Fluorinated polyurea copolymer pad
US-2023082181-A1 · Mar 16, 2023 · US
Chemical mechanical polishing pad with fluorinated polymer and multimodal groove pattern
US12447582B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12447582-B2 |
| Application number | US-202318168621-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 14, 2023 |
| Priority date | Dec 22, 2022 |
| Publication date | Oct 21, 2025 |
| Grant date | Oct 21, 2025 |
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- Title
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Abstract
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A polishing pad suitable for chemical mechanical polishing comprising: a polishing layer having a top surface having a groove pattern, the groove pattern comprises a plurality of first grooves having a first groove cross-section, the plurality of first grooves defining a plurality of regions between adjacent first grooves; and, in a portion of the plurality of region between adjacent first grooves, a plurality of second grooves having a second groove cross-section, wherein the second groove cross-section is less than 50 percent of the first groove cross-section, wherein the polishing layer is further characterized by having a specific gravity of at least 1.05 grams per cubic centimeter.
First claim
Opening claim text (preview).
What is claimed is: 1. A polishing pad suitable for chemical mechanical polishing comprising: a polishing layer including a polyurea having a soft phase and a hard phase, the soft phase being a copolymer of aliphatic fluorine-free species and a fluorinated aliphatic species, and hard phase being formed from diisocyanate containing segments and an amine curative agent, wherein the polishing layer has a top surface having a groove pattern, the groove pattern comprises a plurality of first grooves having a first groove cross-section, the plurality of first grooves defining a plurality of regions between adjacent first grooves; and, in a portion of the plurality of region between adjacent first grooves, a plurality of second grooves having a second groove cross-section, wherein the second groove cross-section is less than 50 percent of the first groove cross-section, wherein the polishing layer is further characterized by having a specific gravity of at least 1.05 grams per cubic centimeter. 2. The polishing pad of claim 1 having a specific gravity of 1.1 grams per cubic centimeter or more. 3. The polishing pad of claim 1 that is non-porous. 4. The polishing pad of claim 1 wherein a pitch of the first grooves is from 2.5 to 15 times a width of the first grooves and a pitch of the second grooves is from 1.5 to 10 times the width of the second grooves. 5. The polishing pad of claim 1 wherein each of the plurality of regions between adjacent first grooves comprises the plurality of the second grooves. 6. The polishing pad of claim 1 wherein the plurality of the second grooves in the region between adjacent first grooves comprises at least three of the second grooves. 7. The polishing pad of claim 1 wherein the polishing layer is hydrophilic during polishing in shear conditions.
Assignees
Inventors
Classifications
- B24B37/22Primary
characterised by a multi-layered structure · CPC title
characterised by the shape of the lapping pad surface, e.g. grooved · CPC title
and rotating the drill about its own axis · CPC title
operating processes therefor · CPC title
- B24B37/24Primary
characterised by the composition or properties of the pad materials · CPC title
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- What does patent US12447582B2 cover?
- A polishing pad suitable for chemical mechanical polishing comprising: a polishing layer having a top surface having a groove pattern, the groove pattern comprises a plurality of first grooves having a first groove cross-section, the plurality of first grooves defining a plurality of regions between adjacent first grooves; and, in a portion of the plurality of region between adjacent first groo…
- Who is the assignee on this patent?
- Rohm & Haas Elect Materials Cmp Holdings Inc
- What technology area does this patent fall under?
- Primary CPC classification B24B37/22. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 21 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).