Sample image observation device and method for same

Patent metadata

Field	Value
Publication number	US-12431325-B2
Application number	US-202017928691-A
Country	US
Kind code	B2
Filing date	Jul 14, 2020
Priority date	Jul 14, 2020
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

Provided is a sample image observation device including an SEM and a control system configured to control the SEM. An observation region of a sample is divided into a plurality of sections, and restoration processing is performed on an image which is acquired by irradiating each section with a sparse electron beam, based on scanning characteristics in the section. A reduction in quality of a restored image due to a beam irradiation position deviation caused by a scanning response is prevented and restoration with high accuracy and high throughput under a condition for preventing sample damage is possible.

First claim

The invention claimed is:

1. A sample image observation device, comprising:
scanning electron microscope (SEM) including:
an electron gun configured to emit an electron beam;
a detector configured to detect secondary electrons from a sample and generate detection signals of the secondary electrons; and
a computer, coupled to the SEM, programmed to:
divide an observation region of the sample into a plurality of sections,
determine a size of each section based on a spatial distribution of focal point positions of the electron beam for irradiation, and
execute restoration processing on an image which is acquired by irradiating each of a plurality of sections with the electron beam, based on scanning characteristics of the respective sections.

2. A sample image observation method using an SEM, the method comprising:
dividing an observation region of a sample into a plurality of sections;
determining a size of each section based on a spatial distribution of focal point positions of an electron beam for irradiation; and
performing restoration processing on an image which is acquired by irradiating each section with the electron beam, based on scanning characteristics in the section.

3. The sample image observation device according to claim 1 ,
wherein an irradiation position and an irradiation path of the electron beam with which each section is irradiated are different for each section.

4. The sample image observation device according to claim 1 ,
wherein an irradiation position and an irradiation path of the electron beam with which the section is irradiated are the same for each section.

5. The sample image observation method according to claim 2 ,
wherein an irradiation position and an irradiation path of the electron beam with which the section is irradiated are different for each section.

6. The sample image observation method according to claim 2 ,
wherein an irradiation position and an irradiation path of the electron beam with which the section is irradiated are the same for each section.

7. The sample image observation device according to claim 1 ,
wherein the size of each section includes an upper limit and a lower limit,
wherein the computer is programmed to:
determine the upper limit of the size of each section based on a processing speed of the restoration processing, and
determine the lower limit of the size of each section based on an accuracy of the restoration accuracy.

8. The sample image observation device according to claim 1 ,
wherein the size of each section includes a lower limit,
wherein the computer is programmed to determine the lower limit of the size of each section such that the following formula is satisfied: pN−√{square root over (pN)}>t,
wherein p is an irradiation density, N is a total number of pixels and t is a threshold having a value of 1 or more.

9. The sample image observation method according to claim 2 ,
wherein the size of each section includes an upper limit and a lower limit, and
wherein the method further comprises:
determining an upper limit of the size of each section based on a processing speed of the restoration processing; and
determining a lower limit of the size of each section based on an accuracy of the restoration accuracy.

10. The sample image observation method according to claim 2 ,
wherein the size of each section includes a lower limit, and
wherein the method further comprises:
determining the lower limit of the size of each section such that the following formula is satisfied: pN−√{square root over (pN)}>t,
wherein p is an irradiation density, N is a total number of pixels and t is a threshold having a value of 1 or more.

Assignees

• Hitachi High Tech Corp

Inventors

• Imai Yuta
• Katane Junichi

Classifications

• H01J2237/24578

  Spatial variables, e.g. position, distance · CPC title

• H01J2237/226

  Image reconstruction · CPC title

• H01J37/28

  with scanning beams {(H01J37/268, H01J37/292, H01J37/2955 take precedence)} · CPC title

• H01J37/265

  Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination · CPC title

• H01J37/222 Primary

  Image processing arrangements associated with the tube · CPC title