Photocurable composition, coating layer comprising cured product thereof, and substrate for semiconductor process

Patent metadata

Field	Value
Publication number	US-12435164-B2
Application number	US-202117917101-A
Country	US
Kind code	B2
Filing date	Jul 22, 2021
Priority date	Jul 22, 2020
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

The present disclosure provides a photocurable composition, which has excellent coatability and is capable of providing a coating layer having excellent surface quality and thickness uniformity, a coating layer including a cured product of the photocurable composition, and a substrate for a semiconductor process including the coating layer.

First claim

What is claimed is:

1. A photocurable composition comprising:
a urethane (meth)acrylate-based resin syrup comprising a urethane (meth)acrylate-based resin, which is a reaction product of a polyalkylene carbonate-based urethane prepolymer having an isocyanate end group and a reactive group-containing (meth)acrylate-based compound, and a (meth)acrylate-based monomer mixture;
a polyfunctional urethane (meth)acrylate-based compound; and
a polyfunctional (meth)acrylate-based compound,
wherein the urethane (meth)acrylate-based resin comprises a carbonate repeating unit containing a C 1-10 alkylene having at least one C 1-3 side chain attached thereto, and
wherein the polyfunctional urethane (meth)acrylate-based compound comprises a compound represented by the following Formula 1:

wherein
R 1 , R 2 , and R 3 are each independently a C 2-10 alkylene,
R 4 , R 5 , and R 6 are each independently a C 2-7 alkylene,
R 7 , R 8 , and R 9 are each independently hydrogen or a methyl group, and
n, j and k are each independently an integer ranging from 1 to 3.

2. The photocurable composition of claim 1 , wherein the urethane (meth)acrylate-based resin has a weight-average molecular weight of 20,000 g/mol to 50,000 g/mol.

3. The photocurable composition of claim 1 , wherein the urethane (meth)acrylate-based resin syrup has a viscosity of 400 cP to 3,300 cP.

4. The photocurable composition of claim 1 , wherein the polyalkylene carbonate-based urethane prepolymer is a reaction product of a polyalkylene carbonate-based polyol and a diisocyanate-based compound.

5. The photocurable composition of claim 4 , wherein a content of the diisocyanate-based compound is 10 parts by weight to 20 parts by weight based on 100 parts by weight of the polyalkylene carbonate-based polyol.

6. The photocurable composition of claim 1 , wherein a content of the reactive group-containing (meth)acrylate-based compound is 1 part by weight to 10 parts by weight based on 100 parts by weight of the polyalkylene carbonate-based urethane prepolymer.

7. The photocurable composition of claim 1 , wherein a content of the urethane (meth)acrylate-based resin is 15 parts by weight to 35 parts by weight based on 100 parts by weight of the urethane (meth)acrylate-based resin syrup.

8. The photocurable composition of claim 1 , wherein the (meth)acrylate-based monomer mixture comprises at least one type of monomer selected from an alkyl group-containing (meth)acrylate-based monomer, an alicyclic alkyl group-containing (meth)acrylate-based monomer, an aromatic group-containing (meth)acrylate-based monomer, and a polar functional group-containing (meth)acrylate-based monomer.

9. The photocurable composition of claim 1 , wherein a content of the (meth)acrylate-based monomer mixture is 65 parts by weight to 85 parts by weight based on 100 parts by weight of the urethane (meth)acrylate-based resin syrup.

10. The photocurable composition of claim 1 , wherein a content of the polyfunctional urethane (meth)acrylate-based compound is 2.5 parts by weight to 7.5 parts by weight based on 100 parts by weight of the urethane (meth)acrylate-based resin.

11. The photocurable composition of claim 1 , wherein a content of the polyfunctional (meth)acrylate-based compound is 1 part by weight to 5 parts by weight based on 100 parts by weight of the urethane (meth)acrylate-based resin.

12. The photocurable composition of claim 1 , further comprising a photoinitiator,
wherein a content of the photoinitiator is 0.5 parts by weight to 3 parts by weight based on 100 parts by weight of the urethane (meth)acrylate-based resin.

13. The photocurable composition of claim 1 , having a viscosity of 3,000 cP or less.

14. A coating layer comprising a cured product of the photocurable composition according to claim 1 .

15. The coating layer of claim 14 , having a total thickness variation of 3 μm or less, wherein the total thickness variation is defined as a difference between a maximum thickness and a minimum thickness.

16. A substrate for a semiconductor process comprising:
a substrate film; and
the coating layer according to claim 14 .

Assignees

• Lg Chemical Ltd

Inventors

• Kim Sang Hwan
• Choi Jung Woo
• Seo Ki Seung
• Seo Kwang Su
• Park Jun Beom
• Cho Won Seup

Classifications

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• C08J2375/14

  Polyurethanes having carbon-to-carbon unsaturated bonds · CPC title

• C08J7/042

  with two or more layers, where at least one layer of a composition contains a polymer binder · CPC title

• C08G2150/00

  Compositions for coatings · CPC title

• C08G18/6229

  Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols · CPC title