Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package

Patent metadata

Field	Value
Publication number	US-12413001-B2
Application number	US-202117352103-A
Country	US
Kind code	B2
Filing date	Jun 18, 2021
Priority date	Jun 18, 2021
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.

First claim

What is claimed is:

1. A microelectronic socket structure comprising:
a socket structure housing defining a cavity therein; and
an interconnection structure including:
a contact element at least in part within the cavity, and to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and
a conductive structure at least in part within the cavity and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.

2. The socket structure of claim 1 , wherein the conductive structure includes a conductive coating on interior walls of the cavity, the conductive coating on at least a portion of the interior walls.

3. The socket structure of claim 1 , wherein the conductive structure includes an insertable conductive structure inserted into the cavity of the socket structure housing.

4. The socket structure of claim 3 , wherein the insertable conductive structure includes one or more conductive stubs.

5. The socket structure of claim 3 , wherein the interconnection structure is a unitary interconnection structure, and the insertable conductive structure includes the contact element and a stubby feature fixed to the contact element to form the unitary interconnection structure therewith.

6. The socket structure of claim 3 , wherein the insertable conductive structure includes a conductive body defining a recess therein, the contact element inserted within the recess.

7. The socket structure of claim 1 , wherein the contact element includes a coating thereon.

8. The socket structure of claim 1 , wherein the contact element is a ground contact pin.

9. The socket structure of claim 8 , wherein the cavity includes one or more cavity extensions extending in a direction toward one or more respective adjacent signal contact elements of the socket structure, the conductive structure at least in part within the one or more cavity extensions.

10. The socket structure of claim 9 , wherein the one or more cavity extensions include individual extensions respectively extending in a direction of a respective one of the adjacent signal contact elements.

11. The socket structure of claim 1 , wherein the conductive structure includes a portion that extends beyond the cavity of the socket structure housing and onto a top surface of the socket structure housing, the top surface to face a surface of the package when the contact element is electrically coupled to the package.

12. The socket structure of claim 11 , wherein the socket structure housing includes an interstitial seating plane on a top surface thereof, and the portion of the conductive structure includes a conductive coating on the interstitial seating plane (ISP).

13. The socket structure of claim 1 , further including a split region, and conductive tuning features on the split regions.

14. The socket structure of claim 13 , wherein the socket structure housing defines tuning feature holes, and the conductive tuning features are inserted into the holes.

15. An microelectronic system comprising:
a microelectronic package containing package circuitry, and package contacts configured to provide signals and ground to the package circuitry;
a motherboard containing motherboard circuitry and motherboard contacts configured to provide signals and ground between the motherboard circuitry and the package circuitry; and
a microelectronic socket structure between the package and the motherboard and including:
a socket structure housing defining a plurality of cavities therein; and
a plurality of interconnection structures, individual ones of the interconnection structures including:
a contact element at least in part within a corresponding one of the cavities, and electrically coupled to a corresponding one of the package contacts and the motherboard contacts, the contact element further including one of a signal contact element or a ground contact element; and
a conductive structure at least in part within a corresponding one of the cavities and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.

16. The microelectronic system of claim 15 , wherein the conductive structure includes a conductive coating on interior walls of the corresponding one of the cavities, the conductive coating on at least a portion of the interior walls.

17. The microelectronic system of claim 15 , wherein the conductive structure includes an insertable conductive structure inserted into the corresponding one of the cavities of the socket structure housing.

18. The microelectronic system of claim 17 , wherein the insertable conductive structure includes one or more conductive stubs.

19. The microelectronic system of claim 17 , wherein the interconnection structure is a unitary interconnection structure, and the insertable conductive structure includes the contact element and a stubby feature fixed to the contact element to form the unitary interconnection structure therewith.

20. A computing system including:
a memory; and
a processors coupled to the memory and including an microelectronic system that comprises:
a microelectronic package containing package circuitry, and package contacts configured to provide signals and ground to the package circuitry;
a motherboard containing motherboard circuitry and motherboard contacts configured to provide signals and ground between the motherboard circuitry and the package circuitry; and
a microelectronic socket structure between the package and the motherboard and including:
a socket structure housing defining a plurality of cavities therein; and
a plurality of interconnection structures, individual ones of the interconnection structures including:
a contact element at least in part within a corresponding one of the cavities, and electrically coupled to a corresponding one of the package contacts and the motherboard contacts, the contact element further including one of a signal contact element or a ground contact element; and
a conductive structure at least in part within a corresponding one of the cavities and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.

21. The computing system of claim 20 , wherein the conductive structure includes a conductive coating on interior walls of the corresponding one of the cavities, the conductive coating on at least a portion of the interior walls.

22. The computing system of claim 20 , wherein the conductive structure includes an insertable conductive structure inserted into the corresponding one of the cavities of the socket structure housing.

23. A method of fabricating a socket structure for a microelectronic system, the method including:
providing a cavity in a socket housing made of a dielectric mat

Assignees

• Intel Corp

Inventors

• Zhang Zhichao
• Chen Zhe
• Klein Steven A
• Cheng Feifei
• Nekkanty Srikant
• Aygun Kemal
• Ryan Michael E
• Tadayon Pooya

Classifications

• H01R13/17

  with spring member on the pin · CPC title

• B81B2201/07

  Data storage devices, static or dynamic memories · CPC title

• B81B2207/07

  Interconnects · CPC title

• H01R2201/06

  for computer periphery · CPC title

• B81B1/00

  Devices without movable or flexible elements, e.g. microcapillary devices · CPC title