Automated microdissection instrument for determining a location of a laser beam projection on a worksurface area

US10156501B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10156501-B2
Application numberUS-201715434200-A
CountryUS
Kind codeB2
Filing dateFeb 16, 2017
Priority dateNov 5, 2001
Publication dateDec 18, 2018
Grant dateDec 18, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for automatically determining the location of a laser beam projection on a worksurface area of a laser microdissection instrument that is operatively coupled to a microprocessing device and a digital image acquisition system containing a digital image sensor, the method comprising the steps of: emitting a laser beam from a laser used in a cut-and-capture microdissection of a biological sample at an intensity at a level sufficient to be detected by the digital image sensor; detecting the sufficient light intensity of the laser beam by the digital image sensor; determining the pixel location of the laser beam on the digital image sensor; converting the pixel location of the laser beam on the digital image sensor to a coordinate location corresponding to the worksurface area; and assigning the coordinate location to the location of the laser beam, wherein the coordinate location establishes a zeroed location. 2. The method of claim 1 , wherein detecting a sufficient light intensity of the laser beam includes turning off background illumination. 3. The method of claim 1 further including, controlling the movement of the laser beam relative to the worksurface from the assigned zeroed coordinate location to a target location of an area of interest of a biological sample. 4. The method of claim 1 , wherein detecting a sufficient light intensity of the laser beam includes increasing the intensity of the laser beam.

Assignees

Inventors

Classifications

  • Methods of surface bonding and/or assembly therefor · CPC title

  • using local activation of adhesive, i.e. Laser Capture Microdissection · CPC title

  • G01N1/2813Primary

    Producing thin layers of samples on a substrate, e.g. smearing, spinning-on (G01N1/30 takes precedence) · CPC title

  • and simultaneously bonding [e.g., cut-seaming] · CPC title

  • with mapping; Identification of areas; Spatial correlated pattern · CPC title

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What does patent US10156501B2 cover?
Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substr…
Who is the assignee on this patent?
Life Technologies Corp
What technology area does this patent fall under?
Primary CPC classification G01N1/2813. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).