Shutter apparatus and substrate treating apparatus including the same

Patent metadata

Field	Value
Publication number	US-12411427-B2
Application number	US-202117467949-A
Country	US
Kind code	B2
Filing date	Sep 7, 2021
Priority date	Sep 10, 2020
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a process chamber having an opening, a shutter that opens and closes the opening through a rotation thereof, and a shutter driver having a cylinder that opens and closes the shutter, and the shutter driver includes a controller that controls a pneumatic pressure provided to the cylinder such that, when the shutter is rotated from an opening location to a closing location, a rotational speed of the shutter in a first rotation section including the opening location and a rotational speed of the shutter in a second rotation section including the closing location are different.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a process chamber having an opening;
a shutter configured to open and close the opening through a rotation thereof while maintaining a gap with respect to the process chamber while closed; and
a shutter driver having a cylinder configured to open and close the shutter,
wherein the shutter driver includes:
a controller configured to control a pneumatic pressure provided to the cylinder such that, when the shutter is rotated from an opening location to a closing location, a rotational speed of the shutter in a first rotation section including the opening location and a rotational speed of the shutter in a second rotation section including the closing location are different,
wherein the shutter driver includes:
the cylinder;
a first pneumatic pressure line configured to provide a positive pressure for closing the shutter to the cylinder;
a second pneumatic pressure line configured to provide a back pressure for opening the shutter to the cylinder;
a first valve provided in the first pneumatic pressure line;
a second valve provided in the second pneumatic pressure line; and
the controller configured to control the first valve and the second valve,
wherein the controller controls the second valve to provide the back pressure to the cylinder through the second pneumatic pressure line when the shutter enters the second rotation section,
the gap is 3 mm, and
the process chamber has an exhaust hole on a sidewall of the process chamber opposite to the opening, the exhaust hole configured to exhaust air introduced to the process chamber through the gap.

2. The substrate treating apparatus of claim 1 , wherein the first rotation section has a rotation section that is larger than the second rotation section.

3. The substrate treating apparatus of claim 1 , wherein the rotational speed of the shutter in the second rotation section is lower than the rotational speed of the shutter in the first rotation section.

4. The substrate treating apparatus of claim 1 , wherein the shutter driver further includes:
a regulator installed in the second pneumatic pressure line.

5. The substrate treating apparatus of claim 4 , wherein the regulator is configured such that the back pressure supplied to a back pressure chamber is lower than the positive pressure supplied to a positive pressure chamber.

6. The substrate treating apparatus of claim 1 ,
wherein the cylinder is a rack-pinion type rotary cylinder configured to convert a linear thrust obtained by a piston into a rotary torque.

7. The substrate treating apparatus of claim 6 , wherein the controller is configured to supply the positive pressure and the back pressure during a closing operation of the shutter, and to provide the back pressure during an opening of the shutter.

8. A substrate treating apparatus comprising:
a process chamber having an opening;
a shutter configured to open and close the opening through a rotation thereof while maintaining a gap with respect to the process chamber while closed; and
a shutter driver having a cylinder configured to open and close the shutter,
wherein the shutter driver further includes:
the cylinder having a positive pressure chamber accommodating a piston such that the piston is moved forwards and rearwards in an axial direction thereof, formed on one side of the piston, and through which a pneumatic pressure for closing the shutter is introduced, and a back pressure chamber formed on an opposite side thereof and through which a pneumatic pressure for opening the shutter is introduced,
a first pneumatic pressure line configured to provide a positive pressure for closing the shutter to the positive pressure chamber;
a second pneumatic pressure line configured to provide a back pressure for opening the shutter to the back pressure chamber;
a first valve provided in the first pneumatic pressure line;
a second valve provided in the second pneumatic pressure line; and
a controller configured to control the first and second valves such that the positive pressure and the back pressure are provided together during closing operation of the shutter,
wherein the controller controls the first valve such that a pneumatic pressure is supplied to the positive pressure chamber for the closing operation of the shutter, and controls the second valve such that a pneumatic pressure is supplied to the back pressure chamber when the shutter is located at a specific angle,
wherein a range, in which the shutter is rotated for a period of time, for which the positive pressure and the back pressure are simultaneously provided to the cylinder during the closing operation of the shutter, is shorter than a range, in which the shutter is rotated for a period of time, for which only the positive pressure is provided to the cylinder,
the gap is 3 mm, and
the process chamber has an exhaust hole on a sidewall of the process chamber opposite to the opening, the exhaust hole configured to exhaust air introduced to the process chamber through the gap.

9. The substrate treating apparatus of claim 8 , wherein the shutter driver further includes:
a regulator installed in the second pneumatic pressure line.

10. The substrate treating apparatus of claim 8 , wherein the controller controls the first valve such that the positive pressure is supplied to the positive pressure chamber for the closing operation of the shutter, and controls the second valve such that the back pressure is supplied to the back pressure chamber after a specific period of time.

11. The substrate treating apparatus of claim 10 , wherein a period of time, for which the positive pressure and the back pressure are simultaneously provided to the cylinder during the closing operation of the shutter, is shorter than a period of time, for which only the positive pressure is provided to the cylinder.

12. The substrate treating apparatus of claim 8 , wherein the controller controls the positive pressure and the back pressure to be supplied to the cylinder such that, when the shutter is rotated from an opening location to a closing location, a rotational speed of the shutter in a first rotation section including the opening location is higher than a rotational speed of the shutter in a second rotation section including the closing location.

13. The substrate treating apparatus of claim 12 , wherein the controller controls the first valve and the second valve such that only the positive pressure is provided in the first rotation section and the positive pressure and the back pressure are simultaneously provided in the second rotation section.

14. The substrate treating apparatus of claim 8 , wherein the back pressure supplied to the back pressure chamber is lower than the positive pressure supplied to the positive pressure chamber.

15. A shutter apparatus configured to open and close access to a process chamber, the shutter apparatus comprising:
a shutter configured to open and close an opening through a rotation thereof while maintaining a gap with respect to the opening while closed; and
a shutter driver having a cylinder configured to open and close the shutter,
wherein the shutter driver further includes:
the cylinder having a positive pressure chamber accommodating a piston such that the piston is moved forwards and rearwards in an axial direction thereof, formed on one side of the piston, and through which a pneumatic pressure for closing the shutter is introduced, and a back pressure chamber formed on an opposite side thereof and through which a pneumatic pressure for opening the shutter is introduced,
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Assignees

• Semes Co Ltd

Inventors

• Do Wan Ho

Classifications

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• F27D1/1858

  Doors · CPC title

• F15B15/20

  Other details {, e.g. assembly with regulating devices} · CPC title

• F27B17/0025

  specially adapted for treating semiconductor wafers · CPC title

• F27B17/02

  specially designed for laboratory use · CPC title