Acoustic wave device

Patent metadata

Field	Value
Publication number	US-12425003-B2
Application number	US-202217969727-A
Country	US
Kind code	B2
Filing date	Oct 20, 2022
Priority date	Apr 27, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

An acoustic wave device includes an IDT electrode and reflector electrodes on or above a piezoelectric substrate. A region in which first and second electrode fingers of the IDT electrode overlap each other in an acoustic wave propagation direction defines an intersection region. The intersection region includes a center region and first and second edge regions on both sides of the center region. Dielectric films extend from the first and second edge regions to outer side regions in the acoustic wave propagation direction of the reflector electrodes via the reflector electrodes.

First claim

What is claimed is:

1. An acoustic wave device comprising:
a piezoelectric substrate;
an interdigital transducer (IDT) electrode on or above the piezoelectric substrate and including first and second electrode fingers interdigitated with each other;
reflector electrodes on both sides of the IDT electrode in an acoustic wave propagation direction and including a plurality of electrode fingers; wherein
in the IDT electrode, a region in which the first electrode finger and the second electrode finger overlap each other when viewed in the acoustic wave propagation direction defines an intersection region, the intersection region includes a center region and first and second edge regions on both sides of the center region in a direction in which the first and second electrode fingers extend;
the acoustic wave device further includes a dielectric film extending from the first and second edge regions to outer sides in the acoustic wave propagation direction of regions in which the reflector electrodes are provided; and
the dielectric film extends beyond outer edges of the reflector electrodes in the acoustic wave propagation direction by at least a length of about 0.25 μm.

2. The acoustic wave device according to claim 1 , wherein the dielectric film does not extend to end portions of the piezoelectric substrate.

3. The acoustic wave device according to claim 2 , wherein the dielectric film extends from between the IDT electrode and the piezoelectric substrate to between the reflector electrodes and the piezoelectric substrate.

4. The acoustic wave device according to claim 2 , wherein the dielectric film extends from above the IDT electrode to above the reflector electrodes.

5. The acoustic wave device according to claim 2 , further comprising a protective film covering the IDT electrode.

6. The acoustic wave device according to claim 1 , wherein the dielectric film extends to end portions of the piezoelectric substrate.

7. The acoustic wave device according to claim 6 , wherein the dielectric film extends from between the IDT electrode and the piezoelectric substrate to between the reflector electrodes and the piezoelectric substrate.

8. The acoustic wave device according to claim 6 , wherein the dielectric film extends from above the IDT electrode to above the reflector electrodes.

9. The acoustic wave device according to claim 6 , further comprising a protective film covering the IDT electrode.

10. The acoustic wave device according to claim 1 , wherein the dielectric film extends from between the IDT electrode and the piezoelectric substrate to between the reflector electrodes and the piezoelectric substrate.

11. The acoustic wave device according to claim 1 , wherein the dielectric film extends from above the IDT electrode to above the reflector electrodes.

12. The acoustic wave device according to claim 1 , further comprising a protective film covering the IDT electrode.

13. The acoustic wave device according to claim 1 , wherein the dielectric film is made of tantalum oxide, hafnium oxide, tungsten oxide, selenium oxide, or niobium oxide.

14. The acoustic wave device according to claim 1 , wherein an acoustic velocity in the first and second edge regions is less than an acoustic velocity in the center region.

15. The acoustic wave device according to claim 1 , wherein the piezoelectric substrate includes a support substrate and a piezoelectric film directly or indirectly on the support substrate.

16. The acoustic wave device according to claim 15 , wherein the piezoelectric substrate further includes a high acoustic velocity material layer between the piezoelectric film and the support substrate and that is made of a high acoustic velocity material in which an acoustic velocity of a bulk wave propagating through the high acoustic velocity material is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric film.

17. The acoustic wave device according to claim 16 , wherein the support substrate is made of the high acoustic velocity material, and the high acoustic velocity material layer and the support substrate are integrated.

18. The acoustic wave device according to claim 16 , further comprising a low acoustic velocity film between the high acoustic velocity material layer and the piezoelectric film and that is made of a low acoustic velocity material in which an acoustic velocity of a bulk wave propagating through the low acoustic velocity material is lower than an acoustic velocity of a bulk wave propagating through the piezoelectric film.

19. The acoustic wave device according to claim 15 , wherein the piezoelectric substrate further includes an acoustic reflection film between the piezoelectric film and the support substrate.

20. The acoustic wave device according to claim 19 , wherein the acoustic reflection film includes a low acoustic impedance layer having a relatively low acoustic impedance and a high acoustic impedance layer having a relatively high acoustic impedance.

Assignees

• Murata Manufacturing Co

Inventors

• Taniguchi Yasumasa
• Daimon Katsuya
• Iwamoto Hideki

Classifications

• H03H9/145

  for networks using surface acoustic waves · CPC title

• H03H9/131

  consisting of a multilayered structure · CPC title

• H03H9/02992

  Details of bus bars, contact pads or other electrical connections for finger electrodes · CPC title

• H03H9/02842

  of reflections (H03H9/6406 takes precedence) · CPC title

• H03H9/02007

  of bulk acoustic wave devices · CPC title