Shielding Cover, Shielding Can, Printed Circuit Board Assembly, and Electronic Device
US-2023019918-A1 · Jan 19, 2023 · US
Circuit board assembly and electronic device
US12369288B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12369288-B2 |
| Application number | US-202218044687-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 22, 2022 |
| Priority date | Sep 30, 2021 |
| Publication date | Jul 22, 2025 |
| Grant date | Jul 22, 2025 |
How to read this patent
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- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
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- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
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Abstract
Official abstract text for this publication.
Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity.
First claim
Opening claim text (preview).
What is claimed is: 1. A circuit board assembly, comprising: a first circuit board; and a second circuit board stacked with the first circuit board, wherein a first shielding frame is disposed on a surface of the first circuit board that faces toward the second circuit board, a second shielding frame is disposed on a surface of the second circuit board that faces toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover in a manner that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a first shielding cavity and a second shielding cavity, and wherein at least one of the first shielding frame or the second shielding frame comprises: a shielding frame body; and an elastic abutment portion, wherein the elastic abutment portion is disposed at an end portion of the shielding frame body that faces toward the shared shielding cover, the elastic abutment portion abuts against the shared shielding cover, the elastic abutment portion is tilted relative to the shielding frame body, and in a direction away from the shielding frame body, the elastic abutment portion is tilted toward an interior of the shielding cavity. 2. The circuit board assembly according to claim 1 , wherein at least one of the first shielding frame or the second shielding frame is detachably connected to the shared shielding cover. 3. The circuit board assembly according to claim 1 , wherein elastic abutment portion abuts against a surface of the shared shielding cover that faces toward the shielding frame body. 4. The circuit board assembly according to claim 1 , wherein the first shielding frame is detachably connected to the shared shielding cover, and the second shielding frame is fixedly connected to the shared shielding cover. 5. The circuit board assembly according to claim 1 , wherein the first shielding frame and the second shielding frame are both detachably connected to the shared shielding cover. 6. The circuit board assembly according to claim 1 , wherein the elastic abutment portion is made of an elastic material having an electromagnetic shielding effect. 7. The circuit board assembly according to claim 1 , wherein the elastic abutment portion and the shielding frame body are integrally formed. 8. The circuit board assembly according to claim 1 , wherein the elastic abutment portion and the shielding frame body are welded together. 9. The circuit board assembly according to claim 1 , wherein the elastic abutment portion comprises a plurality of elastic plates. 10. The circuit board assembly according to claim 9 , wherein a groove extends in the shared shielding cover, and the elastic abutment portion extends in the groove. 11. An electronic device, comprising: a housing and a circuit board assembly, wherein the circuit board assembly is disposed in an accommodating space of the housing, and the circuit board assembly comprises: a first circuit board; and a second circuit board stacked with the first circuit board, wherein a first shielding frame is disposed on a surface of the first circuit board that faces toward the second circuit board, a second shielding frame is disposed on a surface of the second circuit board that faces toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover in a manner that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a first shielding cavity and a second shielding cavity, and wherein at least one of the first shielding frame or the second shielding frame comprises: a shielding frame body; and an elastic abutment portion, wherein the elastic abutment portion is disposed at an end portion of the shielding frame body that faces toward the shared shielding cover, the elastic abutment portion abuts against the shared shielding cover, the elastic abutment portion is tilted relative to the shielding frame body, and in a direction away from the shielding frame body, the elastic abutment portion is tilted toward an interior of the shielding cavity. 12. The electronic device according to claim 11 , wherein at least one of the first shielding frame or the second shielding frame is detachably connected to the shared shielding cover. 13. The electronic device according to claim 11 , wherein the elastic abutment portion abuts against a surface of the shared shielding cover that faces toward the shielding frame body. 14. The electronic device according to claim 11 , wherein the first shielding frame is detachably connected to the shared shielding cover, and the second shielding frame is fixedly connected to the shared shielding cover. 15. The electronic device according to claim 11 , wherein the first shielding frame and the second shielding frame are both detachably connected to the shared shielding cover. 16. The electronic device according to claim 11 , wherein the elastic abutment portion is made of an elastic material having an electromagnetic shielding effect. 17. The electronic device according to claim 11 , wherein the elastic abutment portion and the shielding frame body are integrally formed. 18. The electronic device according to claim 11 , wherein the elastic abutment portion and the shielding frame body are welded together. 19. The electronic device according to claim 11 , wherein the elastic abutment portion comprises a plurality of elastic plates. 20. The electronic device according to claim 11 , wherein a groove extends in the shared shielding cover, and the elastic abutment portion extends in the groove.
Assignees
Inventors
Classifications
Related components mounted on both sides of the PCB · CPC title
Shields or metal cases · CPC title
associated with surface mounted components · CPC title
Stacked arrangements of planar printed circuit boards · CPC title
- H05K9/0032Primary
having multiple parts, e.g. frames mating with lids · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12369288B2 cover?
- Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shieldi…
- Who is the assignee on this patent?
- Honor Device Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K9/0032. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 22 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).