises:
a first portion comprising a first pipe connected directly to the valve assembly and having a first diameter; and
a second portion downstream from the first pipe, wherein the second portion comprises a second pipe having a second diameter that is greater than the first diameter,

wherein the second pipe is configured to accumulate the liquid therein;
a heating system arranged around the second portion configured to heat the liquid in the second pipe;
a source vessel connected to and downstream from the second portion, wherein the source vessel is configured to receive and contain heated liquid from the second pipe and configured to deliver a gas produced from the heated liquid to a reaction chamber for processing; and
the reaction chamber, which is connected to and downstream from the source vessel, wherein the reaction chamber is configured to receive the gas from the source vessel for semiconductor processing within the reaction chamber.

2. The apparatus of claim 1 , further comprising a third pipe downstream from the source vessel.

3. The apparatus of claim 1 , wherein the heating system comprises a cast heater surrounding the second portion, and wherein the cast heater comprises a heating cartridge.

4. The apparatus of claim 1 , wherein the heating system comprises a heater jacket surrounding the second pipe.

5. The apparatus of claim 1 , wherein the heating system comprises a clamp heater surrounding the second pipe.

6. The apparatus of claim 1 , wherein the liquid received by the valve assembly has a temperature in a range of 20 to 30 degrees Celsius.

7. The apparatus of claim 1 , wherein the heating system is configured to heat the liquid in the second portion to a temperature in a range of 100 to 120 degrees Celsius.

8. A system, comprising:
a bulk container configured to hold a liquid;
a first pipe system connected to and downstream from the bulk container and configured to allow flow of the liquid;
a valve assembly connected to and downstream from the first pipe system and configured to control the flow of the liquid;
a second pipe system connected to and downstream of the valve assembly, wherein the second pipe system comprises:
a first pipe connected directly to the valve assembly and having a first diameter and configured to allow flow of the liquid; and
a second pipe downstream from the first pipe and having a second diameter that is greater than the first diameter, wherein the second pipe is configured to accumulate the liquid therein;

a heating system arranged around the second pipe configured to heat the liquid in the second pipe;
a source vessel connected to and downstream from the second pipe system, wherein the source vessel is configured to receive and contain heated liquid from the second pipe and configured to deliver a gas produced from the heated liquid to a reaction chamber for processing; and
the reaction chamber, which is connected to and downstream from the source vessel, wherein the reaction chamber is configured to receive the gas from the source vessel for semiconductor processing within the reaction chamber.

9. The system of claim 8 , wherein the first pipe lacks contact with the heating system.

10. The system of claim 8 , further comprising a third pipe downstream from the source vessel.

11. The system of claim 8 , wherein the heating system is configured to heat the accumulated volume of liquid in the second pipe system to a temperature in a range of 100 to 120 degrees Celsius.

12. The system of claim 8 , wherein the bulk container is configured to hold a liquid having a temperature in a range of 20 to 30 degrees Celsius.

13. The system of claim 8 , wherein:
the heating system comprises a cast heater surrounding the second pipe, and wherein the cast heater comprises a heating cartridge.

14. The system of claim 8 , wherein the heating system comprises a heater jacket surrounding the second pipe.

15. A method for heating a volume of a liquid, comprising:
flowing the liquid from a bulk container to a valve assembly via a first pipe system, wherein the liquid flowing into the valve assembly has a temperature in a range of 20 to 30 degrees Celsius;
flowing the liquid through the valve assembly;
flowing the liquid from the valve assembly to a second pipe system, wherein the second pipe system comprises:
a first pipe having a first diameter; and
a second pipe downstream from the first pipe and having a second diameter that is greater than the first diameter;

accumulating the liquid in the second pipe;
heating the liquid in the second pipe;
flowing the heated liquid from the second pipe to a source vessel, and
containing the heated liquid in the source vessel, wherein the source vessel is configured to deliver a gas produced from the heated liquid to a reaction chamber for processing.

16. The method of claim 15 , further comprising:
flowing the gas from the source vessel directly to a third pipe located downstream from the source vessel.

17. The method of claim 15 , wherein heating the liquid comprises providing a heating apparatus around the outside of the second pipe.

18. The method of claim 17 , wherein heating the liquid in the second pipe comprises heating the liquid to a temperature in a range of 100 to 120 degrees Celsius.

19. The method of claim 15 , wherein heating the liquid in the second pipe comprises heating the liquid to a temperature in a range of 80 to 200 degrees Celsius.

Assignees

• Asm Ip Holding Bv

Inventors

• Yednak Iii Andrew Michael

Classifications

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• C23C16/45561 Primary

  Gas plumbing upstream of the reaction chamber · CPC title

• Y10T137/6416

  With heating or cooling of the system · CPC title

• B01D1/0041

  Use of fluids · CPC title