Automated microdissection instrument and method for processing a biological sample

US12372440B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12372440-B2
Application numberUS-202318336855-A
CountryUS
Kind codeB2
Filing dateJun 16, 2023
Priority dateSep 25, 2004
Publication dateJul 29, 2025
Grant dateJul 29, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

First claim

Opening claim text (preview).

What is claimed is: 1. A digital microscope comprising: a worksurface for receiving a sample; the worksurface intersecting a primary optical axis of the microscope; a substrate receiving location on the worksurface for receiving a sample-bearing substrate; the worksurface having a first opening in the substrate receiving location for alignment with the primary optical axis to permit pathing of light through the first opening in the worksurface; a digital image acquisition system including an image sensor configured to: automatically detect the presence of the substrate in the substrate-receiving location; and automatically record a static image of the substrate to create a roadmap image of the sample after the presence of the sample-bearing substrate is detected in the substrate-receiving location; and at least two laser sources including an infrared capture laser source and an ultraviolet cutting laser source; a computer coupled to the digital image acquisition system and the at least two laser sources, wherein the digital microscope is mounted on a frame and wherein the frame carries the components of the digital microscope, wherein the capture laser source and the cutting laser source are integrated into the digital microscope being mounted on the frame, wherein the worksurface includes a staging area for receiving transfer film carriers and/or cap cassettes, wherein cell capture is performed in the substrate receiving location, wherein the worksurface further includes a quality control station location, wherein the quality control station location includes an opening in the worksurface that permits illumination and laser light to pass, and wherein the quality control station location provides for viewing the cap following cell capture, wherein the computer is configured to generate an image of the cap with the digital image acquisition system, and further exposing the cap to the infrared capture laser or the ultraviolet cutting laser for ablation of portions of a collected sample residing on the transfer film carrier and/or cap in the quality control station. 2. The digital microscope of claim 1 , wherein the digital microscope further includes an illumination system. 3. The digital microscope of claim 2 , wherein the illumination system comprises a white light illuminator and a condenser mounted on the frame. 4. The digital microscope of claim 1 , wherein the digital microscope further includes a handling system. 5. The digital microscope of claim 4 , wherein the handling system comprises a lift fork. 6. The digital microscope of claim 5 , wherein the lift fork is adapted to pick and move a transfer film carrier and/or cap into and out of juxtaposition with the sample-bearing substrate. 7. The digital microscope of claim 4 , wherein the handling system includes a visualization filter. 8. The digital microscope of claim 7 , wherein the visualization filter comprises diffuser glass. 9. The digital microscope of claim 1 , wherein the digital microscope further includes an optical system. 10. The digital microscope of claim 9 , wherein the optical system includes elements mounted on the frame in combination to create an optical train of optical elements for pathing light, wherein the optical system comprises one or more optical elements selected from a mirror, a dichroic mirror, a lens, an objective, a beam-diameter adjuster, a cut-off filter, a diffuser, a condenser, an eyepiece and an image acquisition system. 11. The digital microscope of claim 1 , wherein the digital microscope further includes an illumination system and an optical system. 12. The digital microscope of claim 11 , wherein the illumination system, worksurface and optical system are arranged in an inverted transmitted-light microscope fashion such that the illumination system is arranged above the worksurface and at least one objective is arranged below the worksurface. 13. The digital microscope of claim 1 , wherein the worksurface is mounted on the frame and operates as a translation stage that is automatically or manually moveable. 14. The digital microscope of claim 13 , wherein the worksurface is moveable in directions including at least the planar X-Y directions. 15. The digital microscope of claim 1 , wherein the worksurface includes slide locations for handling multiple tissue samples simultaneously and wherein each slide location includes at least one opening in the worksurface. 16. The digital microscope of claim 1 , wherein the worksurface further includes an unload station for unloading the transfer film carriers and/or caps.

Assignees

Inventors

Classifications

  • Methods of surface bonding and/or assembly therefor · CPC title

  • using local activation of adhesive, i.e. Laser Capture Microdissection · CPC title

  • and simultaneously bonding [e.g., cut-seaming] · CPC title

  • with mapping; Identification of areas; Spatial correlated pattern · CPC title

  • for measuring two or more coordinates · CPC title

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What does patent US12372440B2 cover?
Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substr…
Who is the assignee on this patent?
Life Technologies Corp
What technology area does this patent fall under?
Primary CPC classification G01N1/2813. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 29 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).