Method for manufacturing a detector

Patent metadata

Field	Value
Publication number	US-12429414-B2
Application number	US-202117248117-A
Country	US
Kind code	B2
Filing date	Jan 11, 2021
Priority date	Jan 31, 2020
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A method for manufacturing a detector for sensing, detecting and monitoring environmental hazards and conditions, said method including the printing of an electronic circuit on at least a first side of a flexible, printable substrate; coupling at least two electronic components to the electronic circuit on at least the first side of the flexible, printable substrate; thermoforming the flexible, printable substrate to form at least one detection zone from: (i) at least one side of the flexible, printable substrate having an angle for emitting one of a light or a signal from at least one electronic component; and (ii); at least one side of the flexible, printable substrate having an angle for receiving one of a light or a signal by at least one electronic component; and encapsulating the flexible, printable substrate, forming a detector.

First claim

We claim:

1. A method for manufacturing a detector, the method comprising:
printing an electronic circuit on at least a first side of a flexible, printable substrate;
coupling a first electronic component and a second electronic component to the electronic circuit on at least the first side of the flexible, printable substrate;
thermoforming the flexible, printable substrate to form at least one detection zone from:
(i) at least one side of the flexible, printable substrate having an angle for emitting light from the first electronic component; and
(ii) at least one side of the flexible, printable substrate having an angle for receiving light by the second electronic component;
wherein the first electronic component is a light emitter and the second electronic component is a light receiver, the second electronic component configured to receive light from the first electronic component scattered by particles in the at least one detection zone;
wherein the light emitter is positioned on a first sloped surface and the light receiver is positioned on a second sloped surface, the first sloped surface positioned at an angle relative to the second sloped surface, the angle being greater than zero degrees.

2. The method of claim 1 wherein the first electronic component is a light emitting diode the second electronic component is a photodiode.

3. The method of claim 1 wherein at least one of the flexible, printable substrate and base is encapsulated, in whole or in part.

4. The method of claim 1 wherein at least one of the emitting angle and the receiving angle are 180 degrees or less.

5. The method of claim 1 wherein the flexible, printable substrate has at least one cavity for receiving an electronic component, wherein the electronic component emits or receives the light, at an angle of 180 degrees or less.

6. The method of claim 1 further comprising the flexible, printable substrate having an optical guide for: (i) directing the emitted light from the first electronic component to the at least one detection zone; and (ii) receiving the light by the second electronic component, the optical guide comprising a raised surface extending between the first electronic component and the second electronic component.

7. The method of claim 1 wherein the first sloped surface and the second sloped surface form at least part of a depression in the flexible, printable substrate.

8. The method of claim 2 wherein the additional layer is at least one of: a polymer film and a polycarbonate film.

9. The method of claim 3 , wherein at least one of the flexible, printable substrate and base is encapsulated by one or more of thermoforming, injection molding, additive printing.

Assignees

• Carrier Corp
• Kidde Fire Prot Llc

Inventors

• Culp Slade R
• Schmidt Wayde R
• Lincoln David L
• Caldwell Dustin D
• Harris Peter R

Classifications

• G01N15/075

  by optical means · CPC title

• G01N15/0205

  by optical means · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/10151

  Sensor · CPC title