Multilayer substrate and method for manufacturing the same
US-2018242464-A1 · Aug 23, 2018 · US
US12354786B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12354786-B2 |
| Application number | US-202217696326-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 16, 2022 |
| Priority date | Mar 19, 2021 |
| Publication date | Jul 8, 2025 |
| Grant date | Jul 8, 2025 |
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A multilayer coil component includes: a through hole connecting portion electrically connecting an end portion of the coil portion and the external terminal, in which a coil pattern and a through hole pattern are formed in each of the plurality of layers, the through hole connecting portion is formed by mutually joining a plurality of the through hole patterns in the lamination direction, the through hole pattern in at least one first layer among the plurality of layers is shifted with respect to the through hole pattern in another second layer when viewed from the lamination direction, and, when viewed from the lamination direction, a distance between the through hole pattern in the first layer and a coil pattern in the first layer is farther than a distance between the through hole pattern in the second layer and the coil pattern in the first layer.
Opening claim text (preview).
What is claimed is: 1. A multilayer coil component comprising: an element body formed by laminating a plurality of layers made of an insulator in a lamination direction; an external terminal formed on a bottom surface of the element body; a coil portion provided in the element body with a coil axis perpendicular to the bottom surface; and a through hole connecting portion provided in the element body and electrically connecting an end portion of the coil portion and the external terminal, wherein a coil pattern and a through hole pattern are formed in each of the plurality of layers, whereby the coil portion is formed by a plurality of the coil patterns in the lamination direction, and the through hole connecting portion is formed by a plurality of the through hole patterns in the lamination direction, and each coil pattern is formed in a same layer as a corresponding one of the through hole patterns, the through hole pattern in at least one first layer among the plurality of layers is shifted with respect to the through hole pattern in another second layer when viewed from the lamination direction, and when viewed from the lamination direction, a distance between the through hole pattern in the first layer and a coil pattern in the first layer is farther than a distance between the through hole pattern in the second layer and the coil pattern in the first layer. 2. The multilayer coil component according to claim 1 , wherein the through hole connecting portion does not have a region where all of the through hole patterns overlap when viewed from the lamination direction. 3. The multilayer coil component according to claim 1 , wherein the plurality of through hole patterns are classified into at least three types of a first through hole pattern, a second through hole pattern, and a third through hole pattern disposed at positions mutually shifted when viewed from the lamination direction. 4. The multilayer coil component according to claim 3 , wherein the second through hole pattern and the third through hole pattern are connected in the lamination direction via the first through hole pattern, and the second through hole pattern and the third through hole pattern do not overlap when viewed from the lamination direction. 5. The multilayer coil component according to claim 4 , wherein a multilayer pattern in which the second through hole pattern and the third through hole pattern are alternately disposed via the first through hole pattern is repeated. 6. The multilayer coil component according to claim 4 , wherein in at least one section of the through hole connecting portion, one of the second through hole pattern and the third through hole pattern is disposed on both sides of the first through hole pattern in the lamination direction. 7. The multilayer coil component according to claim 1 , wherein the through hole connecting portion has a region where all of the through hole patterns overlap when viewed from the lamination direction. 8. The multilayer coil component according to claim 1 , wherein at least two of the layers where the coil pattern and the through hole pattern have the same disposition are continuous.
with stacked layers · CPC title
Details of via holes for interconnecting the layers · CPC title
Surface mounted devices · CPC title
on stacked layers · CPC title
Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields · CPC title
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