Piezoelectric MEMS microphone

Patent metadata

Field	Value
Publication number	US-10964880-B2
Application number	US-201816196922-A
Country	US
Kind code	B2
Filing date	Nov 20, 2018
Priority date	Jun 30, 2008
Publication date	Mar 30, 2021
Grant date	Mar 30, 2021

Abstract

A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

First claim

The invention claimed is:

1. A packaged transducer comprising:
a microphone comprising:
a substrate;
a transducing element, the transducing element comprising a first electrode layer, a piezoelectric layer deposited over the first electrode layer, and a second electrode layer deposited over piezoelectric material of the piezoelectric layer; and

a casing mounted to the microphone and having a front wall and a back wall, wherein a space between the back wall and the transducing element at least partially defines a back cavity, wherein the substrate is located at least partially between the transducing element and the back wall and the microphone is coupled to the front wall by the substrate to at least partially define a front cavity between the front wall and the microphone, and a fluid connection between the back cavity, the front cavity, and an exterior of the casing.

2. The transducer of claim 1 , wherein the microphone comprises a plurality of cantilevered beams, each beam defining a beam body extending from a beam base and terminating in a beam tip, wherein each beam is joined to the substrate along the respective beam base and is substantially free from the substrate along the respective beam body, wherein the plurality of beams are arranged such that each beam body extends from the respective beam base toward the beam base of an opposing beam, wherein a transducer acoustic compliance of the transducing element is the collective compliance of the cantilevered beams.

3. The transducer of claim 2 , wherein the plurality of beams is arranged such that an edge of each beam is substantially parallel to an edge of an adjacent beam.

4. The transducer of claim 2 , wherein the electrode layers of each beam extend from the respective beam base over less than 80% of the respective beam body.

5. The transducer of claim 2 , wherein the beams comprise triangular beams, wherein the electrode layers extend from the beam base over less than 80% of the beam body.

6. The transducer of claim 1 , wherein the piezoelectric layer comprises aluminum nitride or doped AlN.

7. The transducer of claim 1 , further comprising a second piezoelectric layer deposited directly over the second electrode layer and a third electrode layer deposited directly over the second piezoelectric layer.

8. The transducer of claim 1 , wherein the transducing element has a transducer acoustic compliance and the back cavity has a back cavity acoustic compliance, and the casing is dimensioned to achieve a predetermined ratio between the transducer and back cavity acoustic compliances.

9. The transducer of claim 8 , wherein the back cavity is dimensioned such that the transducer acoustic compliance is more than 17% of the back cavity acoustic compliance.

10. The transducer of claim 8 , wherein the back cavity is dimensioned such that the transducer acoustic compliance is less than 581% of the back cavity acoustic compliance.

11. A packaged transducer comprising:
a casing comprising a front wall, a back wall, and a side wall joining the front wall to the back wall;
a microphone transducer mounted to the front wall, the microphone transducer comprising a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions;
a back cavity cooperatively defined between the back wall, the side wall, the front wall, and the transducer, the back cavity having a back cavity acoustic compliance;
wherein the transducing element comprises a length that matches a predetermined resonant frequency and a width, thickness, and elasticity that produces the transducer acoustic compliance within a given range of the back cavity acoustic compliance.

12. The transducer of claim 11 , wherein the transducer acoustic compliance is between 17% to 538% of the back cavity acoustic compliance.

13. The transducer of claim 12 , wherein the transducer acoustic compliance is between 24% to 410% of the back cavity acoustic compliance.

14. The transducer of claim 13 , wherein the transducer acoustic compliance substantially matches the back cavity acoustic compliance.

15. The transducer of claim 11 , wherein the transducing element comprises a first electrode layer, an intermediate layer of piezoelectric material deposited over said first electrode layer, and a second electrode layer deposited over said piezoelectric material.

16. The transducer of claim 15 , wherein the transducing element comprises a cantilevered beam comprising a beam base joined to the substrate and a beam body extending from the beam base that is substantially free from the substrate.

17. The transducer of claim 16 , wherein the electrode layers extend from the beam base over less than 80% of the beam body.

18. The transducer of claim 15 , wherein the transducing element comprises a stress-relieved diaphragm, wherein the diaphragm is attached to the substrate about a perimeter of the diaphragm at a first and second portion, wherein the first portion of the diaphragm comprises a layer of the diaphragm directly deposited onto the substrate, and the second portion of the diaphragm is adhered to the substrate.

19. The transducer of claim 18 , wherein the first and second electrode layers define a first and second electrode, respectively, wherein the first and second electrodes each extend over a central quarter the diaphragm, the first and second electrodes further comprising lead traces that extend to the substrate at the first portion of the diaphragm.

20. The transducer of claim 19 , wherein the first and second electrode layers further define a third and fourth electrode, respectively, wherein the third and fourth electrodes each extend along the entirety of the diaphragm perimeter, have an area substantially equivalent to a quarter of the diaphragm area, and are electrically isolated from the first and second electrodes, respectively.

21. The transducer of claim 20 , wherein the first electrode is electrically connected to the fourth electrode and the second electrode is electrically connected to the third electrode.

22. A packaged transducer comprising:
a microphone comprising:
a substrate;
a transducing element, the transducing element comprising a first electrode layer, a piezoelectric layer deposited over the first electrode layer, and a second electrode layer deposited over piezoelectric material of the piezoelectric layer; and

a casing mounted to the microphone and having a front wall and a back wall, wherein a space between the back wall and the transducing element at least partially defines a back cavity, wherein the transducing element has a transducer acoustic compliance and the back cavity has a back cavity acoustic compliance, and wherein the casing is dimensioned to achieve a ratio between the transducer and back cavity acoustic compliances.

23. The transducer of claim 22 , wherein the transducer acoustic compliance is between 17% to 581% of the back cavity acoustic compliance.

24. The transducer of claim 23 , wherein the transducer acoustic compliance is between 24% to 410% of the back cavity acoustic compliance.

Assignees

• Univ Michigan Regents
• Vesper Tech Inc

Inventors

• Grosh Karl
• Littrell Robert J

Classifications

• H04R17/00 Primary

  Piezoelectric transducers; Electrostrictive transducers (piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners {H10N30/00}) · CPC title

• H04R17/02

  Microphones · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• B81B2203/04

  Electrodes · CPC title

• B81B2203/0127

  Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function · CPC title