Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package
US-12413001-B2 · Sep 9, 2025 · US
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Ryan Michael E patents
Ryan Michael E is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ryan Michael E |
| Total patents | 2 |
| First publication | Dec 22, 2022 |
| Latest publication | Sep 9, 2025 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01R13/17 | 2 |
| B81B2201/07 | 2 |
| B81B2207/07 | 2 |
| H01R2201/06 | 2 |
| B81B1/00 | 2 |