Fingerprint sensor and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12438110-B2
Application number	US-202418667720-A
Country	US
Kind code	B2
Filing date	May 17, 2024
Priority date	May 12, 2015
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

First claim

What is claimed is:

1. A sensor device comprising:
a substrate comprising:
an upper substrate side, a bottom substrate side, and lateral substrate sides between the upper and bottom substrate sides;
a dielectric structure; and
a conductive structure;

a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die comprises a sensing unit;
a plurality of first conductive interconnection structures electrically coupling the sensing unit of the semiconductor die to the top substrate side;
a plate over the top die side;
an adhesive material adhered to the top die side and a bottom side of the plate; and
an encapsulant surrounding the semiconductor die, wherein the encapsulant extends above the top die side and contacts the plate.

2. The sensor device of claim 1 , wherein the plate comprises glass.

3. The sensor device of claim 1 , wherein the adhesive material completely covers the top die side.

4. The sensor device of claim 1 , wherein the plate is laterally wider than the semiconductor die and laterally narrower than the encapsulant.

5. The sensor device of claim 1 , wherein a perimeter of the plate contacts the encapsulant.

6. The sensor device of claim 1 , wherein the conductive structure is exposed from the dielectric structure at the upper substrate side.

7. The sensor device of claim 6 , wherein at least a portion of the conductive structure is outside a footprint of the semiconductor die.

8. The sensor device of claim 6 , wherein the encapsulant contacts at least a portion of the conductive structure exposed from the dielectric structure at the upper substrate side.

9. A sensor device comprising:
a substrate comprising:
an upper substrate side, a bottom substrate side, and lateral substrate sides between the upper and bottom substrate sides;
a dielectric structure; and
a conductive structure;

a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die includes a sensing unit that is electrically coupled to the conductive structure of the substrate;
a plurality of first conductive interconnection structures electrically coupling the semiconductor die to the top substrate side, wherein the plurality of first conductive interconnection structures and the semiconductor die are free of molding material;
a plate over the top die side and extending beyond the lateral die sides;
an air gap positioned lateral of the semiconductor die between the upper substrate side and the plate;
an adhesive material adhered to the plate; and
a body surrounding the semiconductor die, wherein the body extends above the top die side, and wherein the body is spaced apart from the lateral die sides.

10. The sensor device of claim 9 , wherein the plate comprises glass.

11. The sensor device of claim 9 , wherein:
the conductive structure is exposed from the dielectric structure at the upper substrate side, and
at least a portion of the conductive structure is outside a footprint of the semiconductor die.

12. A method of manufacturing a sensor device, the method comprising:
providing a substrate comprising:
an upper substrate side, a bottom substrate side, and lateral substrate sides between the upper and bottom substrate sides;
a dielectric structure; and
a conductive structure;

providing a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die comprises a sensing unit;
electrically coupling the sensing unit of the semiconductor die to the top substrate side with a plurality of first conductive interconnection structures;
providing an adhesive material adhered to the top die side;
providing a plate over the top die side, wherein a bottom side of the plate is adhered to the adhesive material; and
providing an encapsulant surrounding the semiconductor die, wherein the encapsulant extends above the top die side and contacts the plate.

13. The method of claim 12 , wherein the plate comprises glass.

14. The method of claim 12 , wherein the adhesive material completely covers the top die side.

15. The method of claim 12 , wherein the plate is laterally wider than the semiconductor die and laterally narrower than the encapsulant.

16. The method of claim 12 , wherein a perimeter of the plate contacts the encapsulant.

17. The method of claim 12 , wherein the conductive structure is exposed from the dielectric structure at the upper substrate side.

18. The method of claim 17 , wherein at least a portion of the conductive structure is outside a footprint of the semiconductor die.

19. The method of claim 17 , wherein the encapsulant contacts at least a portion of the conductive structure exposed from the dielectric structure at the upper substrate side.

Assignees

• Amkor Tech Singapore Holding Pte Ltd

Inventors

• Park Sung Sun
• Chung Ji Young
• Berry Christopher

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/019

  of bond pads · CPC title