Data storage medium in the form of a card and method for producing a data storage medium in the form of a card

US12423549B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12423549-B2
Application numberUS-202218709871-A
CountryUS
Kind codeB2
Filing dateNov 23, 2022
Priority dateNov 24, 2021
Publication dateSep 23, 2025
Grant dateSep 23, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A data storage medium in the form of a card, includes: a flexible inlay with a contact structure located on an upper face of the inlay. The inlay has an integrated circuit spaced apart from the contact structure and has at least one antenna; an upper layer, which is located above the inlay, wherein the upper layer has an opening, in which the contact structure is located; and a lower layer, which is located below the inlay. The upper layer includes a continuous metal layer and a ferrite layer, the ferrite layer being located between the metal layer and the flexible inlay. A method is provided for producing a data storage medium in the form of a card.

First claim

Opening claim text (preview).

The invention claimed is: 1. A data carrier in a form of a card having a flexible inlay with a contact structure arranged on an upper side of the inlay, the inlay having an integrated circuit spaced apart from the contact structure and at least one antenna, an upper layer which is arranged above the inlay, the upper layer having a recess in which the contact structure is arranged, and a lower layer which is arranged underneath the inlay, wherein the upper layer comprises a continuous metal layer and a ferrite layer, the ferrite layer being arranged between the metal layer and the flexible inlay, and wherein the integrated circuit is spaced apart from the recess. 2. The data carrier in the form of a card according to claim 1 , wherein a first adhesive layer is arranged between the ferrite layer and the metal layer and a second adhesive layer is arranged between the ferrite layer and the inlay, the recess extending through the metal layer, the adhesive layers and the ferrite layer. 3. The data carrier in the form of a card according to claim 1 , wherein the lower layer comprises a plastic layer a layer with optical features and an outer-lying overlay layer. 4. The data carrier in the form of a card according to claim 3 , wherein an insert which positions the contact structure in the recess of the upper layer is arranged underneath the contact structure. 5. The data carrier in the form of a card according to claim 4 , wherein the insert is arranged in the lower layer underneath the contact structure, the insert being arranged between the plastic layer and the layer with optical features. 6. The data carrier in the form of a card according to claim 4 , wherein a height of the insert, of the inlay, of the plastic layer and of the contact structure corresponds to a height of the recess of the upper layer. 7. The data carrier in the form of a card according to claim 1 , wherein the metal layer is covered with at least one outer-lying layer. 8. The data carrier in the form of a card according to claim 1 , wherein inner-lying edges of the recess of the upper layer are provided with a chamfer. 9. The data carrier in the form of a card according to claim 1 , wherein the antenna is arranged in a region of a circumferential face of the data carrier in the form of a card. 10. A method for producing a data carrier in the form of a card according to claim 1 , having the steps: providing a flexible inlay having a contact structure of the data carrier in the form of a card, which is arranged on an upper side of the inlay, the inlay having an integrated circuit spaced apart from the contact structure and at least one antenna, arranging an upper layer having a recess on the upper side of the inlay, in such a way that the contact structure is arranged in the recess, arranging a lower layer underneath the inlay, and laminating the layers to form a data carrier in the form of a card. 11. A data carrier in a form of a card having a flexible inlay with a contact structure arranged on an upper side of the inlay, the inlay having an integrated circuit spaced apart from the contact structure and at least one antenna, an upper layer which is arranged above the inlay, the upper layer having a recess in which the contact structure is arranged, and a lower layer which is arranged underneath the inlay, wherein the lower layer comprises a continuous metal layer and a ferrite layer, the ferrite layer being arranged between the metal layer and the flexible inlay, and wherein the integrated circuit is spaced apart from the recess. 12. The data carrier in the form of a card according to claim 11 , wherein the upper layer comprises a third adhesive layer, a layer with optical features and an outer-lying overlay layer, the third adhesive layer being arranged between the layer with optical features and the inlay, the recess extending through the third adhesive layer, the layer with optical features and the overlay layer. 13. The data carrier in the form of a card according to claim 11 , wherein a first adhesive layer is arranged between the ferrite layer and the metal layer and a second adhesive layer is arranged between the ferrite layer and the inlay. 14. The data carrier in the form of a card according to claim 13 , wherein an insert which positions the contact structure in the recess of the upper layer is arranged underneath the contact structure. 15. The data carrier in the form of a card according to claim 14 , wherein the insert is arranged on the lower layer underneath the contact structure, the insert being arranged between the inlay and the second adhesive layer. 16. The data carrier in the form of a card according to claim 14 , wherein a height of the insert, of the inlay and of the contact structure corresponds to a height of the recess of the upper layer.

Assignees

Inventors

Classifications

  • the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object · CPC title

  • the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface · CPC title

  • the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

  • G06K19/02Primary

    characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12423549B2 cover?
A data storage medium in the form of a card, includes: a flexible inlay with a contact structure located on an upper face of the inlay. The inlay has an integrated circuit spaced apart from the contact structure and has at least one antenna; an upper layer, which is located above the inlay, wherein the upper layer has an opening, in which the contact structure is located; and a lower layer, whi…
Who is the assignee on this patent?
Giesecke & Devrient Epayments Gmbh
What technology area does this patent fall under?
Primary CPC classification G06K19/07722. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 23 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).