Inductor component

US12406791B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12406791-B2
Application numberUS-202117174202-A
CountryUS
Kind codeB2
Filing dateFeb 11, 2021
Priority dateFeb 26, 2020
Publication dateSep 2, 2025
Grant dateSep 2, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The inductor component includes a first magnetic layer, an inductor wiring line laminated on a main face of the first magnetic layer, a second magnetic layer disposed in the same layer as the inductor wiring line, a third magnetic layer disposed on a main face of the inductor wiring line and the second magnetic layer on a side opposite to the first magnetic layer, and an insulation layer being a non-magnetic material in contact with part of a surface of the inductor wiring line. The entire face of the surface of the inductor wiring line on the first magnetic layer side is in contact with the first magnetic layer, and a face of the surface of the inductor wiring line on the second magnetic layer side is in contact with the insulation layer.

First claim

Opening claim text (preview).

What is claimed is: 1. An inductor component, comprising: a first magnetic layer; an inductor wiring line laminated on a main face of the first magnetic layer; a second magnetic layer disposed in a layer same as the inductor wiring line; a third magnetic layer disposed on a main face of the inductor wiring line and the second magnetic layer on a side opposite to the first magnetic layer; and an insulation layer being a non-magnetic material in contact with part of a surface of the inductor wiring line, wherein, an entire face of the surface of the inductor wiring line on the main face of the first magnetic layer is in physical contact with the first magnetic layer, and a face of the surface of the inductor wiring line on a side of the second magnetic layer is in contact with the insulation layer. 2. The inductor component according to claim 1 , wherein a face of the surface of the inductor wiring line on a side of the third magnetic layer is in contact with the insulation layer. 3. The inductor component according to claim 1 , wherein part of the surface of the inductor wiring line is exposed from the insulation layer and is in contact with the second magnetic layer. 4. The inductor component according to claim 1 , wherein the inductor wiring line is wound more than 1.0 turns in the layer in which the inductor wiring line is disposed. 5. The inductor component according to claim 4 , wherein the insulation layer is interposed in a portion where a distance between wiring lines in the inductor wiring line is minimum in the layer in which the inductor wiring line is disposed. 6. The inductor component according to claim 1 , further comprising: a vertical wiring line being connected to the inductor wiring line and penetrating through the third magnetic layer from a main face on a side of the inductor wiring line toward a main face on a side opposite to a side of the inductor wiring line, wherein a face of a surface of the vertical wiring line on a side of the third magnetic layer is in contact with the insulation layer. 7. The inductor component according to claim 1 , wherein the insulation layer includes at least one resin among epoxy-based resin, phenol-based resin, acrylic-based resin, polyimide-based resin, or liquid crystal polymer-based resin. 8. The inductor component according to claim 1 , wherein the insulation layer contains an inorganic filler having an average particle size equal to or less than 1.0 μm. 9. The inductor component according to claim 1 , wherein the inductor wiring line has a laminated structure including a first wiring line layer on the main face of the first magnetic layer and a second wiring line layer laminated on a surface of the first wiring line layer on a side of the third magnetic layer, and part of the second wiring line layer extends to an inside of a layer in which the first wiring line layer is disposed, and is interposed between the first wiring line layer and the second magnetic layer. 10. The inductor component according to claim 9 , wherein the inductor wiring line includes a catalyst layer containing at least one or more metals among palladium, platinum, silver, or gold, and the catalyst layer is disposed on the first wiring line layer on the main face of the first magnetic layer. 11. The inductor component according to claim 9 , wherein a material of the first wiring line layer has a copper ratio equal to or less than 99 wt %, and a nickel ratio equal to or larger than 0.1 wt %. 12. The inductor component according to claim 9 , wherein a material of the first wiring line layer has a nickel ratio equal to or less than 99 wt %, and a phosphorus ratio from 0.5 wt % to 10 wt %. 13. The inductor component according to claim 9 , wherein the inductor wiring line has a thickness from 40 μm to 120 μm, and the first wiring line layer has a thickness from 0.3 μm to 10 μm. 14. The inductor component according to claim 1 , further comprising: a vertical wiring line being connected to the inductor wiring line and penetrating through the third magnetic layer from a main face on a side of the inductor wiring line toward a main face on a side opposite to a side of the inductor wiring line, wherein a covering layer formed of an insulation material is laminated on the main face of the third magnetic layer on a side opposite to the inductor wiring line, a face of the vertical wiring line on a side opposite to the inductor wiring line is not covered by the covering layer, and an outer electrode is connected to a portion in the vertical wiring line being exposed from the covering layer. 15. The inductor component according to claim 1 , wherein when the inductor wiring line is denoted as a first inductor wiring line and the insulation layer is denoted as a first insulation layer, the inductor component further comprises: a second inductor wiring line disposed on a main face of the third magnetic layer on a side opposite to the first inductor wiring line; a fourth magnetic layer disposed in a layer same as the second inductor wiring line; a fifth magnetic layer disposed on the second inductor wiring line and the fourth magnetic layer on a side opposite to the first inductor wiring line; and a second insulation layer being a non-magnetic material in contact with part of a surface of the second inductor wiring line, wherein a face of the first inductor wiring line on a side of the third magnetic layer is in contact with the first insulation layer, a face of a surface of the second inductor wiring line on a side of the first inductor wiring line is in contact with the first insulation layer, and a face of the surface of the second inductor wiring line on a side of the fourth magnetic layer is in contact with the second insulation layer. 16. The inductor component according to claim 15 , wherein the first insulation layer contains an inorganic filler, and the second insulation layer does not contain the inorganic filler. 17. The inductor component according to claim 16 , wherein the first inductor wiring line has a laminated structure including a first wiring line layer and a second wiring line layer laminated on a surface of the first wiring line layer on a side opposite to the first magnetic layer, the second inductor wiring line has a laminated structure including a third wiring line layer and a fourth wiring line layer laminated on a surface of the third wiring line layer on a side opposite to the third magnetic layer, a material of the first wiring line layer has a copper ratio equal to or less than 99 wt %, and a nickel ratio equal to or larger than 0.1 wt %, and a material of the third wiring line layer includes at least one of chromium or titanium. 18. The inductor component according to claim 16 , wherein the first inductor wiring line has a laminated structure including a first wiring line layer and a second wiring line layer laminated on a surface of the first wiring line layer on a side opposite to the first magnetic layer, the second inductor wiring line has a laminated structure including a third wiring line layer and a fourth wiring line layer laminated on a surface of the third wiring line layer on a side opposite to the third magnetic layer, part of the second wiring line layer extends to an inside of a layer in which the first wiring line layer is disposed, and is interposed between the first wiring line layer and the second magnetic layer, and the fourth wiring line layer is entirely laminated on a surface of the third wiring line layer on a side opp

Assignees

Inventors

Classifications

  • Insulation between coil and core, between different winding sections, around the coil; Other insulation structures · CPC title

  • with a magnetic layer · CPC title

  • Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

  • with magnetic core · CPC title

  • with encapsulating core, e.g. made of resin and magnetic powder · CPC title

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Frequently asked questions

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What does patent US12406791B2 cover?
The inductor component includes a first magnetic layer, an inductor wiring line laminated on a main face of the first magnetic layer, a second magnetic layer disposed in the same layer as the inductor wiring line, a third magnetic layer disposed on a main face of the inductor wiring line and the second magnetic layer on a side opposite to the first magnetic layer, and an insulation layer being …
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H01F17/0013. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).