Adhesive composition, and coverlay film and printed circuit board that include the same
US-12410347-B2 · Sep 9, 2025 · US
Park Kwangseok is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Park Kwangseok |
| Total patents | 9 |
| First publication | Mar 18, 2021 |
| Latest publication | Sep 9, 2025 |
Publications ranked by popularity score, then publication date.
US-12410347-B2 · Sep 9, 2025 · US
US-12274009-B2 · Apr 8, 2025 · US
US-11773568-B2 · Oct 3, 2023 · US
US-2023135423-A1 · May 4, 2023 · US
US-2023049939-A1 · Feb 16, 2023 · US
US-2022251433-A1 · Aug 11, 2022 · US
US-2021362737-A1 · Nov 25, 2021 · US
US-2021223400-A1 · Jul 22, 2021 · US
US-2021079623-A1 · Mar 18, 2021 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Doosan Corp | 5 |
| Doosan Infracore Co Ltd | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K3/281 | 5 |
| H05K3/285 | 4 |
| E02F9/2004 | 3 |
| C09J2301/312 | 3 |
| C09J7/30 | 3 |