Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

Patent metadata

Field	Value
Publication number	US-12404386-B2
Application number	US-202318366753-A
Country	US
Kind code	B2
Filing date	Aug 8, 2023
Priority date	Dec 27, 2017
Publication date	Sep 2, 2025
Grant date	Sep 2, 2025

Abstract

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

First claim

What is claimed is:

1. An electronic device selected from a phone, tablet, laptop, or mouse comprising a housing or case that comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles; wherein the cured epoxy resin composition has a thermal conductivity of at least 1 W/m*K and is radio frequency transparent such that the cured epoxy resin composition has a dielectric loss tangent <0.03 ranging from 10 4 to 10 10 Hz.

2. The electronic device of claim 1 wherein the electronic device comprises a battery that can be charged through the enclosure.

3. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles comprise a material having an electronic band gap >0 eV.

4. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles comprise a material having a bulk thermal conductivity >10 W/m*K.

5. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate, and mixtures thereof.

6. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles have a median particle size of less than 20, 10, 5, or 1 micron.

7. The electronic device of claim 1 wherein the cured epoxy resin composition comprises an epoxy resin comprising cyclic moieties.

8. The electronic device of claim 1 wherein the cured epoxy resin composition comprises an epoxy resin comprising cycloaliphatic moieties.

9. The electronic device of claim 1 wherein the cured epoxy resin composition has a tensile strain at break ranging from 1 to 10%.

10. The electronic device of claim 1 wherein the cured epoxy resin composition has an elastic modulus ranging from 5 to 50 GPa.

11. The electronic device of claim 1 wherein the cured epoxy resin composition further comprises a dispersant.

12. The electronic device of claim 1 wherein the cured epoxy resin composition has a glass transition temperature of less than 125, or 100° C.

13. The electronic device of claim 1 wherein the cured epoxy resin composition has one or more of the following properties:
i) a single glass transition temperature;
ii) a tan delta peak width at half height of less than 50° C.;
iii) at least two glass transition temperatures.

14. The electronic device of claim 1 wherein the cured epoxy resin composition comprises 2 to 20 wt.-% of oligomeric or polymeric moieties having a glass transition temperature less than 0° C.

15. The electronic device of claim 14 wherein the oligomeric or polymeric moieties are covalently bonded to the cured epoxy resin.

16. The electronic device of claim 14 wherein the oligomeric or polymeric moieties comprise a cured epoxy-reactive oligomer having a weight average molecular weight ranging from 100-3000 g/mole.

17. The electronic device of claim 16 wherein the epoxy-reactive oligomer is hydroxyl terminated.

18. The electronic device of claim 16 wherein the oligomeric or polymeric moieties comprise polycaprolactone.

Assignees

• 3M Innovative Properties Company

Inventors

• Beiermann Brett A
• Clark John C
• Larson Eric G
• Higgins Jeremy M
• Forticaux Audrey S
• Lomeda Jay R
• Mahoney Wayne S
• Charles Scott B
• Fletcher Timothy D
• Thompson Wendy L
• Schwartz Kyle R

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08K2201/009

  Additives being defined by their hardness · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C08K2003/385

  Binary compounds of nitrogen with boron · CPC title

• C08K2003/2227

  of aluminium · CPC title