Electronic device

Patent metadata

Field	Value
Publication number	US-10296135-B2
Application number	US-201715658953-A
Country	US
Kind code	B2
Filing date	Jul 25, 2017
Priority date	Jul 29, 2016
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

In one embodiment, an electronic device includes first and second substrates, an insulating layer, and a connecting material. The first substrate includes a first conductive layer. The second substrate includes a basement having first and second surfaces, a second conductive layer on the second surface, and a first hole penetrating through the basement. The insulating layer is arranged between the first conductive layer and the basement, and has a second hole. The connecting material connects conductive layers via holes. The first hole has a first opening on a first surface side. The second hole has a third opening on a first conductive layer side which is larger than the first opening.

First claim

What is claimed is:

1. An electronic device comprising:
a first substrate which includes a first conductive layer;
a second substrate which includes
a basement which has
a first surface opposed to the first conductive layer and separated from the first conductive layer, and
a second surface opposite to the first surface,

a second conductive layer which is arranged on the second surface, and
a first hole which penetrates through between the first surface and the second surface;

an insulating layer which is arranged between the first conductive layer and the basement, and has a second hole which is connected to the first hole; and
a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole and the second hole, wherein
the first hole has a first opening on a first surface side and a second opening on a second surface side,
the second hole has a third opening on a first conductive layer side and a fourth opening on a basement side, and
the third opening is larger than the first opening.

2. The electronic device according to claim 1 , wherein the second hole has a shape that a width increases from the fourth opening to the third opening in a sectional view.

3. The electronic device according to claim 1 , wherein
the first conductive layer has a flat area which closes the third opening, and
the connecting material is in contact with the area.

4. The electronic device according to claim 1 , wherein the insulating layer includes a sealing material which attaches the first substrate and the second substrate to each other.

5. The electronic device according to claim 1 , wherein the fourth opening is larger than the first opening.

6. The electronic device according to claim 1 , wherein the first opening is larger than the second opening.

7. The electronic device according to claim 1 , wherein the first opening is smaller than the second opening.

8. The electronic device according to claim 1 , wherein the first hole has a shape that a width increases from the first opening toward the second opening in a sectional view.

9. The electronic device according to claim 1 , wherein
the first hole has an intermediate portion which is located between the first opening and the second opening, and
the first hole has a shape that a width decreases from the first opening toward the intermediate portion and increases from the intermediate portion toward the second opening in a sectional view.

10. The electronic device according to claim 9 , wherein the first opening is smaller than the second opening.

11. The electronic device according to claim 1 , wherein the connecting material covers an inner surface of the first hole and an inner surface of the second hole.

12. The electronic device according to claim 1 , wherein the connecting material covers the second surface and the second conductive layer covers the connecting material in a circumference of the first hole.

13. The electronic device according to claim 1 , wherein the connecting material inside the first hole is formed between the second conductive layer and an inner surface of the first hole.

14. The electronic device according to claim 1 , wherein the second conductive layer inside the first hole is formed between the connecting material and an inner surface of the first hole.

15. The electronic device according to claim 1 , further comprising a protection layer which covers the second conductive layer and the connecting material.

16. The electronic device according to claim 15 , wherein the protection layer includes a first protection layer which covers the second conductive layer, and a second protection layer which covers the connecting material.

17. The electronic device according to claim 16 , wherein the second hole is filled with the second protection layer.

18. The electronic device according to claim 1 , wherein
the second conductive layer includes
a detector which detects an object in contact with or in proximity to the first area, and
a terminal which is arranged in a second area adjacent to the first area and is connected to the detector, and

the first hole and the second hole are located in a position which overlaps the terminal in a plan view.

19. The electronic device according to claim 18 , further comprising a detection circuit which is electrically connected to the first conductive layer and reads a sensor signal output from the second conductive layer.

20. The electronic device according to claim 18 , wherein the first substrate includes a driving electrode which is opposed to the second conductive layer.

Assignees

• Japan Display Inc

Inventors

• Imazeki Yoshikatsu

Classifications

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W74/147

  the encapsulations being multilayered · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title