MEMS-based system for cooling a vapor chamber

Patent metadata

Field	Value
Publication number	US-12439556-B2
Application number	US-202218083414-A
Country	US
Kind code	B2
Filing date	Dec 16, 2022
Priority date	Dec 20, 2021
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A server system is described. The server system includes a vapor chamber in thermal communication with a plurality of heat sources and an array of microelectromechanical system (MEMS) jets arranged to cause a fluid to impinge on a surface of the vapor chamber.

First claim

What is claimed is:

1. A server system, comprising:
a vapor chamber in thermal communication with a plurality of heat sources, the vapor chamber including a plurality of external fins;
at least one array of microelectromechanical system (MEMS) jets coupled to at least one fin of the plurality of external fins, the at least one array of MEMS jets arranged to cause a fluid to impinge on a surface corresponding to the at least one fin of the plurality of external fins of the vapor chamber, the surface being selected from an external surface of the at least one fin and a heat spreader surface thermally coupled to the external surface of the at least one fin; and
a duct system coupled with the at least one array of MEMS jets and configured to direct heated fluid from proximate to the at least one fin to distal from the at least one fin.

2. The server system of claim 1 , wherein the at least one array of MEMS jets includes a plurality of cooling cells, each of the plurality of cooling cells including a cooling element and an orifice plate including a plurality of orifices therein, the cooling element being configured to drive the fluid through the plurality of orifices, forming a plurality of fluid jets.

3. The server system of claim 1 , wherein the fluid is air.

4. The server system of claim 1 , wherein the at least one fin has a first surface and a second surface opposite to the first surface, the at least one array of MEMS jets being configured to drive the fluid toward the first surface and the second surface.

5. The server system of claim 1 , wherein each of the plurality of external fins are parallel another of the plurality of external fins, and wherein the plurality of external fins is oriented parallel to a heat source surface or perpendicular to the heat source surface.

6. The server system of claim 1 , wherein each of the at least one array of MEMS jets has a height of not more than 1.5 millimeter.

7. The server system of claim 1 , wherein the at least one array of MEMS jets includes at least 720 jets and dissipates at least 1400 W.

8. The server system of claim 2 , wherein the cooling element includes a central region and a first cantilevered region on a first side of the central region and a second cantilevered region on a second side of the central region opposite to the first side, the first and second cantilevered regions being configured to vibrate to drive the fluid through the plurality of orifices.

9. A system, comprising:
a vapor chamber in thermal communication with a plurality of heat sources, the vapor chamber including a plurality of external fins;
at least one array of cooling elements coupled to at least one fin of the plurality of external fins, the at least one array of cooling elements being configured to undergo vibrational motion when actuated to drive a fluid to impinge on a surface corresponding to the at least one fin of the vapor chamber, the surface being selected from an external surface of the at least one fin and a heat spreader surface thermally coupled to the external surface of the at least one fin, the at least one array of cooling elements configured to dissipate at least 800 Watts when actuated; and
a duct system coupled with the at least one array of cooling elements and configured to direct heated fluid from proximate to the at least one fin to distal from the at least one fin.

10. The system of claim 9 , wherein the at least one array of cooling elements is configured to drive the fluid through a plurality of orifices in a least one orifice plate when actuated, forming a plurality of fluid jets.

11. The system of claim 9 , wherein the at least one array of cooling elements is configured to dissipate at least 1600 Watts when actuated.

12. The system of claim 9 , wherein the plurality of external fins has a first surface and a second surface opposite to the first surface, the at least one array of cooling elements being configured to cause the fluid to impinge on the first surface and the second surface.

13. The system of claim 9 , each of the at least one array of cooling elements has a height of not more than 1.5 millimeter.

14. The system of claim 9 , wherein the at least one array of cooling elements includes at least 720 cooling elements and dissipates at least 1400 W.

15. A method comprising:
providing a vapor chamber in thermal communication with a plurality of heat sources, the vapor chamber including a plurality of external fins;
providing at least one array of microelectromechanical system (MEMS) jets coupled with at least one fin of the plurality of external fins, the at least one array of MEMS jets arranged to cause a fluid to impinge on a surface corresponding to the at least one fin of the vapor chamber, the surface being selected from an external surface of the at least one fin and a heat spreader surface thermally coupled to the external surface of the least one fin; and
providing a duct system coupled with the at least one array of MEMS jets and configured to direct heated fluid from proximate to the at least one fin to distal from the at least one fin.

16. The method of claim 15 , wherein the providing the at least one array of MEMS jets includes:
providing a plurality of cooling cells, each of the plurality of cooling cells including a cooling element and an orifice plate including a plurality of orifices therein, the cooling element being configured to drive the fluid through the plurality of orifices, forming a plurality of fluid jets.

Assignees

• Frore Systems Inc

Inventors

• Sathyamurthy Prabhu
• Ganti Suryaprakash
• Madhavapeddy Seshagiri Rao
• Mukundan Vikram
• Rayapati Narayana Prasad

Classifications

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20381

  Thermal management, e.g. evaporation control · CPC title

• H05K7/20309 Primary

  Evaporators · CPC title

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title