Electronic control device

Patent metadata

Field	Value
Publication number	US-12426217-B2
Application number	US-202118009911-A
Country	US
Kind code	B2
Filing date	May 20, 2021
Priority date	Jul 1, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

An electronic control device includes a housing including a first region in which heat dissipation fins are formed on one side and an electronic component generating the largest amount of heat is in thermal contact with the other side, and a second region in which an electronic component is in thermal contact with the one side and the other side.

First claim

The invention claimed is:

1. An electronic control device comprising:
a housing including
a first region in which heat dissipation fins are formed on a first side and a first electronic component generating a largest amount of heat is in thermal contact with a second side, and
a second region in which a second electronic component is in thermal contact with the first side and the second side,

wherein the first region and the second region are divided in a longitudinal direction of the housing, and
wherein the first region and the second region are on a same plane.

2. The electronic control device according to claim 1 , further comprising:
a first substrate on which the second electronic component, that is in thermal contact with an upper surface side of the second region, is mounted; and
a second substrate on which a third electronic component, that is in thermal contact with a lower surface side of the second region, is mounted,

wherein the first substrate is fixed to the first side of the housing, and the second substrate is fixed to the second side of the housing.

3. The electronic control device according to claim 2 , further comprising:
a first BtoB connector that connects the first substrate and the second substrate, wherein
the housing is formed with a hole through which the first BtoB connector is inserted, and

a longitudinal direction of the hole is formed to be substantially parallel to an arrangement direction of the first region and the second region.

4. The electronic control device according to claim 3 , further comprising:
a third substrate on which the first electronic component is mounted; and
a second BtoB connector that connects the second substrate and the third substrate,

wherein the second BtoB connector is provided on a surface of the third substrate on which the first electronic component is mounted and a surface of the second substrate on which the third electronic component is mounted.

5. The electronic control device according to claim 4 , wherein
the first electronic component is an accelerator,
the second electronic component is an image processing SoC, and
the third electronic component is a PCIeSW.

6. The electronic control device according to claim 5 , wherein
the accelerator and the second BtoB connector are mounted on a same surface of the third substrate by BGA,
the PCIeSW, the second BtoB connector, and the first BtoB connector are mounted on a same surface of the second substrate by BGA, and
the image processing SoC and the first BtoB connector are mounted on a same surface of the first substrate by BGA.

7. The electronic control device according to claim 6 , further comprising:
an air cooling fan provided on the first side of the first region; and
a fan cover provided to cover the heat dissipation fins.

8. The electronic control device according to claim 7 , wherein a first connector provided on the first substrate and a second connector provided on the second substrate are disposed on a same side of a side surface of the housing.

9. The electronic control device according to claim 8 , further comprising:
a first cover provided to cover an opening on the first side of the housing; and
a second cover provided to cover an opening on the second side of the housing, wherein
the first substrate is disposed in a space formed by the housing and the first cover,
the second substrate and the third substrate are disposed in a space formed by the housing and the second cover, and
a waterproof material that fills gaps between the housing, the first cover, the second cover, the first connector, and the second connector is included.

10. The electronic control device according to claim 1 , wherein
the housing includes a recess, and
the second electronic component is disposed in the recess.

11. The electronic control device according to claim 10 , wherein a gap formed between the recess and the second electronic component is filled with a heat dissipation material.

12. The electronic control device according to claim 7 , further comprising the fan at an end of the heat dissipation fins.

13. The electronic control device according to claim 1 , further comprising a heat pipe that is in thermal contact with both the second electronic component and the heat dissipation fins.

14. The electronic control device according to claim 7 , wherein a fin is formed in the fan cover.

15. The electronic control device according to claim 2 , wherein
at least two electronic components are mounted on the first substrate, and
the at least two electronic components are arranged in parallel with respect to an arrangement direction of the first region and the second region.

16. An electronic control device comprising:
a housing including
a first region in which heat dissipation fins are formed on a first side and a first electronic component generating a largest amount of heat is in thermal contact with a second side, and
a second region in which a second electronic component is in thermal contact with the first side and the second side,
wherein the first region and the second region are divided in a longitudinal direction of the housing;

a first substrate on which the second electronic component, that is in thermal contact with an upper surface side of the second region, is mounted;
a second substrate on which a third electronic component, that is in thermal contact with a lower surface side of the second region, is mounted;
a third substrate on which the first electronic component is mounted,
wherein the first substrate is fixed to the first side of the housing, and the second substrate is fixed to the second side of the housing;

a first BtoB connector that connects the first substrate and the second substrate; and
a second BtoB connector that connects the second substrate and the third substrate,
wherein the housing is formed with a hole through which the first BtoB connector is inserted,
wherein a longitudinal direction of the hole is formed to be substantially parallel to an arrangement direction of the first region and the second region, and wherein the second BtoB connector is provided on a surface of the third substrate on which the first electronic component is mounted and a surface of the second substrate on which the third electronic component is mounted.

Assignees

• Hitachi Astemo Ltd

Inventors

• SUGAHARA Ryujo
• Ichikawa Eiji
• Sakamoto Hideyuki
• Tanaka Daisuke
• Yamamoto Hidetatsu
• Watarai Michihito
• Teranishi Minami

Classifications

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title

• H05K3/36

  Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} · CPC title

• H05K7/20854 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title