Pattern forming method and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-12386265-B2
Application number	US-202418642711-A
Country	US
Kind code	B2
Filing date	Apr 22, 2024
Priority date	Mar 31, 2016
Publication date	Aug 12, 2025
Grant date	Aug 12, 2025

Abstract

A pattern forming method including forming a film using an actinic ray-sensitive or radiation-sensitive resin composition; exposing the formed film; and treating the exposed film using a treatment liquid for manufacturing a semiconductor. The treatment liquid for manufacturing a semiconductor includes a quaternary ammonium compound represented by the following Formula (N); at least one additive selected from the group consisting of an anionic surfactant, a nonionic surfactant, a cationic surfactant, and a chelating agent; and water. The treatment liquid for manufacturing a semiconductor includes one kind or two or more kinds of metal atoms selected from the group consisting of Na, K, Ca, Fe, Cu, Mg, Mn, Li, Al, Cr, Ni, and Zn. A total mass of the metal atoms is 1 mass ppt to 1 mass ppm with respect to the sum of a total mass of the additive and the total mass of the metal atoms.

First claim

What is claimed is:

1. A pattern forming method comprising:
forming a film using an actinic ray-sensitive or radiation-sensitive resin composition;
exposing the formed film; and
treating the exposed film using a treatment liquid for manufacturing a semiconductor, the treatment liquid for manufacturing a semiconductor comprising:
a quaternary ammonium compound represented by the following Formula (N);
at least one additive selected from the group consisting of an anionic surfactant, a nonionic surfactant, a cationic surfactant, and a chelating agent; and
water,
wherein the treatment liquid for manufacturing a semiconductor includes one kind or two or more kinds of metal atoms selected from the group consisting of Na, K, Ca, Fe, Cu, Mg, Mn, Li, Al, Cr, Ni, and Zn, and
a total mass of the metal atoms is 1 mass ppt to 1 mass ppm with respect to the sum of a total mass of the additive and the total mass of the metal atoms,

in Formula (N), R N1 to R N4 each independently represent an alkyl group, a phenyl group, a benzyl group, or a cyclohexyl group, and the alkyl group, the phenyl group, the benzyl group, or the cyclohexyl group may have a substituent.

2. The pattern forming method according to claim 1 , wherein the actinic ray-sensitive or radiation-sensitive resin composition is a positive type resist composition.

3. The pattern forming method according to claim 1 , wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises a resin, the resin comprises a repeating unit having a group which is decomposed by the action of an acid to produce a carboxyl group.

4. The pattern forming method according to claim 1 , wherein KrF excimer laser light, ArF excimer laser light, extreme ultraviolet light or an electron beam is used in the exposure step.

5. The pattern forming method according to claim 1 , wherein the exposure is immersion exposure.

6. The pattern forming method according to claim 1 , wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises a resin, the resin comprises a repeating unit having a lactone group.

7. The pattern forming method according to claim 6 , wherein the actinic ray-sensitive or radiation-sensitive resin composition further comprises a hydrophobic resin.

8. A method for manufacturing an electronic device comprising the pattern forming method according to claim 1 .

Assignees

• Fujifilm Corp

Inventors

• Kamimura Tetsuya
• Shimizu Tetsuya
• Murayama Satoru

Classifications

• H10P70/23

  during, before or after processing of insulating materials · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• G03F7/70925

  Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning · CPC title

• G03F7/322

  Aqueous alkaline compositions · CPC title

• G03F7/027 Primary

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title