Method for testing and evaluating short-circuit withstand capability of press-pack power component

Patent metadata

Field	Value
Publication number	US-12436204-B2
Application number	US-202318484486-A
Country	US
Kind code	B2
Filing date	Oct 11, 2023
Priority date	Nov 1, 2022
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

Disclosed is a method for testing and evaluating a short-circuit withstand capability of a press-pack power component. The method includes: building a test platform; obtaining a voltage level, a pressure load, an environment temperature, and a maximum junction temperature fluctuation range of a to-be-tested component in an actual working condition; separately testing short-circuit withstand capabilities of the to-be-tested press-pack power component; monitoring, in real time, changes of a component short-circuit current, a collector-emitter voltage, and a grid-emitter voltage until the to-be-tested press-pack power component fails due to short circuit; correspondingly obtaining a relationship between a voltage and each of a short-circuit critical energy and a critical temperature, a relationship between a pressure and a short-circuit current, and a relationship between a temperature and a short-circuit current; obtaining a relationship between a short-circuit withstand capability of the to-be-tested press-pack power component and each of a voltage, a pressure, and a temperature.

First claim

What is claimed is:

1. A method for testing and evaluating a short-circuit withstand capability of a press-pack power component, wherein the method comprises the following steps:
S1: building a test platform suitable for a short-circuit withstand capability of a press-pack power component;
S2: obtaining a voltage level, a pressure load, an environment temperature, and a maximum junction temperature fluctuation range of a to-be-tested press-pack power component in an actual working condition;
S3: customizing a test scheme of the short-circuit withstand capability, which comprises: separately testing short-circuit withstand capabilities of the to-be-tested press-pack power component at different voltage, pressure, and temperature levels; monitoring, in real time, changes of a component short-circuit current I S , a collector-emitter voltage V CE , and a grid-emitter voltage V GE until the to-be-tested press-pack power component fails due to short circuit; and correspondingly obtaining a relationship between a voltage and each of a short-circuit critical energy E CR and a critical temperature T CR , a relationship between a pressure and a short-circuit current, and a relationship between a temperature and a short-circuit current; and
S4: obtaining, according to test results obtained under different voltages, pressures, and temperatures, a relationship between a short-circuit withstand capability of the to-be-tested press-pack power component and each of a voltage, a pressure, and a temperature.

2. The method for testing and evaluating a short-circuit withstand capability of a press-pack power component according to claim 1 , wherein in step S1, the test platform comprises a short-circuit energy supply module, a control module, a measurement module, and an environment control module;
the short-circuit energy supply module comprises a high-voltage direct current (DC) power supply and a capacitor group that are connected in parallel, to provide impact energy for a short-circuit withstand test;
the control module comprises a signal generator and a drive circuit that are connected in series, to control a to-be-tested module to be enabled;
the measurement module comprises a voltage probe and a current probe, to monitor and acquire a short-circuit current I S , a collector-emitter voltage V CE , a grid-emitter voltage V GE in a process of the short-circuit withstand test; and
the environment control module comprises a high-voltage DC power supply, a pressure fixture, and a constant-temperature experimental box, to respectively control changes of a voltage, a pressure, and a temperature.

3. The method for testing and evaluating a short-circuit withstand capability of a press-pack power component according to claim 1 , wherein in step S2, a test voltage U i , a test pressure F i , and a test temperature T i are determined according to the actual working condition of the to-be-tested press-pack power component, wherein
the test voltage U i uses an actual working voltage U 0 as a reference, and ±10% as a step, and testing is performed at least at 5 voltage levels, namely, U 0 −20%, U 0 −10%, U 0 , U 0 +10%, and U 0 +20%;
the test pressure F i uses a recommended pressure load value F 0 of the to-be-tested press-pack power component in the actual working condition as a reference, and a maximum pressure load value F 0-max as an upper limit; within the test pressure F i ∈(0, F 0 ] interval, testing is performed at least at 5 pressure levels within (0, F 0 /2] interval, testing is performed at least at 3 pressure levels; and within the test pressure F i ∈(F 0 , F 0-max ] interval, testing is performed at least at 2 pressure levels; and
the test temperature T i includes one or more values between TEN min in actual application as a lower limit, and a maximum junction temperature T j_max as an upper limit; a minimum value T j_min of junction temperature fluctuation in the application working condition is comprised, and testing is performed at least at 4 temperature levels.

4. The method for testing and evaluating a short-circuit withstand capability of a press-pack power component according to claim 1 , wherein in step S3, a short-circuit current I S and a collector-emitter voltage V CE are monitored in real time in a process of testing the short-circuit withstand capability, and when the short-circuit current I S instantly rises to at least 2 times an initial value and the collector-emitter voltage V CE drops rapidly to about 0 V, it is determined that the to-be-tested press-pack power component fails due to short circuit.

5. The method for testing and evaluating a short-circuit withstand capability of a press-pack power component according to claim 1 , wherein in step S3, the testing short-circuit withstand capabilities of the to-be-tested press-pack power component at different voltage levels comprises: separately testing a short-circuit withstand capability of the to-be-tested press-pack power component at a selected voltage level, and monitoring, in real time, a component short-circuit current I S , a collector-emitter voltage V CE , and a grid-emitter voltage V GE until the to-be-tested press-pack power component fails due to short circuit;
(1) calculating a short-circuit critical energy E CR of the to-be-tested press-pack power component based on the short-circuit current I S and the collector-emitter voltage V CE :
E CR =∫ 0 t SCWC V CE ( t )· I S ( t )· dt , wherein

t SCWC is a short-circuit withstand time of the to-be-tested press-pack power component, namely, a maintenance time from a beginning of testing to a short-circuit failure of the to-be-tested press-pack power component;
(2) fitting a relationship between a test voltage U i and a short-circuit critical energy E CR based on the test results at the different voltage levels:
E CR =f E ( U i ), wherein

f E (U i ) is a fitting relationship function between a test voltage U i and a short-circuit critical energy E CR ; and
(3) obtaining a relationship between a test voltage U i and a critical temperature T CR :

T
CR

(

U
i

)

=

f
E

(

U
i

)

K
chip

+

T
EN

,

wherein
K chip is a parameter related to a material and a structure of a chip used by the to-be-tested press-pack power component, and T EN is the environment temperature.

6. The method for testing and evaluating a short-circuit withstand capability of a press-pack power component according to claim 1 , wherein in step S3, the testing short-circuit withstand capabilities of the to-be-tested press-pack power component at different pressure levels comprises: separately testing a short-circuit withstand capability of the to-be-tested press-pack power component at a selected pressure level, and monitoring, in real time, changes of a component short-circuit current I S , a collector-emitter vo

Assignees

• Univ Chongqing

Inventors

• Li Hui
• Liu Renkuan
• Yao Ran
• Lai Wei
• Duan Zeyu
• Zhu Zheyan
• Zhou Bailing
• Chen Siyu
• Li Jinyuan
• Chen Zhongyuan

Classifications

• G01R31/2601

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title

• G01R31/2619

  for measuring thermal properties thereof · CPC title

• G01R31/52 Primary

  Testing for short-circuits, leakage current or ground faults · CPC title