Acoustic wave device

Patent metadata

Field	Value
Publication number	US-2019123713-A1
Application number	US-201816158333-A
Country	US
Kind code	A1
Filing date	Oct 12, 2018
Priority date	Oct 20, 2017
Publication date	Apr 25, 2019
Grant date	—

Abstract

An acoustic wave device includes a multilayer substrate including a reverse-velocity surface, a piezoelectric film, a low acoustic velocity material layer, a high acoustic velocity material layer, and an IDT electrode disposed on the piezoelectric film. In the IDT electrode, gap lengths of a first gap between a tip of each of first electrode fingers and a second busbar and a second gap between a tip of each of second electrode fingers and a first busbar are about 0.23 λ or shorter, the gap lengths extending in an extension direction of the first and second electrode fingers.

First claim

1 . An acoustic wave device comprising:
a multilayer substrate including:
a convex reverse-velocity surface;
a piezoelectric film;
a low acoustic velocity material layer in which a bulk wave having lower velocity than acoustic velocity of a bulk wave propagating in the piezoelectric film propagates; and
a high acoustic velocity material layer in which a bulk wave having higher velocity than the acoustic velocity of the acoustic wave propagating in the piezoelectric film propagates, the low acoustic velocity material layer being located between the high acoustic velocity material layer and the piezoelectric film; and
an IDT electrode disposed on the piezoelectric film; wherein the IDT electrode includes first and second busbars opposing each other, a plurality of first electrode fingers extending from the first busbar toward the second busbar, and a plurality of second electrode fingers extending from the second busbar toward the first busbar; and gap lengths of a first gap between a tip of each of the first electrode fingers and the second busbar and a second gap between a tip of each of the second electrode fingers and the first busbar are about 0.23 λ or less, the gap lengths extending in an extension direction of the first and second electrode fingers.

2 . The acoustic wave device according to claim 1 , wherein
in the IDT electrode, an intersecting region in which the first electrode fingers and the second electrode fingers are overlapped with each other in a propagation direction of the acoustic wave includes a central region at a middle portion in the extension direction of the first and second electrode fingers, and first and second edge regions on both outer sides of the central region in the extension direction of the first and second electrode fingers; and an acoustic velocity in each of the first and second edge regions is lower than an acoustic velocity in the central region.

3 . The acoustic wave device according to claim 2 , wherein widths of the first and second electrode fingers in the first and second edge regions are greater than widths of the first and second electrode fingers in the central region, the widths extending in the propagation direction of the acoustic wave.

4 . The acoustic wave device according to claim 2 , wherein each of the first and second busbars includes a plurality of openings arrayed side by side in the propagation direction of the acoustic wave, portions of the first and second busbars on a side closer to the intersecting region than the openings define first and second thin busbar portions, and portions of the first and second busbars on a side farther away from the intersecting region than the openings define first and second outer busbar portions, the first and second thin busbar portions being connected respectively to the first and second outer busbar portions by connecting portions each positioned between the adjacent openings.

5 . The acoustic wave device according to claim 1 , wherein the piezoelectric film is made of LiTaO 3 and has a thickness of about 3.5 λ or smaller.

6 . The acoustic wave device according to claim 1 , wherein the high acoustic velocity material layer is a support substrate made of a high acoustic velocity material.

7 . The acoustic wave device according to claim 1 , further comprising a support substrate that supports the high acoustic velocity material layer.

8 . The acoustic wave device according to claim 1 , wherein first dielectric films defining mass adding films are provided on the first and second edge regions.

9 . The acoustic wave device according to claim 1 , wherein metal films defining mass adding films are provided on portions of the first and second electrode fingers, the portions being provided in the first and second edge regions.

10 . The acoustic wave device according to claim 8 , wherein the first dielectric films are further provided on the first and second busbars and over the first and second gaps.

11 . The acoustic wave device according to claim 10 , wherein a second dielectric film defining a frequency adjustment film is provided on the IDT electrode, and the first dielectric films are provided with the second dielectric film interposed between the IDT electrode and the first dielectric films.

12 . The acoustic wave device according to claim 1 , wherein the piezoelectric film is made of LiTaO 3 .

13 . The acoustic wave device according to claim 1 , further comprising reflectors disposed on the piezoelectric film such that the IDT electrode is disposed therebetween in a propagation direction of the acoustic wave.

14 . The acoustic wave device according to claim 4 , wherein the connecting portions are disposed along extensions of respective ones of the first and second electrode fingers in a direction outward from the intersecting region.

15 . The acoustic wave device according to claim 8 , wherein the first dielectric films are made of silicon oxide, tantalum pentoxide, or tellurium oxide.

16 . The acoustic wave device according to claim 1 , wherein the high acoustic velocity material layer is made of Si, SiN, Al 2 O 3 , Pt, W, or an alloy of Pt or W.

17 . The acoustic wave device according to claim 1 , wherein low acoustic velocity material layer is made of silicon oxide, silicon oxynitride, or a resin material.

Assignees

• Murata Manufacturing Co

Inventors

• Daimon Katsuya

Classifications

• H03H9/02866

  of bulk wave excitation and reflections · CPC title

• H03H9/02637

  Details concerning reflective or coupling arrays · CPC title

• H03H9/02992

  Details of bus bars, contact pads or other electrical connections for finger electrodes · CPC title

• H03H9/25

  Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)} · CPC title

• H03H9/6496

  Reducing ripple in transfer characteristic · CPC title