Semiconductor structure with frontside port and cavity features for conveying sample to sensing element

US12411105B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12411105-B2
Application numberUS-202217821836-A
CountryUS
Kind codeB2
Filing dateAug 24, 2022
Priority dateAug 24, 2022
Publication dateSep 9, 2025
Grant dateSep 9, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A structure includes a lab-on-chip (LOC) sensor and frontside port and cavity features for conveying a flowable sample (fluid or gas) to a sensing element of the sensor. The cavity is confined within middle of the line (MOL) dielectric layer(s). Alternatively, the cavity includes a lower section within MOL dielectric layer(s), an upper section within back end of the line (BEOL) dielectric layer(s) in the first metal (M1) level, a divider between the sections, and a duct linking the sections. Alternatively, the cavity includes a lower portion within MOL dielectric layer(s) and an upper portion continuous with the lower portion and within BEOL dielectric layer(s) in the M1 level. Optionally, the cavity is separated from the sensing element by an additional dielectric layer and/or at least partially lined with a dielectric liner. The port extends from the top of the BEOL dielectric layers down to the cavity.

First claim

Opening claim text (preview).

What is claimed is: 1. A structure comprising: a first dielectric layer on a sensing element; a second dielectric layer on the first dielectric layer, wherein a cavity is within the first dielectric layer between the sensing element and the second dielectric layer; a third dielectric layer on the second dielectric layer; a fourth dielectric layer on the third dielectric layer; a first interconnect on the sensing element; and a second interconnect on the first interconnect, wherein the first interconnect extends from the sensing element through the first dielectric layer to the second interconnect, wherein the second interconnect extends from the first interconnect through the second dielectric layer and the third dielectric layer to the fourth dielectric layer, and wherein a port extends from the cavity at least through the second dielectric layer, the third dielectric layer and the fourth dielectric layer. 2. The structure of claim 1 , wherein the port and the cavity enable a sample to flow toward the sensing element. 3. The structure of claim 1 , further comprising an additional dielectric layer between the sensing element and the first dielectric layer, wherein the cavity extends from the additional dielectric layer to the second dielectric layer. 4. The structure of claim 1 , wherein the cavity extends from the sensing element to the second dielectric layer. 5. The structure of claim 1 , further comprising a dielectric liner lining at least a bottom of the cavity. 6. The structure of claim 1 , wherein the sensing element comprises a photodetector and wherein the sample is illuminable within the cavity. 7. The structure of claim 1 , wherein the sensing element comprises a semiconductor region of a field effect transistor, wherein the semiconductor region comprises source/drain regions and a channel region between the source/drain regions, wherein the cavity is adjacent to the channel region, and wherein the field effect transistor further comprises a gate structure comprising: an additional dielectric layer; and the sample within the cavity, wherein the sample is biasable and separated from the channel region by the additional dielectric layer. 8. A structure comprising: a first dielectric layer on a sensing element; a second dielectric layer on the first dielectric layer; a third dielectric layer on the second dielectric layer; a fourth dielectric layer on the third dielectric layer, wherein a cavity has a first section within the first dielectric layer between the sensing element and the second dielectric layer, a second section in the third dielectric layer between the second dielectric layer and the fourth dielectric layer and a connecting duct extending through the third dielectric layer from the first section to the second section; a fifth dielectric layer on the fourth dielectric layer; a first interconnect on the sensing element; and a second interconnect on the first interconnect, wherein the first interconnect extends from the sensing element through the first dielectric layer to the second interconnect, wherein the second interconnect extends from the first interconnect through the second dielectric layer and the third dielectric layer to the fourth dielectric layer, and wherein a port extends from the second section of the cavity at least through the fourth dielectric layer and the fifth dielectric layer. 9. The structure of claim 8 , wherein the port and the cavity enable a sample to flow toward the sensing element. 10. The structure of claim 8 , further comprising an additional dielectric layer between the sensing element and the first dielectric layer, wherein the first section of the cavity extends from the additional dielectric layer to the second dielectric layer. 11. The structure of claim 8 , wherein the first section of the cavity extends from the sensing element to the second dielectric layer. 12. The structure of claim 8 , further comprising a dielectric liner lining at least a bottom of the cavity. 13. The structure of claim 8 , wherein the sensing element comprises any of a photodetector or a semiconductor region of a field effect transistor. 14. A structure comprising: a first dielectric layer on a sensing element; a second dielectric layer on the first dielectric layer; a third dielectric layer on the second dielectric layer, wherein a cavity is within the first dielectric layer and the second dielectric layer between the sensing element and the third dielectric layer; a fourth dielectric layer on the third dielectric layer; a first interconnect on the sensing element; and a second interconnect on the first interconnect, wherein the first interconnect extends from the sensing element through the first dielectric layer to the second interconnect, wherein the second interconnect extends from the first interconnect through the second dielectric layer to the third dielectric layer, and wherein a port extends from the cavity at least through the third dielectric layer and the fourth dielectric layer. 15. The structure of claim 14 , wherein the port and the cavity enable a sample to flow toward the sensing element. 16. The structure of claim 14 , further comprising an additional dielectric layer between the sensing element and the first dielectric layer, wherein the cavity extends from the additional dielectric layer to the third dielectric layer. 17. The structure of claim 14 , wherein the cavity extends from the sensing element to the third dielectric layer. 18. The structure of claim 14 , further comprising a dielectric liner lining at least a bottom of the cavity. 19. The structure of claim 14 , wherein the sensing element comprises a photodetector and wherein the sample is illuminable within the cavity. 20. The structure of claim 14 , wherein the sensing element comprises a semiconductor region of a field effect transistor, wherein the semiconductor region comprises source/drain regions and a channel region between the source/drain regions, wherein the cavity is adjacent to the channel region, and wherein the field effect transistor further comprises a gate structure comprising: an additional dielectric layer; and the sample within the cavity, wherein the sample is biasable and separated from the channel region by the additional dielectric layer.

Assignees

Inventors

Classifications

  • Flow-through cuvettes (G01N21/09 takes precedence; handling fluid samples G01N1/10) · CPC title

  • Integrated biosensor, microarrays · CPC title

  • Electrodes · CPC title

  • Additional chamber, reservoir · CPC title

  • characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces · CPC title

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What does patent US12411105B2 cover?
A structure includes a lab-on-chip (LOC) sensor and frontside port and cavity features for conveying a flowable sample (fluid or gas) to a sensing element of the sensor. The cavity is confined within middle of the line (MOL) dielectric layer(s). Alternatively, the cavity includes a lower section within MOL dielectric layer(s), an upper section within back end of the line (BEOL) dielectric layer…
Who is the assignee on this patent?
Globalfoundries Us Inc
What technology area does this patent fall under?
Primary CPC classification G01N27/4145. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 09 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).