Method for testing and evaluating short-circuit withstand capability of press-pack power component
US-12436204-B2 · Oct 7, 2025 · US
Lai Wei is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lai Wei |
| Total patents | 8 |
| First publication | Jan 24, 2017 |
| Latest publication | Oct 7, 2025 |
Publications ranked by popularity score, then publication date.
US-12436204-B2 · Oct 7, 2025 · US
US-2024189292-A1 · Jun 13, 2024 · US
US-2024142546-A1 · May 2, 2024 · US
US-11251948-B2 · Feb 15, 2022 · US
US-2020412532-A1 · Dec 31, 2020 · US
US-9788080-B2 · Oct 10, 2017 · US
US-2017099526-A1 · Apr 6, 2017 · US
US-9554093-B2 · Jan 24, 2017 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Microsoft Technology Licensing Llc | 3 |
| Univ Chongqing | 2 |
| Univ Central South | 2 |
| Hua Xian-Sheng | 1 |
| Lai Wei | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04N21/2387 | 3 |
| H04N21/23424 | 3 |
| H04N7/17318 | 3 |
| H04N21/812 | 3 |
| H04N21/8133 | 3 |