System and method for graph-augmented test case generation using artificial intelligence (ai)
US-2026064567-A1 · Mar 5, 2026 · US
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Luo Wenjun patents
Luo Wenjun is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Luo Wenjun |
| Total patents | 29 |
| First publication | Nov 19, 2020 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
System and method for generative artificial intelligence based image generation
US-2026051095-A1 · Feb 19, 2026 · US
Circuit board assembly and electronic device
US-12369288-B2 · Jul 22, 2025 · US
External meshing cylindrical gear pair with constant meshing characteristics constructed tooth pair
US-12352347-B2 · Jul 8, 2025 · US
Herringbone planetary gear transmission device with constant meshing characteristics constructed tooth pair
US-12313147-B2 · May 27, 2025 · US
Circuit board assembly soldering apparatus and circuit board assembly soldering method
US-12303990-B2 · May 20, 2025 · US
Antenna apparatus and electronic device
US-12237566-B2 · Feb 25, 2025 · US
Circuit board assembly and electronic device
US-12219727-B2 · Feb 4, 2025 · US
Herringbone Planetary Gear Transmission Device With Constant Meshing Characteristics Constructed Tooth Pair
US-2024401673-A1 · Dec 5, 2024 · US
Bevel Gear Pair With Constant Meshing Characteristics Constructed Tooth Pair
US-2024401670-A1 · Dec 5, 2024 · US
Recent patents
Latest publications not already listed above.
Herringbone Gear Pair With Constant Meshing Characteristics Constructed Tooth Pair
US-2024401685-A1 · Dec 5, 2024 · US
External Meshing Cylindrical Gear Pair With Constant Meshing Characteristics Constructed Tooth Pair
US-2024401686-A1 · Dec 5, 2024 · US
Internal Meshing Cylindrical Gear Pair With Constant Meshing Characteristics Constructed Tooth Pair
US-2024401684-A1 · Dec 5, 2024 · US
Flexible Circuit Board, Circuit Board Assembly, and Electronic Device
US-2024306300-A1 · Sep 12, 2024 · US
Circuit Board Assembly and Electronic Device
US-2024292581-A1 · Aug 29, 2024 · US
Circuit board assembly soldering apparatus and circuit board assembly soldering method
US-2024269759-A1 · Aug 15, 2024 · US
Circuit Board Assembly and Electronic Device
US-2024244752-A1 · Jul 18, 2024 · US
Circuit board assembly and electronic device
US-2024206102-A1 · Jun 20, 2024 · US
Polar navigation window period assessment system based on three-dimensional visualization simulation of ship-ice interaction
US-11954806-B1 · Apr 9, 2024 · US
Antenna apparatus and electronic device
US-2022407218-A1 · Dec 22, 2022 · US
Air conditioner indoor unit
US-11480345-B2 · Oct 25, 2022 · US
Indoor unit, and air conditioner
US-11262086-B2 · Mar 1, 2022 · US
Air conditioner indoor unit
US-2021364189-A1 · Nov 25, 2021 · US
Air conditioner indoor unit
US-2021356143-A1 · Nov 18, 2021 · US
Air conditioner
US-11105519-B2 · Aug 31, 2021 · US
Air conditioner installation plate and air conditioner
US-10907841-B2 · Feb 2, 2021 · US
Air conditioner
US-2021010691-A1 · Jan 14, 2021 · US
Indoor unit, and air conditioner
US-2020370763-A1 · Nov 26, 2020 · US
Air conditioner installation plate and air conditioner
US-2020363077-A1 · Nov 19, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Honor Device Co Ltd | 10 |
| Gd Midea Air Conditioning Equipment Co Ltd | 9 |
| Midea Group Co Ltd | 9 |
| Univ Chongqing | 7 |
| Chongqing Yisilun Tech Co Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| F24F1/0057 | 7 |
| F16H55/08 | 7 |
| F24F13/20 | 6 |
| F16H2055/0866 | 6 |
| F16H2055/086 | 6 |