Printed circuit board assembly and electronic device

Patent metadata

Field	Value
Publication number	US-12369249-B2
Application number	US-202118246036-A
Country	US
Kind code	B2
Filing date	Sep 7, 2021
Priority date	Sep 30, 2020
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

This application provides a printed circuit board assembly and an electronic device. The printed circuit board assembly includes: a printed circuit board, where the printed circuit board includes a functional network, and the functional network is configured to provide an electrical function; a conductive part, where the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network; and a cover-shaped structure, where the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure. The foregoing technical solutions can reduce impedance of a circuit board, improve a current utilization, and further improve mechanical reliability of the circuit board.

First claim

What is claimed is:

1. A printed circuit board assembly, comprising:
a printed circuit board, wherein the printed circuit board comprises a functional network, and the functional network is configured to provide an electrical function;
a conductive part, wherein the conductive part is connected to the printed circuit board and is separately electrically connected to the functional network, and wherein the conductive part is a conductive sheet; and
a cover-shaped structure, wherein the cover-shaped structure covers the conductive part and is connected to the printed circuit board, a gap is disposed between the cover-shaped structure and the conductive part, the cover-shaped structure is made of metal, configured to reduce a risk of breakage to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure,
wherein the printed circuit board comprises a transverse wide region and a narrow strip region that extends longitudinally, a width of the narrow strip region is less than that of the wide region, and the conductive part and the cover-shaped structure are disposed on the narrow strip region.

2. The printed circuit board assembly according to claim 1 , wherein the printed circuit board further comprises a ground network, wherein
the cover-shaped structure is electrically connected to the ground network.

3. The printed circuit board assembly according to claim 1 , wherein the cover-shaped structure is made of an insulation material.

4. The printed circuit board assembly according to claim 1 , wherein the conductive sheet is formed from cured solder, or formed from a cured conductive adhesive.

5. The printed circuit board assembly according to claim 1 , wherein the conductive part is fixedly connected to the printed circuit board.

6. The printed circuit board assembly according to claim 1 , wherein the cover-shaped structure is fixedly connected to the printed circuit board.

7. The printed circuit board assembly according to claim 1 , wherein the printed circuit board comprises a first circuit board part and a second circuit board part that are separable, wherein
the first circuit board part comprises a first connection region, a second connection region disposed around the first connection region, and an extension region extending outwards from the second connection region;
the first connection region is connected to the conductive part;
the second connection region and the extension region are connected to the cover-shaped structure; and
the extension region and the second circuit board part are disposed in an overlapping manner.

8. The printed circuit board assembly according to claim 1 , wherein the functional network comprises a charging circuit and/or a power supply circuit.

9. An electronic device, comprising:
a printed circuit board assembly, wherein the printed circuit board assembly comprises;
a printed circuit board, wherein the printed circuit board comprises a functional network, and the functional network is configured to provide an electrical function;
a conductive part, wherein the conductive part is connected to the printed circuit board and is separately electrically connected to the functional network, and wherein the conductive part is a conductive sheet; and
a cover-shaped structure, wherein the cover-shaped structure covers the conductive part and is connected to the printed circuit board, a gap is disposed between the cover-shaped structure and the conductive part, the cover-shaped structure is made of metal, configured to reduce a risk of breakage to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure,
wherein the printed circuit board comprises a transverse wide region and a narrow strip region that extends longitudinally, a width of the narrow strip region is less than that of the wide region, and the conductive part and the cover-shaped structure are disposed on the narrow strip region.

10. The electronic device according to claim 9 , wherein the printed circuit board further comprises a ground network, wherein
the cover-shaped structure is electrically connected to the ground network.

11. The electronic device according to claim 9 , wherein the cover-shaped structure is made of an insulation material.

12. The electronic device according to claim 9 , wherein the conductive sheet is formed from cured solder, or formed from a cured conductive adhesive.

13. The electronic device according to claim 9 , wherein the conductive part is fixedly connected to the printed circuit board.

14. The printed circuit board assembly according to claim 9 , wherein the cover-shaped structure is fixedly connected to the printed circuit board.

15. The printed circuit board assembly according to claim 9 , wherein the printed circuit board comprises a first circuit board part and a second circuit board part that are separable, wherein
the first circuit board part comprises a first connection region, a second connection region disposed around the first connection region, and an extension region extending outwards from the second connection region;
the first connection region is connected to the conductive part;
the second connection region and the extension region are connected to the cover-shaped structure; and
the extension region and the second circuit board part are disposed in an overlapping manner.

16. The printed circuit board assembly according to claim 9 , wherein the functional network comprises a charging circuit and/or a power supply circuit.

Assignees

• Huawei Tech Co Ltd

Inventors

• Shi Hongbin
• Guo Xin
• Wang Lixiang
• Tu Haisheng
• Zheng Benyin

Classifications

• H05K1/0271 Primary

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H05K2201/09081

  Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure · CPC title

• H05K2201/2009

  Reinforced areas, e.g. for a specific part of a flexible printed circuit · CPC title

• H05K2201/09027

  Non-rectangular flat PCB, e.g. circular · CPC title

• H05K3/24

  Reinforcing of the conductive pattern {(by solder coating H05K3/3465)} · CPC title