Ultrasonic device and method of manufacturing ultrasonic device
US-2021223213-A1 · Jul 22, 2021 · US
US12415206B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12415206-B2 |
| Application number | US-202117469597-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 8, 2021 |
| Priority date | Sep 16, 2020 |
| Publication date | Sep 16, 2025 |
| Grant date | Sep 16, 2025 |
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An ultrasonic sensor includes: a first substrate including an ultrasonic element; a first electrode and a second electrode on the first substrate; a second substrate having a through-hole that penetrates from a first surface facing the first substrate to a second surface; and a gap material that separates the first substrate and the second substrate from each other, in which in a plan view from a +Z direction, the through-hole overlaps with the first electrode and the second electrode, and the gap material surrounds the through-hole, the through-hole has a narrow portion, and a width of the narrow portion is smaller than a width of the through-hole in the first surface, in a direction orthogonal to the +Z direction.
Opening claim text (preview).
What is claimed is: 1. An ultrasonic device comprising: a first substrate including an ultrasonic element; an electrode on the first substrate; a second substrate having a through-hole that penetrates from a first surface facing the first substrate to a second surface opposite to the first surface; a gap material formed of a curable resin and interposed between the electrode and the second substrate and separating the first substrate and the second substrate; and a conductive resin electrically coupled to the electrode and disposed on a space surrounded by the electrode, the through-hole, and the gap material, wherein the gap material is in direct contact with the second substrate, the second substrate is stacked in a first direction with respect to the first substrate, the conductive resin protrudes from the second substrate toward the first direction, in a plan view from the first direction, the through-hole overlaps with the electrode, and the gap material surrounds the through-hole, the through-hole has a narrow portion, a width of the narrow portion is smaller than a width of the through-hole in the first surface, in a second direction orthogonal to the first direction, and a width of the space surrounded by the electrode, the through-hole, and the gap material is equal to the width of the through-hole in the first surface. 2. The ultrasonic device according to claim 1 , wherein the narrow portion is formed at the second surface, and the width of the through-hole becomes smaller from the first surface toward the second surface in the second direction. 3. The ultrasonic device according to claim 1 , wherein the narrow portion is formed between the first surface and the second surface. 4. The ultrasonic device according to claim 1 , wherein the ultrasonic element does not overlap with the through-hole in the plan view from the first direction. 5. The ultrasonic device according to claim 2 , wherein the ultrasonic element does not overlap with the through-hole in the plan view from the first direction. 6. The ultrasonic device according to claim 3 , wherein the ultrasonic element does not overlap with the through-hole in the plan view from the first direction. 7. The ultrasonic device according to claim 1 , wherein the narrow portion is formed at a middle portion of the first surface and the second surface, the through-hole becomes smaller in a tapered shape from the first surface to the middle portion, and the through-hole becomes smaller in the tapered shape from the second surface to the middle portion. 8. The ultrasonic device according to claim 1 , wherein a volume of the conductive resin is larger than an internal volume of the space surrounded by the electrode, the through-hole, and the gap material. 9. The ultrasonic device according to claim 1 , wherein at least a portion of the electrode is on the ultrasonic element, and at least the portion of the electrode is in direct contact with the ultrasonic element.
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