Electronic device including antenna

Patent metadata

Field	Value
Publication number	US-12374799-B2
Application number	US-202218054312-A
Country	US
Kind code	B2
Filing date	Nov 10, 2022
Priority date	Nov 22, 2021
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

According to various embodiment, an electronic device may include: a housing, a first substrate disposed in an inner space of the housing and including a first surface facing a first direction, a second surface facing a direction opposite to the first surface, and a first recess area at least partially corresponding to the first surface, a second substrate at least partially disposed in the first recess area of the first substrate, a third substrate at least partially disposed on one surface of the second substrate and including multiple antenna elements comprising at least one antenna, and a wireless communication circuit disposed on the second surface of the first substrate and electrically connected to the second substrate. The second substrate may include at least one matching circuit electrically connected to the wireless communication circuit corresponding to each of the multiple elements.

First claim

What is claimed is:

1. An electronic device comprising:
a housing;
a first substrate disposed in an inner space of the housing and comprising a first surface facing a first direction, a second surface facing a direction opposite to the first surface, and a first recess area at least partially corresponding to the first surface;
a second substrate at least partially disposed in the first recess area of the first substrate;
a third substrate at least partially disposed on one surface of the second substrate and comprising multiple antenna elements each comprising at least one antenna; and
a wireless communication circuit disposed on the second surface of the first substrate and electrically connected to the second substrate through at least one via included in the first substrate,
wherein the second substrate comprises a plurality of matching circuits electrically connected to the wireless communication circuit corresponding to each of the multiple antenna elements, and
wherein the first substrate comprises the first recess area for insertion of the second substrate such that the third substrate is closer to the wireless communication circuit than if the second substrate was disposed on the first substrate without the first recess area.

2. The electronic device of claim 1 , wherein the first substrate comprises the at least one via configured to electrically connect the second substrate and the wireless communication circuit.

3. The electronic device of claim 1 , wherein the first substrate comprises at least one stacked layer, and a layer included in a first group among the at least one layer comprises an opening corresponding to the first recess area.

4. The electronic device of claim 1 , wherein one end of each of the plurality of matching circuits included in the second substrate is electrically connected to the at least one antenna element included in the third substrate and another end of each of the plurality of matching circuits is electrically connected to the wireless communication circuit through the via included in the first substrate.

5. The electronic device of claim 4 , wherein the third substrate comprises at least one antenna element disposed at regular intervals and comprising an array antenna, based on the at least one antenna element.

6. The electronic device of claim 5 , wherein the third substrate comprises a first antenna structure on which a first antenna element is disposed and a second antenna structure on which a second antenna element is disposed, and comprises the array antenna, based on the first antenna element and the second antenna element.

7. The electronic device of claim 5 , wherein the third substrate is at least partially disposed on one of the first substrate and the second substrate.

8. The electronic device of claim 1 , wherein the second substrate is comprises a material having permittivity less than a permittivity of the first substrate or a transmission loss lower than a transmission loss of an electrical signal, and
wherein the third substrate has a dielectric constant (DK) value relatively larger than a DK of the first substrate and permittivity substantially the same as a permittivity of the second substrate.

9. The electronic device of claim 1 , wherein the number of the plurality of matching circuits is based on the number of antenna elements disposed on the third substrate, and
wherein each of the plurality of matching circuits comprises a conductive pattern.

10. An electronic device comprising:
a housing;
a first substrate disposed in an inner space of the housing and comprising a first surface facing a first direction, a second surface facing a direction opposite to the first surface, and a first recess area at least partially corresponding to the first surface, wherein the first recess area is positioned within a perimeter of the first substrate when viewed from a position orthogonal to a plane of the first substrate;
a second substrate at least partially disposed in the first recess area of the first substrate;
a third substrate at least partially disposed on one surface of the second substrate and comprising multiple antenna elements each comprising at least one antenna; and
a wireless communication circuit disposed on the second surface of the first substrate and electrically connected to the second substrate through at least one via included in the first substrate,
wherein the second substrate comprises a plurality of matching circuits electrically connected to the wireless communication circuit corresponding to each of the multiple antenna elements, and
wherein the first substrate comprises the first recess area for insertion of the second substrate such that the third substrate is closer to the wireless communication circuit than if the second substrate was disposed on the first substrate without the first recess area.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Cho Namjun
• Na Hyoseok
• Son Junghwan

Classifications

• H01Q1/422

  comprising two or more layers of dielectric material (H01Q1/425 takes precedence) · CPC title

• H01Q21/08

  the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)} · CPC title

• H01Q21/28

  Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title

• H01Q1/243

  with built-in antennas · CPC title

• H01Q9/285 Primary

  Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407) · CPC title