Photosensitive assembly and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12426395-B2
Application number	US-201917261776-A
Country	US
Kind code	B2
Filing date	May 29, 2019
Priority date	Jul 23, 2018
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

The present application provides a photosensitive assembly, comprising: a photosensitive chip, having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region; an electronic element arranged around the photosensitive chip; a molded portion formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded portion having a third surface flush with the first surface; and a first re-wiring layer formed on a non-photosensitive region of the first surface and on the third surface, a pad of the photosensitive chip being electrically connected to the electronic element through the first re-wiring layer, wherein a side surface or a bottom surface of the photosensitive assembly has a conductive region, and the conductive region is electrically connected to the first re-wiring layer. The present application further provides a corresponding manufacturing method of photosensitive assembly. The present application can reduce design limitations of the photosensitive assembly; and make camera modules in mobile terminals more modularized and easy to replace.

First claim

The invention claimed is:

1. A photosensitive assembly, comprising:
a photosensitive chip having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region and a non-photosensitive region, and the photosensitive chip further having a pad disposed in the non-photosensitive region;
an electronic element arranged around the photosensitive chip;
a molded portion formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded portion having a third surface flush with the first surface; and
a first re-wiring layer formed on the non-photosensitive region of the first surface and on the third surface, the pad being electrically connected to the electronic element through the first re-wiring layer;
wherein a side surface of the photosensitive assembly has a conductive region, and the conductive region is electrically connected to the first re-wiring layer;
wherein a re-wiring line of the first re-wiring layer extends to an edge of the first re-wiring layer and is exposed on a side surface of the first re-wiring layer; and the conductive region is formed by plating a metal layer on a side surface of the molded portion and the side surface of the first re-wiring layer.

2. The photosensitive assembly according to claim 1 , wherein the molded portion is a molded layer, and the molded layer covers the second surface to form a fourth surface facing away from the third surface; and
the photosensitive assembly further comprises:
a second re-wiring layer formed on the fourth surface.

3. The photosensitive assembly according to claim 2 , wherein the conductive region is electrically connected to the first re-wiring layer; and the conductive region is further electrically connected to the second re-wiring layer.

4. The photosensitive assembly according claim 2 , wherein the conductive region is formed by cutting a conductive pillar disposed on a boundary between two adjacent photosensitive assemblies.

5. A manufacturing method of photosensitive assembly, comprising:
a) manufacturing the photosensitive assembly according to claim 2 , wherein a part of a re-wiring line of a re-wiring layer of the photosensitive assembly extends to an edge of the re-wiring layer, and is exposed on a side surface of the re-wiring layer, and wherein the re-wiring layer is the first re-wiring layer; and
b) forming the conductive region by plating a metal layer on a side surface of the molded layer and the side surface of the re-wiring layer.

6. The manufacturing method of photosensitive assembly according to claim 5 , wherein the step a) comprises the following sub-steps:
a.1) forming the first re-wiring layer corresponding to the photosensitive chip on a bearing plate;
a.2) disposing the photosensitive chip and the electronic element on the first re-wiring layer, wherein the electronic element is electrically connected to the pad of the photosensitive chip through the first re-wiring layer; and
a.3) fixing the first re-wiring layer, the photosensitive chip and the electronic element together by the molding process.

7. The manufacturing method of photosensitive assembly according to claim 6 , wherein in the step a.1), the bearing plate has a blank region corresponding to the photosensitive region of the photosensitive chip thereon, and the blank region is not covered by the first re-wiring layer.

8. The manufacturing method of photosensitive assembly according to claim 6 , wherein in the step a.1), the first re-wiring layer has a light-passing hole forming region corresponding to the photosensitive region of the photosensitive chip, and no wiring is performed in the light-passing hole forming region; and
the manufacturing method of photosensitive assembly further comprises a step of:
c) removing the light-passing hole forming region.

9. The manufacturing method of photosensitive assembly according to claim 6 , wherein in the step a.1), a part of the re-wiring line of the first re-wiring layer extends to the edge of the first re-wiring layer, and is exposed on the side surface of the first re-wiring layer; and
in the step b), the conductive region is formed by plating the metal layer on the side surface of the molded layer and the side surface of the first re-wiring layer.

10. The manufacturing method of photosensitive assembly according to claim 6 , wherein:
the step a) further comprises a sub-step of:
a.4) forming the second re-wiring layer on a surface of the molded layer formed in step a.3) facing away from the bearing plate.

11. A photosensitive assembly, comprising:
a photosensitive chip having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region and a non-photosensitive region, and the photosensitive chip further having a pad disposed in the non-photosensitive region;
an electronic element arranged around the photosensitive chip;
a molded layer formed by a molding process and fixing the electronic element and the photosensitive chip together, the molded layer having a third surface flush with the first surface, and the molded layer covering the second surface to form a fourth surface facing away from the third surface;
a first re-wiring layer formed on the non-photosensitive region of the first surface and on the third surface, the pad being electrically connected to the electronic element through the first re-wiring layer; and
wherein a re-wiring line of the first re-wiring layer extends to an edge of the first re-wiring layer and is exposed on a side surface of the first re-wiring layer; and the conductive region is formed by plating a metal layer on a side surface of the molded portion and the side surface of the first re-wiring layer.

12. A manufacturing method of photosensitive assembly, comprising:
a) manufacturing a photosensitive assembly spliced board, the photosensitive assembly spliced board being composed of at least two photosensitive assembly units, each of the at least two photosensitive assembly units comprising:
a photosensitive chip having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region and a non-photosensitive region, and the photosensitive chip further having a pad disposed in the non-photosensitive region;
an electronic element arranged around the photosensitive chip; and
a molded layer formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded layer having a third surface flush with the first surface;

wherein a first re-wiring layer formed on the non-photosensitive region of the first surface and on the third surface of each of the at least two photosensitive assembly units, each pad being electrically connected to each electronic element through the first re-wiring layer;
wherein the molded layer of each of two adjacent photosensitive assembly units of the at least two photosensitive assembly units is connected to one another to form a whole, and a conductive pillar is provided at a position of a boundary of the two adjacent photosensitive assembly units of the at least two photosensitive assembly units, the conductive pillar being wrapped in the molded layers forming a whole; and
b) cutting the photosensitive assembly spliced board at the boundary, so that the conductive pillar is cut open, and thereby a side surface of each of the molded layers obtained by cutting has a conductive region.

13. The manufacturing method of photosensitive assembly according to claim 12 , wherein the step a) comprises:
a.1) forming the first re-wi

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Wenjie
• Wang Mingzhu
• Chen Zhenyu

Classifications

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title

• H10W80/211

  using auxiliary members, e.g. aids for protecting the bonding area · CPC title