Multilayer film and molded body provided with same

US12404425B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12404425-B2
Application numberUS-201917046486-A
CountryUS
Kind codeB2
Filing dateApr 12, 2019
Priority dateApr 13, 2018
Publication dateSep 2, 2025
Grant dateSep 2, 2025

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  5. First independent claim

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Abstract

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A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10 −2 or more.

First claim

Opening claim text (preview).

The invention claimed is: 1. A multilayer film comprising an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order therein, wherein the impact absorption layer (a) and the pressure sensitive adhesive layer (c) comprise a thermoplastic polymer composition which satisfies the following (a1): (a1) the thermoplastic polymer composition contains a thermoplastic elastomer (P) composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product of the polymer block (Y); wherein the impact absorption layer (a) and the pressure sensitive adhesive layer (c) contain a polypropylene-based resin (Q); wherein the impact absorption layer (a) has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10 −2 or more; and wherein the pressure sensitive adhesive layer (c) has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10 −2 to 2.4×10 −1 . 2. The multilayer film according to claim 1 , wherein the structural unit derived from the conjugated diene compound of the polymer block (Y) is a structural unit derived from at least one selected from butadiene and isoprene. 3. The multilayer film according to claim 1 , wherein a decorative layer (d) is in contact with the pressure sensitive adhesive layer (c) of the multilayer film. 4. The multilayer film according to claim 3 , wherein the decorative layer (d) is a transparent thermoplastic resin selected from any of a (meth)acrylic resin, an ABS resin, a polycarbonate-based resin, and a polyester-based resin. 5. The multilayer film according to claim 4 , wherein the decorative layer (d) is composed of a multilayer layer in which any of a metal vapor deposition layer and a printed layer is formed in a film of the transparent thermoplastic resin. 6. The multilayer film according to claim 4 , wherein the decorative layer (d) is composed of a multilayer layer in which the transparent thermoplastic resin contains one or both of a pigment and a dye. 7. The multilayer film according to claim 1 , wherein the multilayer film is a decorative film. 8. The multilayer film according to claim 1 , wherein the aromatic vinyl compound of the polymer block (X) includes a structural unit derived from α-methylstyrene. 9. The multilayer film according to claim 2 , wherein a proportion of the sum total of the 1,2-bond amount and the 3,4-bond amount relative to the whole bond amount in the conjugated diene of the polymer block (Y) is 40 to 90 mol %. 10. A molded body comprising the multilayer film according to claim 1 provided on the surface of an adherend. 11. The molded body according to claim 10 , wherein the adherend is composed of a polypropylene resin or an ABS resin. 12. A method for producing a multilayer film that is a method for producing the multilayer film according to claim 1 , the method comprising coextruding the impact absorption layer (a), the base material layer (b), and the pressure sensitive adhesive layer (c). 13. The method for producing a multilayer film according to claim 12 , wherein a silicone roll is used as a roll for nip molding. 14. A method for producing a multilayer film that is a method for producing the multilayer film according to claim 1 , the method comprising forming the pressure sensitive adhesive layer (c) through solvent coating or extrusion lamination method on the base material layer (b) of a film formed by coextrusion of the impact absorption layer (a) and the base material layer (b). 15. A method for producing a molded body, the method comprising: accommodating the multilayer film according to claim 1 and an adherend in a chamber box; reducing the pressure in the chamber box; dividing the inside of the arranging the multilayer film so as to divide the chamber box into two parts sealed from each other by the multilayer film, one of the two parts exposed to the adherend; and making the pressure within the part of the chamber box not exposed to the adherend higher than the pressure within the part of the chamber box exposed to the adherend, to cover the adherend with the multilayer film. 16. The method for producing a molded body according to claim 15 , further comprising heating the multilayer film to a range of 110 to 180° C. to soften it. 17. A method for producing a molded body, the method comprising: preliminarily molding the multilayer film according to claim 1 through vacuum molding; disposing the preliminarily molded multilayer film within a die such that the base material layer comes into contact with the die; and after closing the die, subjecting a thermoplastic resin forming an adherend to injecting molding.

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What does patent US12404425B2 cover?
A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed …
Who is the assignee on this patent?
Kuraray Co
What technology area does this patent fall under?
Primary CPC classification C09J7/29. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).