Substrate drying device and substrate drying method

Patent metadata

Field	Value
Publication number	US-12394639-B2
Application number	US-202217850309-A
Country	US
Kind code	B2
Filing date	Jun 27, 2022
Priority date	Jun 29, 2021
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

A substrate drying device is provided that can suppress occurrence of a micro size defect (for example, a defect having a defect size of 20 nm or less). A substrate drying device 1 includes a substrate holding unit 11 which holds a substrate W, a gas generator 60 which generates a drying gas G including at least IPA vapor and for drying the substrate W, and a drying gas nozzle 30 which supplies the drying gas G to the surface WA of the substrate W. A filter 67 for filtering the drying gas G is provided in the gas generator 60 . A defect size D allowed in a defect test after the drying of the substrate W is set to 20 nm or less and a ratio D/F of the defect size D and a filter size F of the filter 67 is set to 4 or more.

First claim

What is claimed is:

1. A substrate drying device comprising:
a substrate holding unit configured to hold a substrate;
a gas generator configured to generate a drying gas including at least IPA vapor, the drying gas is for drying the substrate; and
a drying gas nozzle configured to supply the drying gas to a surface of the substrate, wherein
the gas generator further comprising a filter for filtering the drying gas; and wherein
the filter has a filter size F that is set to enable the followings:
(1) a defect size D allowed in a defect test after the drying of the substrate is set to 20 nm or less, and
(2) 4 or more of a ratio of the defect size D over the filter size F.

Assignees

• Ebara Corp

Inventors

• Ishibashi Tomoatsu

Classifications

• H10P74/27

  Structural arrangements therefor · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0408 Primary

  for drying · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title