Substrate having embedded electronic component

Patent metadata

Field	Value
Publication number	US-10340234-B2
Application number	US-201715789021-A
Country	US
Kind code	B2
Filing date	Oct 20, 2017
Priority date	Mar 28, 2017
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.

First claim

What is claimed is:

1. A substrate having an electronic component, comprising:
a frame having a through hole with the electronic component disposed in the through hole;
a first wiring portion formed on a surface of the frame and the electronic component, comprising a wiring layer and a first insulating layer;
a first layer formed on the first wiring portion; and
a second wiring portion formed on the first layer, comprising an antenna layer,
wherein the first layer is formed of a first material different from a second material of the second wiring portion, and
wherein the first layer comprises a via connecting a pattern layer of the first wiring portion and the antenna layer of the second wiring portion.

2. The substrate having an electronic component of claim 1 , wherein the antenna layer comprises a plurality of layers.

3. The substrate having an electronic component of claim 1 , wherein the electronic component comprises an RF IC chip disposed in a central portion of the through hole, and a passive device is disposed around the RF IC chip.

4. The substrate having an electronic component of claim 1 , wherein the through hole is filled with a molding layer to fix the electronic component.

5. The substrate having an electronic component of claim 4 , wherein a connection electrode is provided in the molding layer, and configured to form an external electrical connection.

6. The substrate having an electronic component of claim 1 , wherein an inner surface of the frame is provided with a conductor layer.

7. The substrate having an electronic component of claim 1 , wherein a via is formed in the frame to provide external electrical connection.

8. The substrate having an electronic component of claim 1 , wherein the antenna layer comprises a main antenna layer connected to the electronic component, and a dummy antenna layer disposed above the main antenna layer.

9. The substrate having an electronic component of claim 1 , further comprising:
a second insulating layer formed on another surface of the frame and the electronic component.

10. The substrate having an electronic component of claim 9 , wherein an electrode pad extends externally out of the second insulating layer.

11. The substrate having an electronic component of claim 10 , wherein the electrode pad is connected to the electronic component through a via member.

12. The substrate having an electronic component of claim 1 , wherein the antenna layer has any one or any combination of a spiral shape, a circular shape, an elliptical shape, a quadrangular spiral shape, a quadrangular shape, an elliptical spiral shape, a hexagonal shape, a hexagonal spiral shape, and a polygonal shape.

13. The substrate having an electronic component of claim 1 , wherein a thickness of the first layer is greater than a thickness of the first wiring portion.

14. The substrate having an electronic component of claim 2 , wherein a size of at least one layer of the plurality of layers is different from sizes of remaining layers of the plurality of layers.

15. A substrate having an electronic component, comprising:
a frame having a through hole with the electronic component disposed in the through hole;
a first wiring portion formed on a surface of the frame and the electronic component, comprising a wiring layer and a first insulating layer;
a first layer formed on the first wiring portion;
a second wiring portion formed on the first layer, comprising an antenna layer;
a second insulating layer formed on another surface of the frame and the electronic component; and
a via member connecting an electrode pad formed in the second insulating layer to the electronic component,
wherein the first layer is formed of a first material different from a second material of the second wiring portion, and
wherein the first layer comprises a via connecting a pattern layer of the first wiring portion and the antenna layer of the second wiring portion.

16. The substrate having an electronic component of claim 15 , wherein the antenna layer comprises a main antenna layer connected to the electronic component, and a dummy antenna layer disposed above the main antenna layer.

17. The substrate having an electronic component of claim 1 , wherein the first material is formed of a photo imageable dielectric (PID) material.

18. The substrate having an electronic component of claim 15 , wherein the first material is formed of a photo imageable dielectric (PID) material.

Assignees

• Samsung Electro Mech

Inventors

• Kim Hong In
• Kim Thomas A
• Jeong Tae Sung

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W44/251

  for monolithic microwave integrated circuits [MMIC] · CPC title

• H10W44/248

  for antennas · CPC title