Apparatus for transferring light-emitting diode chip

Patent metadata

Field	Value
Publication number	US-12438030-B2
Application number	US-202117488538-A
Country	US
Kind code	B2
Filing date	Sep 29, 2021
Priority date	Jan 29, 2021
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

The disclosure provides an apparatus for transferring LED chips, including: first light source configured to generate and emit first light rays; first support structure configured to carry load substrate, load substrate including light-transmissive substrate and the LED chips fixed on side of the light-transmissive substrate away from first light source by dissociation adhesive; second support structure configured to carry to-be-transferred substrate on side of the LED chips away from light-transmissive substrate; and optical control mechanism on side of light-transmissive substrate away from the LED chips and configured to control propagation direction of first light rays that irradiate onto first radiation region of the optical control mechanism to form target light rays that irradiate onto target radiation region of load substrate, so that dissociation adhesive in target radiation region is dissociated to transfer LED chips in target radiation region to to-be-transferred substrate.

First claim

What is claimed is:

1. An apparatus for transferring light emitting diode (LED) chips, comprising:
a tunable first light source configured to generate and emit first light rays and second light rays, wherein a wavelength of the first light rays and a wavelength of the second light rays are different;
a first support structure configured to carry a load substrate, the load substrate comprising a light-transmissive substrate and the LED chips fixed on a side of the light-transmissive substrate away from the tunable first light source by dissociation adhesive;
a second support structure configured to carry a to-be-transferred substrate, the to-be-transferred substrate being on a side of the LED chips away from the light-transmissive substrate; and
an optical control mechanism on a side of the light-transmissive substrate away from the LED chips and configured to control a propagation direction of the first light rays that irradiate onto a first radiation region of the optical control mechanism to form target light rays that irradiate onto a target radiation region of the load substrate, so that the dissociation adhesive in the target radiation region is dissociated to transfer the LED chips in the target radiation region to the to-be-transferred substrate,
wherein the second light rays is configured to pass through the optical control mechanism and irradiate onto the load substrate so as to excite the LED chips to emit light; and
the second light rays and the dissociation adhesive are configured such that the dissociation adhesive is not dissociated in a case where being subjected to irradiation of the second light rays,
wherein the optical control mechanism comprises: an optical filter device;
the optical filter device comprises: a plurality of optical control elements arranged in an array, the optical control elements located in the first radiation region being in an active state, and the optical control elements not located in the first radiation region being in an inactive state; and
each of the plurality of optical control elements is configured to control a propagation direction of the received first light rays in response to the optical control element being in the active state, so as to form the target light ray that irradiates onto the target radiation region of the load substrate,
wherein the optical control element is configured to reflect the first light rays that irradiate onto the optical control element to the load substrate in response to the optical control element being in the active state and to reflect the first light rays that irradiate onto the optical control element to a redundant light region in response to the optical control element being in the inactive state, and
the redundant light region is on a side of the optical control mechanism away from the load substrate,
wherein the optical filter device comprises: a reflective digital micro-mirror device;
the reflective digital micro-mirror comprises a plurality of second pixel units, each of the plurality of second pixel units serving as a corresponding one of the plurality of optical control elements;
each of the plurality of second pixel unit comprises: a micro-mirror, a torsion hinge, a CMOS circuit, and an address electrode; and
the micro-mirror is coupled to the torsion hinge by a via, and the CMOS circuit is coupled to the address electrode.

2. The apparatus of claim 1 , further comprising:
an image capture mechanism configured to capture an image of the LED chips that emit light to generate a first image.

3. The apparatus of claim 2 , further comprising:
a first processing mechanism coupled to the image capture mechanism and configured to process the first image generated by the image capture mechanism to generate a quality distribution of the LED chips, the quality distribution indicates a correspondence relationship between a position of each of the LED chips and a quality of a corresponding one of the LED chips, and the quality of the corresponding one of the LED chips indicates whether a brightness of light emitted by the corresponding one of the LED chips is stable.

4. The apparatus of claim 3 , wherein the LED chips in the target radiation region have a same quality.

5. The apparatus of claim 1 , wherein the first radiation region comprises a plurality of first sub-regions, the target radiation region comprises a plurality of second sub-regions, and the plurality of first sub-regions are in one-to-one correspondence with the plurality of second sub-regions.

6. The apparatus of claim 1 , further comprising:
a second processing mechanism coupled to the optical filter device and configured to send a control signal to the optical filter device, the control signal comprising identification information of the plurality of optical control elements in the first radiation region,
wherein the optical filter device controls the plurality of optical control elements in the first radiation region to be in the active state according to the control signal.

7. The apparatus of claim 1 , wherein each of the plurality of optical control elements is configured to transmit the first light rays that irradiate onto the optical control element in response to the optical control element being in the active state and to block the first lights ray that irradiate onto the optical control element in response to the optical control element being in the inactive state.

8. The apparatus of claims 1 , wherein the optical control mechanism further comprises: a beam control device; and
the beam control device is on a light emitting side of the optical filter device and is configured to adjust at least one of a shape, a size and an energy distribution of light spots of the target light rays that irradiate onto the load substrate.

9. The apparatus of claim 8 , wherein the beam control device comprises: at least one of a beam expander, a galvo scanner, and a field lens.

10. The apparatus of claim 9 , wherein the load substrate further comprises an alignment mark on a side of the load substrate on which the LED chips are provided,
the alignment mark comprises a reflective layer and a transparent layer, and
the reflective layer is inclined with respect to a surface of the load substrate on which the LED chips are provided.

11. The apparatus of claim 8 , wherein
the beam control device includes: a beam expander, a galvo scanner, and a field lens,
a light emitting side of the optical filter device is opposite to a light incident side of the beam expander, a light emitting side of the beam expander is opposite to a light incident side of the galvo scanner, a light emitting side of the galvo scanner is opposite to a light incident side of the field lens, and light emitted by the optical filter device passes through the beam expander, the galvo scanner, and the field lens in sequence, and finally irradiates the target radiation region of the load substrate.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Yuan Guangcai
• Li Haixu
• Gu Xin
• Feng Jing

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/7408

  the auxiliary support including alignment aids · CPC title