Semiconductor device, busbar, and power converter

Patent metadata

Field	Value
Publication number	US-12407269-B2
Application number	US-202117924569-A
Country	US
Kind code	B2
Filing date	Jan 22, 2021
Priority date	May 13, 2020
Publication date	Sep 2, 2025
Grant date	Sep 2, 2025

Abstract

Provided are a semiconductor device, a busbar, and a power converter that can suppress an increase in the size of the device and in inductance while ensuring insulation performance between terminals. For example, a semiconductor device 1 includes a first terminal 110 projecting from a sealing body 100 along a given direction, and a second terminal 120 adjacent to the first terminal 110 with a space formed between the second terminal 120 and the first terminal 110 , the second terminal 120 projecting from the sealing body 100 along a given direction in a direction of projection that is the same as a direction of projection of the first terminal 110 . The first terminal 110 has a first exposed part 112 exposed outside the sealing body 100 . The second terminal 120 has a second sheathed part 121 projecting from the sealing body 100 , the second sheathed part 121 being sheathed with an insulating material, and a second exposed part 122 projecting from the second sheathed part 121 , the second exposed part 122 being exposed outside the sealing body 100 . A distance D2 along a given direction from a front end 121 a of the second sheathed part 121 to the sealing body 100 is longer than a distance D1 along the given direction from a front end 112 a of the first exposed part 112 to the sealing body 100.

First claim

The invention claimed is:

1. A power converter comprising:
a semiconductor device; and
a busbar connected to the semiconductor device,
wherein the semiconductor device includes:
a sealing body in which a semiconductor element is resin-sealed;
a first terminal connected to the semiconductor element, the first terminal projecting from the sealing body along a given direction; and
a second terminal connected to the semiconductor element, the second terminal being adjacent to the first terminal with a space formed between the second terminal and the first terminal and projecting from the sealing body along the given direction in a direction of projection that is the same as a direction of projection of the first terminal,

wherein the first terminal has a first exposed part that extends in the given direction and that is exposed outside the sealing body,
wherein the second terminal has a sheathed part projecting from the sealing body, the sheathed part extending in the given direction and being sheathed with an insulating material, and a second exposed part projecting from the sheathed part, the second exposed part extending in the given direction and being exposed outside the sealing body,
wherein a distance along the given direction from a front end of the sheathed part to the sealing body is longer than a distance along the given direction from a front end of the first exposed part to the sealing body,
wherein a busbar includes:
a molded body in which a first conductor plate and a second conductor plate are resin-sealed;
a busbar first terminal connected to the first conductor plate, the busbar first terminal projecting from the molded body along a specific direction; and
a busbar second terminal connected to the second conductor plate, the busbar second terminal being adjacent to the busbar first terminal with a space formed between the busbar second terminal and the busbar first terminal and projecting from the molded body along the specific direction in a direction of projection that is the same as a direction of projection of the busbar first terminal,

wherein the busbar first terminal has a busbar first exposed part that extends in the specific direction and that is exposed outside the molded body,
wherein the busbar second terminal has a busbar sheathed part projecting from the molded body, the busbar sheathed part extending in the specific direction and being sheathed with a sheathing material with an insulation property, and a busbar second exposed part projecting from the busbar sheathed part, the busbar second exposed part extending in the specific direction and being exposed outside the molded body, and
wherein a distance along the specific direction from a front end of the busbar sheathed part to the molded body is longer than a distance along the specific direction from a front end of the busbar first exposed part to the molded body.

2. The power converter according to claim 1 ,
wherein the semiconductor device and the busbar are set in a position in which:
the given direction and the specific direction are the same direction; and
the first terminal is counter to the busbar second terminal, the second terminal is counter to the busbar first terminal, and a direction of the first terminal and the second terminal is opposite to a direction of the busbar first terminal and the busbar second terminal, and

wherein the first exposed part is connected to the busbar second exposed part and the second exposed part is connected to the busbar first exposed part.

3. The power converter according to claim 1 ,
wherein the semiconductor device and the busbar are set in a position in which:
the given direction and the specific direction are the same direction; and
the first terminal is counter to the busbar first terminal, the second terminal is counter to the busbar second terminal, and a direction of the first terminal and the second terminal is the same as a direction of the busbar first terminal and the busbar second terminal, and

wherein the first exposed part is connected to the busbar first exposed part and the second exposed part is connected to the busbar second exposed part.

4. The power converter according to claim 2 , wherein in the semiconductor device and the busbar, a sum of the distance along the given direction from the front end of the first exposed part to the sealing body and the distance along the specific direction from the front end of the busbar second exposed part to the molded body is equal to a sum of the distance along the given direction from the front end of the second exposed part to the sealing body and the distance along the specific direction from the front end of the busbar first exposed part to the molded body.

5. The power converter according to claim 3 ,
wherein the molded body includes:
the first conductor plate and the second conductor plate that are disposed counter to each other across an insulating layer interposed between the first conductor plate and the second conductor plate; and
a main surface extending along the first conductor plate and the second conductor plate,

wherein the molded body is set in a position in which a direction along the main surface intersects the given direction and the specific direction,
wherein in the busbar first terminal, the busbar first exposed part projects from a side surface of the molded body, the side surface intersecting the direction along the main surface, in such a way as to project beyond the main surface closer to the second conductor plate than to the first conductor plate,
wherein in the busbar second terminal, the busbar sheathed part projects from the main surface beyond which the busbar first exposed part projects out, in such a way as to project beyond the front end of the busbar first exposed part in a direction of going away from the main surface, and
wherein the busbar second exposed part has a bent part bent in a direction of heading from the front end of the busbar sheathed part toward the side surface along the main surface, and projects from a front end of the bent part in a direction of going away from the front end of the busbar first exposed part.

Assignees

• Hitachi Astemo Ltd

Inventors

• Kusukawa Junpei
• Mochizuki Masahito
• Ide Eiichi

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/136

  having other interconnections perpendicular to the conductive base · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title