Adhesive composition, and coverlay film and printed circuit board that include the same

Patent metadata

Field	Value
Publication number	US-12410347-B2
Application number	US-202117910703-A
Country	US
Kind code	B2
Filing date	Mar 12, 2021
Priority date	Mar 12, 2020
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.

First claim

The invention claimed is:

1. An adhesive composition, comprising:
(a) an epoxy resin; and
(b) a binder resin including an epoxidized polybutadiene rubber and two or more species of rubber,
wherein the two or more species of rubber comprise an acrylonitrile butadiene rubber (NBR) and an acrylic rubber.

2. The adhesive composition of claim 1 , wherein the epoxidized polybutadiene comprises repeat units represented by the following Chemical Formulas 1 to 3:

3. The adhesive composition of claim 1 , wherein the epoxidized polybutadiene rubber is a rubber represented by the following Chemical Formula 4:

(wherein,
l is an integer of 1-500,
m is an integer of 1-500,
n is an integer of 1-500, and
R1 and R2 are same or different from each other and each are independently selected from the group consisting of hydrogen and a C 1 -C 12 alkyl.

4. The adhesive composition of claim 1 , wherein the binder resin comprises the epoxidized polybutadiene rubber and the two or more species of rubber at a weight ratio of 1:2-15.

5. The adhesive composition of claim 1 , wherein the binder resin comprises the epoxidized polybutadiene rubber, the acrylonitrile butadiene rubber, and the acrylic rubber at a weight ratio of 1:1-8:0.5-5.

6. The adhesive composition of claim 1 , wherein a cured substance formed from the adhesive composition has an elongation of 0.1 to 1% as measured by according to ASTM D1204.

7. The adhesive composition of claim 1 , wherein a cured substance formed from the adhesive composition ranges in minimum viscosity from 1,000 to 10,000 cPs at 150-200° C.

8. The adhesive composition of claim 7 , wherein the cured substance formed from the adhesive composition satisfies the following Relation Formula 1:

3
<

T
1

T
2

<
5

[

Relation
⁢

Formula
⁢

1

]

wherein,
T 1 stands for a time taken for reference adhesive composition A to fill in between patterns on a printed circuit board upon hot pressing a cured substance formed from the reference adhesive composition A against the printed circuit board at 180° C. under a pressure of 8800 LB; and
T 2 stands for a time taken for a subject adhesive composition to fill in between circuit patterns on a printed circuit board upon hot pressing a cured substance formed from the subject adhesive composition against the printed circuit board at 180° C. under a pressure of 8800 LB, wherein the subject adhesive composition comprises (a) an epoxy resin, and a binder resin including an epoxidized polybutadiene rubber and two or more species of rubber, said two or more species of rubber comprising an acrylonitrile butadiene rubber (NBR) and an acrylic rubber;
wherein the reference adhesive composition A is identical to the subject adhesive composition of, with the exception of lacking the epoxidized polybutadiene rubber, and
wherein the circuit patterns on the printed circuit board have a thickness of 35 μm and a width of 100 μm, with a 100 μm spacing between adjacent circuit patterns.

9. A coverlay film, comprising:
a base substrate;
an adhesive layer formed of the adhesive composition of claim 1 on the one surface of the base substrate; and
a release substrate disposed on the adhesive layer,
wherein the adhesive composition comprises:
(a) an epoxy resin; and
(b) a binder resin including an epoxidized polybutadiene rubber and two or more species of rubber,
wherein the two or more species of rubber comprise an acrylonitrile butadiene rubber (NBR) and an acrylic rubber.

10. The coverlay film of claim 9 , wherein the base substrate is a thermoplastic polymer film having a melting point of 300° C. or less.

11. A printed circuit board, comprising:
a board body; and
the coverlay film of claim 9 , disposed on at least one surface of the board body.

12. The coverlay film of claim 9 , wherein the epoxidized polybutadiene comprises repeat units represented by the following Chemical Formulas 1 to 3:

13. The coverlay film of claim 9 , wherein the epoxidized polybutadiene rubber is a rubber represented by the following Chemical Formula 4:

wherein,
l is an integer of 1-500,
m is an integer of 1-500,
n is an integer of 1-500, and
R1 and R2 are same or different and each are independently selected from the group consisting of hydrogen and a C 1 -C 12 alkyl.

14. The coverlay film of claim 9 , wherein the binder resin comprises the epoxidized polybutadiene rubber and the two or more species of rubber at a weight ratio of 1:2-15.

15. The coverlay film of claim 9 , wherein the binder resin comprises the epoxidized polybutadiene rubber, the acrylonitrile butadiene rubber, and the acrylic rubber at a weight ratio of 1:1-8:0.5-5.

16. The coverlay film of claim 9 , wherein a cured substance formed from the adhesive composition has an elongation of 0.1 to 1% as measured by according to ASTM D1204.

17. The coverlay film of claim 9 , wherein a cured substance formed from the adhesive composition ranges in minimum viscosity from 1,000 to 10,000 cPs at 150-200° C.

18. The coverlay film of claim 17 , wherein the cured substance formed from the adhesive composition satisfies the following Relation Formula 1:

3
<

T
1

T
2

<
5

[

Relation
⁢

Formula
⁢

1

]

wherein,
T 1 stands for a time taken for a reference adhesive composition A to fill in between patterns on a printed circuit board upon hot pressing a c

Assignees

• Doosan Corp

Inventors

• Park Kwangseok
• Ryu Euidock
• Jeong Inki
• Park Subyung
• Chae Dongho

Classifications

• H05K3/281

  by means of a preformed insulating foil (H05K3/284 takes precedence) · CPC title

• C09J109/02

  Copolymers with acrylonitrile · CPC title

• C09J7/30

  characterised by the adhesive composition · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J2301/312

  parameters being the characterizing feature · CPC title