Ultrasonic device

US12415206B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12415206-B2
Application numberUS-202117469597-A
CountryUS
Kind codeB2
Filing dateSep 8, 2021
Priority dateSep 16, 2020
Publication dateSep 16, 2025
Grant dateSep 16, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An ultrasonic sensor includes: a first substrate including an ultrasonic element; a first electrode and a second electrode on the first substrate; a second substrate having a through-hole that penetrates from a first surface facing the first substrate to a second surface; and a gap material that separates the first substrate and the second substrate from each other, in which in a plan view from a +Z direction, the through-hole overlaps with the first electrode and the second electrode, and the gap material surrounds the through-hole, the through-hole has a narrow portion, and a width of the narrow portion is smaller than a width of the through-hole in the first surface, in a direction orthogonal to the +Z direction.

First claim

Opening claim text (preview).

What is claimed is: 1. An ultrasonic device comprising: a first substrate including an ultrasonic element; an electrode on the first substrate; a second substrate having a through-hole that penetrates from a first surface facing the first substrate to a second surface opposite to the first surface; a gap material formed of a curable resin and interposed between the electrode and the second substrate and separating the first substrate and the second substrate; and a conductive resin electrically coupled to the electrode and disposed on a space surrounded by the electrode, the through-hole, and the gap material, wherein the gap material is in direct contact with the second substrate, the second substrate is stacked in a first direction with respect to the first substrate, the conductive resin protrudes from the second substrate toward the first direction, in a plan view from the first direction, the through-hole overlaps with the electrode, and the gap material surrounds the through-hole, the through-hole has a narrow portion, a width of the narrow portion is smaller than a width of the through-hole in the first surface, in a second direction orthogonal to the first direction, and a width of the space surrounded by the electrode, the through-hole, and the gap material is equal to the width of the through-hole in the first surface. 2. The ultrasonic device according to claim 1 , wherein the narrow portion is formed at the second surface, and the width of the through-hole becomes smaller from the first surface toward the second surface in the second direction. 3. The ultrasonic device according to claim 1 , wherein the narrow portion is formed between the first surface and the second surface. 4. The ultrasonic device according to claim 1 , wherein the ultrasonic element does not overlap with the through-hole in the plan view from the first direction. 5. The ultrasonic device according to claim 2 , wherein the ultrasonic element does not overlap with the through-hole in the plan view from the first direction. 6. The ultrasonic device according to claim 3 , wherein the ultrasonic element does not overlap with the through-hole in the plan view from the first direction. 7. The ultrasonic device according to claim 1 , wherein the narrow portion is formed at a middle portion of the first surface and the second surface, the through-hole becomes smaller in a tapered shape from the first surface to the middle portion, and the through-hole becomes smaller in the tapered shape from the second surface to the middle portion. 8. The ultrasonic device according to claim 1 , wherein a volume of the conductive resin is larger than an internal volume of the space surrounded by the electrode, the through-hole, and the gap material. 9. The ultrasonic device according to claim 1 , wherein at least a portion of the electrode is on the ultrasonic element, and at least the portion of the electrode is in direct contact with the ultrasonic element.

Assignees

Inventors

Classifications

  • Systems for measuring distance only (indirect measurement G01S15/46) · CPC title

  • Constructional features · CPC title

  • B06B1/0666Primary

    used as a diaphragm · CPC title

  • B06B1/0644Primary

    using a single piezoelectric element (B06B1/0688 takes precedence) · CPC title

Patent family

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Frequently asked questions

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What does patent US12415206B2 cover?
An ultrasonic sensor includes: a first substrate including an ultrasonic element; a first electrode and a second electrode on the first substrate; a second substrate having a through-hole that penetrates from a first surface facing the first substrate to a second surface; and a gap material that separates the first substrate and the second substrate from each other, in which in a plan view from…
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B06B1/0666. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 16 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).