Method for packaging display substrate and packaging structure

US2021210721A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021210721-A1
Application numberUS-201916768060-A
CountryUS
Kind codeA1
Filing dateDec 16, 2019
Priority dateJan 23, 2019
Publication dateJul 8, 2021
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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The present disclosure relates to a method for packaging a display substrate and a packaging structure. The packaging method includes: preparing a light conversion structure in a non-display region of the base substrate capable of converting the received first light into second light; preparing one or more organic packaging layers on a surface of the base substrate on which the light conversion structure is formed; irradiating the light conversion structure with the first light so that the rheological organic material layer in a region in which the light conversion structure is located is cured with the converted second light; and then curing all of the rheological organic material layer, in which the light conversion structure is arranged on a surface of the corresponding organic packaging layer close to the base substrate.

First claim

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1 . A method for packaging a display substrate, comprising: providing a base substrate, the base substrate comprising a display region and a non-display region surrounding the display region; preparing a light conversion structure in the non-display region of the base substrate, the light conversion structure comprising a light conversion material capable of converting received first light into second light; and preparing one or more organic packaging layers and one or more inorganic packaging layers on a surface of the base substrate on which the light conversion structure is formed, to form a composite packaging layer in which the organic packaging layers and the inorganic packaging layers are alternately stacked; wherein the preparing the one or more organic packaging layers comprises: forming a rheological organic material layer, and irradiating the light conversion structure with the first light, so that the rheological organic material layer in a region in which the light conversion structure is located is cured with the second light converted from the first light by the light conversion structure; and curing all of the rheological organic material layer to form the one or more organic packaging layers, wherein the light conversion structure is arranged on a surface of the corresponding organic packaging layer close to the base substrate. 2 . The method of claim 1 , wherein the preparing the light conversion structure in the non-display region of the base substrate comprises: preparing at least two retaining wall patterns in the non-display region of the base substrate, wherein each of the at least two retaining wall patterns surrounds the display region, heights of the at least two retaining wall patterns in a direction perpendicular to the base substrate gradually increase along a direction away from the display region, and a groove is formed between adjacent retaining wall patterns; and preparing a light conversion pattern in the groove, the light conversion pattern comprising a light conversion material capable of converting the received first light into the second light. 3 . The method of claim 2 , wherein the preparing the one or more organic packaging layers comprises preparing the organic packaging layers corresponding to the grooves respectively, wherein during the forming the rheological organic material layer corresponding to the organic packaging layer, the light conversion pattern in a target groove corresponding to the organic packaging layer is irradiated with the first light, so that the rheological organic material layer in a region in which the target groove is located is cured with the second light converted from the first light by the light conversion pattern, and in a direction perpendicular to the base substrate, the rheological organic material layer in a region in which the target groove is located is lower than the retaining wall pattern away from the display region among the retaining wall patterns for forming the target groove. 4 . The method of claim 3 , wherein the preparing the one or more inorganic packaging layers comprises preparing a plurality of inorganic packaging layers, wherein an orthogonal projection of the light conversion structure on the base substrate is located within an orthogonal projection of any one of the plurality of inorganic packaging layers on the base substrate, the inorganic packaging layers and the organic packaging layers are alternately stacked, and an outermost layer located on an outer surface of the composite packaging layer is the inorganic packaging layer. 5 . The method of claim 4 , wherein the method comprises: preparing a first retaining wall pattern and a second retaining wall pattern in the non-display region of the base substrate, wherein the first retaining wall pattern is located between the display region and the second retaining wall pattern, and a first groove is formed between the first retaining wall pattern and the second retaining wall pattern; preparing a first light conversion pattern in the first groove; preparing a first inorganic packaging layer; preparing a first organic packaging layer, which comprises forming a first rheological organic material layer on a surface of the first inorganic packaging layer away from the base substrate, irradiating the first light conversion pattern with the first light, so that the first rheological organic material layer in a region in which the first groove is located is cured with the second light converted from the first light by the first light conversion pattern, and in a direction perpendicular to the base substrate, the first rheological organic material layer in a region in which the first groove is located is lower than the second retaining wall pattern, and curing all of the first rheological organic material layer; and preparing a second inorganic packaging layer on a surface of the first organic packaging layer away from the base substrate. 6 . The method of claim 2 , wherein the at least two retaining wall patterns comprise a first retaining wall pattern, a second retaining wall pattern, and a third retaining wall pattern; a first groove is formed between the first retaining wall pattern and the second retaining wall pattern, and a second groove is formed between the second retaining wall pattern and the third retaining wall pattern; and the composite packaging layer comprises two organic packaging layers and three inorganic packaging layers. 7 . The method of claim 1 , wherein the base substrate is a light transmitting substrate, and layers between the base substrate and the light conversion structure are all light transmitting layers. 8 . The method of claim 7 , wherein the irradiating the light conversion structure with the first light comprises irradiating the light conversion structure with the first light from a side of the base substrate, and after the light conversion structure has converted the first light into the second light, the second light directly irradiates the rheological organic material layer in a region in which the light conversion structure is located. 9 . The method of claim 1 , wherein a layer having light reflecting effect is arranged between the base substrate and the light conversion structure. 10 . The method of claim 9 , wherein the irradiating the light conversion structure with the first light comprises irradiating the light conversion structure with the first light from a side of the light conversion structure away from the base substrate, and after the light conversion structure has converted the first light into the second light, the second light is reflected by the layer having light reflecting effect, to irradiate the rheological organic material layer in a region in which the light conversion structure is located. 11 . The method of claim 2 , wherein the first light comprises an infrared light, and the second light comprises an ultraviolet light. 12 . The method of claim 11 , wherein the preparing the at least two retaining wall patterns in the non-display region of the base substrate comprises: preparing an ultraviolet blocking material; forming a blocking film by depositing the ultraviolet light blocking material, the blocking film at least covering the non-display region of the base substrate; and patterning the blocking film to obtain the at least two retaining wall patterns. 13 . A packaging structure for a display substrate, comprising: a base substrate, the base substrate comprising a display region and a non-display region surrounding the display region; a light conversion structure arranged in the non-display region, wherein the light conversion structur

Assignees

Inventors

Classifications

  • H10K71/40Primary

    Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

  • multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

  • Encapsulations · CPC title

  • H10K59/126Primary

    Shielding, e.g. light-blocking means over the TFTs · CPC title

  • Electricity · mapped topic

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What does patent US2021210721A1 cover?
The present disclosure relates to a method for packaging a display substrate and a packaging structure. The packaging method includes: preparing a light conversion structure in a non-display region of the base substrate capable of converting the received first light into second light; preparing one or more organic packaging layers on a surface of the base substrate on which the light conversion…
Who is the assignee on this patent?
Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10K71/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 08 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).