Piezoelectric microelectromechanical system microphone sensitivity improvement by anchor engineering

Patent metadata

Field	Value
Publication number	US-12358782-B2
Application number	US-202217674213-A
Country	US
Kind code	B2
Filing date	Feb 17, 2022
Priority date	Feb 19, 2021
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a portion of a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and slits defined in the piezoelectric element about the perimeter of the piezoelectric element, the slits defining a plurality of partial anchors securing the piezoelectric element to the support substrate to improve sensitivity of the piezoelectric microelectromechanical system microphone.

First claim

What is claimed is:

1. A piezoelectric microelectromechanical system microphone comprising:
a support substrate;
a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a portion of a perimeter of the piezoelectric element;
a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential; and
slits defined in the piezoelectric element about the perimeter of the piezoelectric element, the slits defining a plurality of partial anchors securing the piezoelectric element to the support substrate to improve sensitivity of the piezoelectric microelectromechanical system microphone.

2. The piezoelectric microelectromechanical system microphone of claim 1 wherein the piezoelectric element has a diaphragm structure.

3. The piezoelectric microelectromechanical system microphone of claim 2 wherein the piezoelectric element is circular.

4. The piezoelectric microelectromechanical system microphone of claim 3 wherein the slits define at least three partial anchors.

5. The piezoelectric microelectromechanical system microphone of claim 3 wherein the slits are arcuate in shape.

6. The piezoelectric microelectromechanical system microphone of claim 5 wherein the plurality of partial anchors each extends over an arc length between 0° and 360°/N, where N is a total number of partial anchors in the piezoelectric microelectromechanical system microphone.

7. The piezoelectric microelectromechanical system microphone of claim 2 wherein the sensing electrode includes an inner sensing electrode disposed proximate a center of the diaphragm structure and an outer sensing electrode disposed proximate the perimeter of the diaphragm structure.

8. The piezoelectric microelectromechanical system microphone of claim 7 wherein the slits are defined in a region of the piezoelectric element surrounding the outer sensing electrode.

9. The piezoelectric microelectromechanical system microphone of claim 7 wherein the piezoelectric element is free of vent holes within a region inside a perimeter defined by the outer sensing electrode.

10. The piezoelectric microelectromechanical system microphone of claim 7 wherein the inner sensing electrode includes a first upper sensing electrode disposed on an upper surface of the piezoelectric element and a first lower sensing electrode disposed on a lower surface of the piezoelectric element.

11. The piezoelectric microelectromechanical system microphone of claim 10 wherein the outer sensing electrode includes a second upper sensing electrode disposed on the upper surface of the piezoelectric element and a second lower sensing electrode disposed on the lower surface of the piezoelectric element.

12. The piezoelectric microelectromechanical system microphone of claim 11 wherein the piezoelectric element includes an upper film of piezoelectric material and a lower film of piezoelectric material, an inner middle sensing electrode disposed between the upper film and lower film proximate the center of the diaphragm structure, and an outer middle sensing electrode disposed proximate the perimeter of the diaphragm structure.

13. The piezoelectric microelectromechanical system microphone of claim 1 wherein the slits are between 1 μm and 5 μm wide.

14. An electronics device module including the piezoelectric microelectromechanical system microphone of claim 1 .

15. An electronic device including the electronic device module of claim 14 .

16. A telephone including the electronic device module of claim 14 .

Assignees

• Skyworks Solutions Inc

Inventors

• Chen Guofeng
• Hui Yu

Classifications

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• H04R17/02 Primary

  Microphones · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• B81B3/0051 Primary

  For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H3/60) · CPC title