Methods of producing bonded magnet and compound for bonded magnets

US12381023B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12381023-B2
Application numberUS-202217815792-A
CountryUS
Kind codeB2
Filing dateJul 28, 2022
Priority dateJan 22, 2018
Publication dateAug 5, 2025
Grant dateAug 5, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Included is a method of preparing a compound for bonded magnets, the method including: coating a magnetic material having an average particle size of 10 μm or less with a thermosetting resin and a curing agent at a ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin of 2 or higher and 10 or lower to obtain a coated material; granulating the coated material by compression to obtain a granulated product; milling the granulated product to obtain a milled product; and surface treating the milled product with a silane coupling agent to obtain a compound for bonded magnets, the method either including, between the granulation and the milling, heat curing the granulated product to obtain a cured product, or including, between the milling and the surface treatment, heat curing the milled product to obtain a cured product.

First claim

Opening claim text (preview).

What is claimed is: 1. A bonded magnet, comprising: a cured product formed from a thermosetting resin and a curing agent, a magnetic material having an average particle size of 10 μm or less, a Si element, and a thermoplastic resin, wherein there are gaps between the thermoplastic resin or the thermosetting resin, and the magnetic material, wherein the gaps allow the magnetic material to rotate, and wherein the amount of the thermoplastic resin with respect to 100 parts by weight of the magnetic material is in the range of 4.4 parts by weight or more and 7.00 parts by weight or lower. 2. The bonded magnet according to claim 1 , wherein the bonded magnet comprises the magnetic material at a filling ratio of 93% by weight or higher. 3. The bonded magnet according to claim 1 , wherein the bonded magnet has a magnetization rate of 98.5% or higher. 4. The bonded magnet according to claim 1 , wherein the magnetic material has a monodisperse particle size distribution. 5. The bonded magnet according to claim 1 , wherein the magnetic material contains Sm, Fe, and N. 6. The bonded magnet according to claim 1 , wherein the bonded magnet has a remanence of 0.83 Tesla or more. 7. The bonded magnet according to claim 1 , wherein the gaps are formed by cracks in the cured product. 8. The bonded magnet according to claim 1 , wherein the thermoplastic resin is at least one selected from the group consisting of polyolefins, polyesters, polycarbonates (PC), polyphenylene sulfide resins (PPS), polyether ether ketones (PEEK), polyacetals (POM), liquid crystal polymers (LCP), polylactams, condensates of dicarboxylic acids and diamines, polyamide copolymers, and amorphous nylons. 9. The bonded magnet according to claim 1 , wherein the thermoplastic resin is nylon 12.

Assignees

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Classifications

  • Agglomerating · CPC title

  • characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

  • Metallic powder coated with organic material · CPC title

  • Aspects linked to processes or compositions used in powder metallurgy · CPC title

  • Magnetic · CPC title

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What does patent US12381023B2 cover?
Included is a method of preparing a compound for bonded magnets, the method including: coating a magnetic material having an average particle size of 10 μm or less with a thermosetting resin and a curing agent at a ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin of 2 or higher and 10 or lower to obtain a coated material; granulating the coa…
Who is the assignee on this patent?
Nichia Corp
What technology area does this patent fall under?
Primary CPC classification H01F1/059. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 05 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).