Tunable system and method for stress resolution in additive manufacturing

US12409609B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12409609-B2
Application numberUS-202318449027-A
CountryUS
Kind codeB2
Filing dateAug 14, 2023
Priority dateMay 12, 2020
Publication dateSep 9, 2025
Grant dateSep 9, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Systems and methods resolve stresses in additive manufacturing. A stress resolution profile including frequency and amplitude parameters of an ultrasonic input are determined based on physical properties of the product. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. An ultrasonic input is applied with the determined parameters to resolve stress as the product is built up. The ultrasonic input is varied as a depth of the material incorporated into the product increases.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for stress relief in forming a product by additive manufacturing, the system comprising: a build surface; a stress relief system including a transducer coupled with the build surface, the transducer configured to generate a frequency and a power so the stress relief system is configured to deliver stress relief energy to the build surface; a material delivery system configured to add successive layers of a material to build the product on the build surface; an energy system configured to add build energy to incorporate the material of each of the successive layers into the product; and at least one controller configured to: coordinate operation of the stress relief system, the material delivery system and the energy system to complete the build of the product; determine stress relief parameters throughout the build of the product, where the stress relief parameters include frequency and amplitude parameters and are at least one of predetermined or based on input from at least one sensor; determine, by a processor of the at least one controller and based on the stress relief parameters, where, during the build of the product, stress relief is required based on where a deviation from design parameters of the product is indicated as incipient or actual; and apply, by the transducer of the stress relief system and when the processor has determined that the stress relief is required, an input to the stress relief system with a power level tailored to relieve stress according to the stress relief parameters as determined by the at least one controller. 2. The system of claim 1 , wherein the transducer comprises an ultrasonic transducer, wherein the at least one controller is configured to deliver, via the ultrasonic transducer of the stress relief system, a customized stress relief treatment of the product based on measurement data from the at least one sensor showing where and to what degree the product is deforming, or is about to deform, as an external indication of internal stresses. 3. The system of claim 1 , wherein the at least one controller is configured to define and to optimize the build of the product, and is configured to make automated adjustments to the stress relief parameters when distortion measured by the at least one sensor exceeds set limits. 4. The system of claim 1 , wherein the at least one controller is configured to determine whether there is overlap between resonant frequencies of the product in its current configuration and the frequency of the stress relief parameters and to avoid the resonant frequencies. 5. The system of claim 1 , wherein the at least one controller is configured to automatically generate the stress relief parameters for a new product, and is configured to aggregate data from the at least one sensor and iteratively process the data against the stress relief parameters and other parameters of a new part to be printed to automatically determine an optimal stress relief parameter set for the new part. 6. The system of claim 1 , wherein the stress relief parameters are based on input from the at least one sensor and the design parameters comprise design dimensions of the product. 7. The system of claim 1 , wherein the stress relief parameters are defined by a profile, wherein the at least one controller is configured to access the profile for each individual layer of the successive layers, and to apply the input only when the profile indicates the deviation from design parameters exists. 8. The system of claim 1 , wherein the build surface is configured to support a powder bed and comprising a cover configured to cover the powder bed during the apply of the input by the stress relief system. 9. The system of claim 1 , wherein the transducer comprises an ultrasonic transducer, configured to apply the input to the stress relief system. 10. The system of claim 1 , wherein the at least one controller comprises a plural number of controllers configured to: collect data from the at least one sensor; transmit the data; create customized stress relief treatments based on the data to automatically determine optimal stress relief parameters; and effect, through the stress relief system, the stress relief of internal stresses during the build of the product. 11. A system for stress relief in forming a product by additive manufacturing, the system comprising: a build surface; a stress relief system including an ultrasonic transducer coupled with the build surface, the stress relief system configured to deliver stress relief energy to the build surface; a material delivery system configured to add successive layers of a material to build the product on the build surface; an energy system configured to add build energy to incorporate the material of each of the successive layers into the product; and at least one controller configured to: coordinate operation of the stress relief system, the material delivery system and the energy system to complete the build of the product; determine stress relief parameters throughout the build of the product to define a profile, where the stress relief parameters include frequency and amplitude parameters and are at least one of predetermined or based on input from at least one sensor; determine, by a processor of the at least one controller and based on the stress relief parameters, where, during the build of the product, stress relief is required based on where a deviation from design parameters of the product is indicated as incipient or actual; and apply, by the ultrasonic transducer of the stress relief system and only when the at least one controller has determined that the stress relief is required, an input to the stress relief system with a power level according to the profile that is tailored to relieve stress according to the stress relief parameters as determined by the at least one controller.

Assignees

Inventors

Classifications

  • pulsed; frequency modulated · CPC title

  • Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

  • Process efficiency · CPC title

  • for measuring the deformation in a solid, e.g. by vibrating string · CPC title

  • for measuring contours or curvatures, e.g. determining profile · CPC title

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What does patent US12409609B2 cover?
Systems and methods resolve stresses in additive manufacturing. A stress resolution profile including frequency and amplitude parameters of an ultrasonic input are determined based on physical properties of the product. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. An ultrasonic input is applied with the determined pa…
Who is the assignee on this patent?
Honeywell Int Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/393. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 09 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).