Matched tcr joule heater designs for electrostatic chucks

Patent metadata

Field	Value
Publication number	US-12387964-B2
Application number	US-202016921661-A
Country	US
Kind code	B2
Filing date	Jul 6, 2020
Priority date	Nov 23, 2015
Publication date	Aug 12, 2025
Grant date	Aug 12, 2025

Abstract

A method of forming a substrate support in a substrate processing system includes forming at least one ceramic layer and arranging a plurality of thermal elements adjacent to the ceramic layer in one or more thermal zones. Each of the thermal zones includes at least one of the thermal elements and each of the thermal elements includes a first resistive material having a positive thermal coefficient of resistance (TCR) and a second resistive material having a negative TCR. The second resistive material is electrically connected to the first resistive material. At least one of the first resistive material and the second resistive material of each of the thermal elements is electrically connected to a power supply to receive power and each of the thermal elements heats a respective one of the thermal zones based on the received power.

First claim

What is claimed is:

1. A method of forming a substrate support in a substrate processing system, the method comprising:
forming a first ceramic layer of green sheets;
forming a bus layer on the first ceramic layer, and forming first vias in the first ceramic layer to connect the bus layer to power supply and power return lines;
arranging a plurality of thermal elements on the first ceramic layer in one or more thermal zones, wherein each of the one or more thermal zones includes at least one of the plurality of thermal elements,
wherein each of the plurality of thermal elements includes
a first resistive material having a positive thermal coefficient of resistance (TCR), and
a second resistive material having a negative TCR, wherein the second resistive material is electrically connected to the first resistive material, and a dielectric layer is formed between the first resistive material and the second resistive material; and

forming a second ceramic layer of green sheets on the plurality of thermal elements, wherein a plurality of second vias are formed through the second resistive material and the dielectric layer to connect the bus layer to the first resistive material,
wherein at least one of the first resistive material and the second resistive material of each of the plurality of thermal elements is electrically connected to a power supply via an independent pair of the power supply and power return lines, to selectively receive power from the power supply independent of other ones of the plurality of thermal elements,
wherein, for each of the plurality of thermal elements, a corresponding one of multiple diodes is serially connected between the power supply line corresponding to the thermal element and the at least one of the first resistive material and the second resistive material, and
wherein each of the plurality of thermal elements heats a respective one of the one or more thermal zones based on the received power.

2. The method of claim 1 , wherein forming a heating layer including the plurality of thermal elements includes depositing a metallized layer on a surface of the first ceramic layer.

3. The method of claim 1 , wherein respective absolute values of the positive TCR and the negative TCR are equal.

4. The method claim 1 , wherein a sum of the positive TCR and the negative TCR is zero.

5. The method of claim 1 , further comprising connecting the first resistive material and the second resistive material in series.

6. The method of claim 1 , further comprising connecting the first resistive material and the second resistive material in parallel.

7. The method of claim 1 , further comprising arranging the first resistive material above the second resistive material.

8. The method of claim 7 , further comprising arranging the first resistive material directly above the second resistive material.

9. The method of claim 7 , further comprising laterally offsetting the first resistive material from the second resistive material.

10. The method claim 1 , further comprising arranging the first resistive material to be coplanar with the second resistive material.

11. The method of claim 10 , further comprising interweaving the first resistive material and the second resistive material.

12. The method of claim 11 , wherein the first resistive material and the second resistive material are interwoven to form at least one of an “S”-shape, a spiral shape, and a “U”-shape.

13. The method of claim 11 , wherein the first resistive material and the second resistive material include alternately interlocking fingers.

Assignees

• Lam Res Corp

Inventors

• Pape Eric A

Classifications

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/7624 Primary

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H05B2203/02

  Heaters using heating elements having a positive temperature coefficient · CPC title