Compact integrated device packages
US-10629574-B2 · Apr 21, 2020 · US
Three dimensional LED device and method of manufacture
US12385605B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12385605-B2 |
| Application number | US-202418800861-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2024 |
| Priority date | May 17, 2023 |
| Publication date | Aug 12, 2025 |
| Grant date | Aug 12, 2025 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of fabricating a light-emitting diode (LED) device, comprising: mounting a plurality of LED chips on a top surface of a plurality of submount portions of a submount, wherein the plurality of submount portions are coplanar with respect to a remainder of the submount; and inserting a punch through the submount between the plurality of submount portions, wherein in response to the inserting the punch, the plurality of submount portions are angled with respect to each other and to the remainder of the submount. 2. The method of claim 1 , further comprising scoring one or more edges of the plurality of submount portions prior to inserting the punch. 3. The method of claim 1 , wherein the plurality of LED chips are mounted on electrical traces that flex in response to the inserting the punch. 4. The method of claim 1 , further comprising: controlling a distance through which the punch is inserted through the submount based on a predetermined angle of the plurality of submount portions with respect to the remainder of the submount. 5. The method of claim 1 , further comprising: placing a heat sink between the plurality of submount portions, such that the heatsink is in contact with a surface of each submount portion of the plurality of submount portions. 6. The method of claim 1 , wherein the punch comprises a heatsink at a tip of the punch, and the method further comprises: detaching the heatsink from the punch, wherein the heatsink is in contact with, and connected to surfaces of the plurality of submount portions; and retracting the punch. 7. The method of claim 1 , wherein the inserting the punch comprises: inserting the punch through a bottom surface of the plurality of submount portions, causing a top surface of plurality of submount portions to be angled away from the punch. 8. The method of claim 1 , wherein the inserting the punch comprises: inserting the punch through a top surface of each of the plurality of submount portions, one at a time, causing a top surface of plurality of submount portions to be angled towards the punch. 9. The method of claim 1 , wherein each submount portion of the plurality of submount portions comprises a plurality of LED chips mounted thereon. 10. The method of claim 9 , wherein each LED chip of the plurality LED chips is configured to emit a different color light. 11. The method of claim 1 , wherein the plurality of submount portions are at least one of a triangular or quadrilateral shape.
Assignees
Inventors
Classifications
in direct thermal and mechanical contact of each other to form a single system · CPC title
forming a single encapsulated light source · CPC title
- F21K9/90Primary
Methods of manufacture · CPC title
Light-emitting diodes [LED] · CPC title
by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound · CPC title
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Frequently asked questions
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- What does patent US12385605B2 cover?
- Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to…
- Who is the assignee on this patent?
- Creeled Inc
- What technology area does this patent fall under?
- Primary CPC classification F21K9/90. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Aug 12 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).