Large area projection micro stereolithography

Patent metadata

Field	Value
Publication number	US-12420477-B2
Application number	US-202117456084-A
Country	US
Kind code	B2
Filing date	Nov 22, 2021
Priority date	Apr 16, 2015
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A large area projection micro stereolithography (LAPμSL) system uses an addressable spatial light modulator (SLM) in coordination with an optical scanning system to make very large stereolithographically produced objects. The SLM is imaged onto a photosensitive material with an optical system that has the ability to scan the image over a large area and speedily manufacture large scale complex three dimensional components with micro scale features.

First claim

The invention claimed is:

1. A large area projection micro stereolithography system for producing a product comprising:
a build plane forming a substrate, the substrate configured to support a curable resin thereon and fixedly located in an X/Y plane while producing the product; and
an adjustable beam delivery subsystem including a spatial light modulator and a beam directing optical assembly:
a processing unit;
wherein the processing unit is configured to receive a three dimensional computer aided design model of the product and to generate a multiplicity of two-dimensional computer generated slices of the product from the three dimensional computer aided design model, the multiplicity of two-dimensional computer generated slices including a first slice, a second slice, and additional slices, the first slice is further subdivided into discrete regions including a first subset of regions, a second subset of regions, and additional subsets of regions,
wherein the spatial light modulator is communicatively connected to the processing unit and configured to illuminate the first subset of regions to produce a first subset of regions image on to the beam directing optical assembly,
wherein the beam directing optical assembly is configured to project and scan the first subset of regions image within an X/Y plane, to the curable resin supported on the substrate, and the spatial light modulator and the beam directing optical assembly are not translatable within the X/Y plane associated with the build plane,
wherein the adjustable beam delivery subsystem is configured to repeat the above steps for the second subset of regions and the additional subsets of regions to complete the first slice of the product, and
wherein the adjustable beam delivery subsystem is configured to repeat the above steps for the second slice and the additional slices to complete the product.

2. The large area projection micro stereolithography (LAPμSL) system of claim 1 , wherein the spatial light modulator comprises a digital micromirror device.

3. The large area projection micro stereolithography (LAPμSL) system of claim 1 , wherein the spatial light modulator comprises a liquid crystal on silicon device.

4. The large area projection micro stereolithography (LAPμSL) system of claim 1 , wherein the adjustable beam delivery subsystem includes a flat field scan lens.

5. The large area projection micro stereolithography (LAPμSL) system of claim 1 , wherein the adjustable beam delivery subsystem is configured to project and scan said first subset of regions image to the curable resin, is configured to project and scan the second subset of regions image to the curable resin, and is configured to project and scan the additional subsets of regions image to the curable resin and overlap the first subset of regions image, the second subset of regions image, and the additional subsets of regions images.

6. The large area projection micro stereolithography (LAPμSL) system of claim 1 , further comprising an additional plurality of LAPμSL systems which are ganged together with the LAPμSL system to complete the product.

7. The large area projection micro stereolithography LAPμSL system of claim 1 , wherein the curable resin includes dispersed metal particles, and
wherein the adjustable beam delivery subsystem is configured to repeat the above steps for the second slice and the additional slices to complete the product, the product having resin with dispersed metal particles, and
further comprising a thermal decomposition system configured to remove the resin from the product having resin with dispersed metal particles and producing a metal product.

8. The large area projection micro stereolithography (LAPμSL) system of claim 1 , wherein the curable resin includes dispersed ceramic particles, and
wherein the adjustable beam delivery subsystem is configured to repeat the above steps for the second slice and the additional slices to complete the product, the product having resin with dispersed ceramic particles, and
further comprising a thermal decomposition system for removing the resin from the product having resin with dispersed ceramic particles and producing a ceramic product.

9. The large area projection micro stereolithography (LAPμSL) system of claim 1 , wherein the curable resin includes dispersed metal and ceramic particles, and
wherein the adjustable beam delivery subsystem is configured to repeat the above steps for the second slice and the additional slices to complete the product, the product having resin with dispersed metal and ceramic particles, and
further comprising a thermal decomposition system configured to remove the resin from the product having resin with dispersed metal and ceramic particles and producing a metal and ceramic product.

10. The large area projection micro stereolithography (LAPμSL) system of claim 1 , comprising one or more subsystems associated with the LAPμSL system in an integrated apparatus.

11. A large area projection micro stereolithography (LAPμSL) system for producing a product using an optically curable resin on a build plane forming a substrate, and 3D computer model of the product represented by a plurality of computer generated two dimensional (2D) slices of the product, the system comprising:
a central processing unit (CPU) configured to subdivide each of the plurality of computer generated 2D slices into a plurality of contiguous subregions, each one of the contiguous subregions having information associated therewith needed to form a corresponding subportion of a specific one of the plurality of computer generated 2D slices of the product;
the build plane fixedly located in an X/Y plane on which the product is formed, the build plane lying within a plane defined by orthogonally extending X and Y axes;
an elevator operably associated with the build plane configured to move the build plane along a vertical Z axis within a container, the Z axis extending orthogonal to both of the X and Y axes, the container adapted to contain a quantity of the optically curable resin for forming the product in a layer-by-layer process;
a spatial light modulator disposed fixedly and in communication with the CPU and configured to receive and use the information associated with each one of the plurality of subregions to create a plurality of images associated therewith, each one of the plurality of images being uniquely associated with a specific one of the plurality of subregions within a specific one of the plurality of computer generated 2D slices of the product; and
a beam steering system disposed fixedly and configured to optically scan each one of the plurality of images within an X/Y plane to an associated one of the contiguous subregions, sequentially one after another, to preferentially cure subportions of the optically curable resin exposed to the plurality of images, to form a given 2D slice of the product.

12. The system of claim 11 , wherein at least a subplurality of contiguous ones of the subregions of the given 2D slice are dimensioned to overlap each other, such that corresponding ones of the images associated therewith also overlap one another when projected by the beam steering system into the curable resin.

Assignees

• L Livermore Nat Security Llc

Inventors

• Moran Bryan D

Classifications

• B29L2009/00

  Layered products · CPC title

• B33Y50/00

  Data acquisition or data processing for additive manufacturing · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B29C64/393

  for controlling or regulating additive manufacturing processes · CPC title