Mold, and method for encapsulating display panel

Patent metadata

Field	Value
Publication number	US-12433091-B2
Application number	US-202017288588-A
Country	US
Kind code	B2
Filing date	Sep 25, 2020
Priority date	Sep 30, 2019
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

Provided is a mold for manufacturing a display panel, including a display substrate and a barrier wall disposed on the display substrate, both the display substrate and the barrier wall being in an annular shape, and an organic layer being formed in an area enclosed by the barrier wall; wherein the mold includes: a bottom surface and a top surface disposed oppositely to each other, the bottom surface being proximal to the display substrate relative to the top surface; and wherein the mold surrounds the barrier wall, and an inner wall surface of the mold is in contact with an outer wall surface of the barrier wall, the inner wall surface of the mold being a surface of an inside of the mold and the outer wall surface of the barrier wall being a surface of an outside of the barrier wall.

First claim

What is claimed is:

1. A mold for manufacturing a display panel, wherein the display panel comprises a display substrate and a barrier wall disposed on the display substrate, both the mold and the barrier wall have a rectangular cross section which has a rectangular opening at a center of the rectangular cross section, and an organic layer is formed in an area enclosed by the barrier wall;
wherein the mold comprises a bottom surface and a top surface disposed oppositely to each other, and the bottom surface is proximal to the display substrate relative to the top surface; and
wherein the mold surrounds the barrier wall, an inner wall surface of the mold is in contact with an outer wall surface of the barrier wall, and the inner wall surface of the mold is a surface of the rectangular opening; and
the mold is a ring-shaped body connected end to end, and a head end and a tail end of the mold are connected detachably; and
wherein a release layer is attached to the inner wall surface of the mold, and a roughness of the release layer is less than a roughness threshold which is 0.050 μm.

2. The mold according to claim 1 , wherein the mold is made of a light transmissive material.

3. The mold according to claim 1 , wherein the inner wall surface of the mold extends towards an outer wall surface of the mold from the top surface to the bottom surface.

4. The mold according to claim 3 , wherein the outer wall surface of the mold extends towards the inner wall surface of the mold from the top surface to the bottom surface.

5. The mold according to claim 1 , wherein an angle between the inner wall surface and the bottom surface of the mold is greater than or equal to 90 degrees and less than or equal to 120 degrees.

6. The mold according to claim 5 , wherein the angle between the inner wall surface and the bottom surface of the mold is greater than or equal to 110 degrees.

7. The mold according to claim 6 , wherein the mold is made of a light transmissive material, and a height of the mold is greater than a height of the barrier wall in a direction from the top surface to the bottom surface;
and
the release layer is made of a release agent and/or a parting agent.

8. The mold according to claim 1 , wherein a height of the mold is greater than a height of the barrier wall in a direction from the top surface to the bottom surface.

9. The mold according to claim 1 , wherein the release layer is made of a release agent and/or a parting agent.

10. A method for encapsulating a display panel, wherein the display panel comprises a display substrate and a barrier wall, both a mold and the barrier wall have a rectangular cross section which has a rectangular opening at a center of the rectangular cross section, and the method comprises:
providing the display substrate;
forming the barrier wall on the display substrate, wherein an inorganic thin film layer is formed in an area enclosed by the barrier wall;
forming an organic layer in the area enclosed by the barrier wall;
sleeving the mold on an exterior of the barrier wall;
baking the organic layer to cure the organic layer; and
separating the mold from the barrier wall;
wherein the mold comprises a bottom surface and a top surface disposed oppositely to each other, and the bottom surface is proximal to the display substrate relative to the top surface; and the mold surrounds the barrier wall, an inner wall surface of the mold is in contact with an outer wall surface of the barrier wall, and the inner wall surface of the mold is a surface of the rectangular opening; and
the mold is a ring-shaped body connected end to end, and a head end and a tail end of the mold are connected detachably; and
wherein a release layer is attached to the inner wall surface of the mold, and a roughness of the release layer is less than a roughness threshold which is 0.050 μm.

11. The method according to claim 10 , wherein prior to sleeving the mold on the exterior of the barrier wall, the method further comprises:
coating the release layer on the inner wall surface of the mold.

12. The method according to claim 11 , wherein the release layer is made of a release agent and/or a parting agent.

13. The method according to claim 10 , wherein baking the organic layer comprises baking the organic layer by ultraviolet rays.

14. The method according to claim 10 , wherein forming the barrier wall on the display substrate comprises:
forming the barrier wall on the display substrate by a coating process and a photolithography process.

15. The method according to claim 10 , wherein forming the organic layer in the area enclosed by the barrier wall comprises:
forming the organic layer in the area enclosed by the barrier wall by an inkjet printing process.

16. The method according to claim 10 , wherein the display panel is an OLED display panel.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Linlin
• Yan Guang

Classifications

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K50/84

  Passivation; Containers; Encapsulations · CPC title

• H10K59/873

  Encapsulations · CPC title

• B29C39/02

  for making articles of definite length, i.e. discrete articles · CPC title

• B29C39/26

  Moulds or cores · CPC title