Tunable system and method for stress resolution in additive manufacturing

Patent metadata

Field	Value
Publication number	US-11772330-B2
Application number	US-202016872618-A
Country	US
Kind code	B2
Filing date	May 12, 2020
Priority date	May 12, 2020
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

Prior to manufacturing a product by additive manufacturing, a stress relief profile including frequency and amplitude parameters of an ultrasonic input is determined based on physical properties of the product, including resonant frequencies of the product and a material from which the product is manufactured. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. A processor accesses stress relief profile parameters for each layer, determines whether a layer requires stress relief and determines a frequency and a power level for the stress relief at the layer. An ultrasonic input is applied with the determined parameters to relieve stress as the product is built up.

First claim

What is claimed is:

1. A method of stress relief in forming a product by additive manufacturing, the method comprising:
determining, prior to manufacturing the product, stress relief profile parameters of an ultrasonic input based on physical properties of the product, including resonant frequencies of the product and a material from which the product is manufactured;
adding successive layers of the material to build the product;
adding energy to incorporate the material of each layer into the product;
accessing, by a processor from a storage device, the stress relief profile parameters for each layer;
determining, by the processor and based on the stress relief profile parameters, whether at an individual layer of the successive layers during the build of the product, stress relief is required;
determining, by the processor and based on the stress relief profile parameters and sensor input on the product being built, a frequency and a power level for the stress relief at the individual layer; and
applying, by an ultrasonic transducer, the ultrasonic input with the frequency and the power level to relieve stress as the product is built up.

2. The method of claim 1 , wherein the determined stress relief profile parameters include a determined frequency of the ultrasonic input and comprising:
evaluating, after determining the frequency and the power level and prior to applying the ultrasonic input, whether the frequency corresponds to a resonant frequency of the product; and
modifying, prior to applying the ultrasonic input, the determined parameters when the determined frequency corresponds to a resonant frequency.

3. The method of claim 1 , comprising tuning the ultrasonic input to each individual layer throughout the build of the product by exciting the ultrasonic transducer to relieve stresses while avoiding the resonant frequencies of the product.

4. The method of claim 1 , comprising determining whether ultrasonic input is needed for each individual layer of the build, prior to applying the ultrasonic input.

5. The method of claim 4 , wherein determining whether ultrasonic input is needed comprises evaluating stored data for each individual layer of the build, wherein the stored data includes the frequency and the power level, and comprising determining the frequency and the power level based on physical dimensions of the product at the individual layer.

6. The method of claim 1 , comprising:
providing, by a sensor, the sensor input including on a physical disposition of the product; and
determining, by the processor, whether the sensor input indicates a deviation from design dimensions of the product,
wherein the applying the ultrasonic input is effected when the deviation exists.

7. The method of claim 1 , comprising:
determining resonant frequencies for the product at various stages of the build; and
avoiding the resonant frequency for the respective layer of the build when applying the ultrasonic input.

8. The method of claim 1 , comprising applying the ultrasonic input concurrent with adding energy to incorporate the material into the product.

9. The method of claim 1 , comprising:
building the product on a build platform;
sensing, by a position sensor, a location of the build platform; and
accessing, by the processor from a memory device and based on the location, the stress relief profile for a build state of the product at the location,
wherein the determining the frequency and the power level for the stress relief at the individual layer is based on the location.

10. The method of claim 1 , comprising:
collecting measurement data of the product during the build; and
storing the measurement data to provide customized stress relief treatment for build of the product.

11. A stress relief system for forming a product by additive manufacturing, the system comprising:
a build platform;
an ultrasonic transducer coupled with the build platform;
a material delivery system configured to add successive layers of a material to build the product;
a laser system configured to add energy to incorporate the material of each layer into the product; and
a controller configured to:
access stress relief profile parameters for each layer;
apply a signal to the ultrasonic transducer to produce an ultrasonic input having stress relief parameters to resolve stress as the product is built up, wherein the stress relief parameters are determined prior to manufacturing the product and are based on physical properties of the product include resonant frequencies of the product and a material from which the product is manufactured;
determine, based on the stress relief profile parameters, whether at an individual layer of the successive layers during the build of the product, stress relief is required;
determine, based on the stress relief profile parameters and sensor input on the product being built, a frequency and a power level for the stress relief at the individual layer; and
apply, through the ultrasonic transducer, the ultrasonic input with the frequency and the power level to relieve stress as the product is built up; and
vary the ultrasonic input as a depth of the material incorporated into the product increases.

12. The system of claim 11 , wherein:
the parameters include a determined frequency of the ultrasonic input; and
the controller is configured to:
evaluate whether the determined frequency corresponds to a resonant frequency of the product, and
modify the determined parameters when the determined frequency corresponds to a resonant frequency.

13. The system of claim 11 , wherein the parameters include a determined frequency of the ultrasonic input and a determined amplitude of the ultrasonic input, and wherein the controller is configured to tune the ultrasonic input to each individual layer throughout the build of the product.

14. The system of claim 11 , wherein the controller is configured to determine whether ultrasonic input is needed for each individual layer of the build, prior to applying the ultrasonic input.

15. The system of claim 14 , wherein the controller is configured to determine whether ultrasonic input is needed by evaluating stored data for each individual layer of the build.

16. The system of claim 14 , comprising a sensor configured to detect distortion of the product; and wherein the controller is configured to determine whether ultrasonic input is needed by monitoring the sensor.

17. The system of claim 11 , wherein the controller is configured to avoid a resonant frequency for the layer of the build when applying the ultrasonic input.

18. The system of claim 11 , wherein the controller is configured to apply the ultrasonic input concurrent with adding energy to incorporate the material into the product.

19. The system of claim 11 , wherein the controller is configured to:
collect measurement data of the product during the build; and
store the measurement data to provide customized stress relief treatment for build of the product.

20. A method of stress relief in forming a product by additive manufacturing, the method comprising:
determining, prior to manufacturing the product, stress relief profile parameters of an ultrasonic input based on physical properties of the product, including resonant frequencies of the product and a material from which the product is manufactured;
adding, by a material delivery system, successive layers of the material to build the product;
adding energy by a laser system to incorporate the material of eac

Assignees

• Honeywell Int Inc

Inventors

• Bowler John
• Colvin Gregory
• Sundarraj Suresh

Classifications

• B29C64/393 Primary

  for controlling or regulating additive manufacturing processes · CPC title

• B29C64/245

  Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

• B29C64/273

  pulsed; frequency modulated · CPC title

• B22F10/20 Primary

  Direct sintering or melting · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title