Method for manufacturing indium-containing organic polymer film, patterning method, and method for manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-12353131-B2
Application number	US-202217675770-A
Country	US
Kind code	B2
Filing date	Feb 18, 2022
Priority date	Sep 21, 2021
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

A method for manufacturing an indium-containing organic polymer film includes forming an organic polymer film on a base body, infiltrating the organic polymer film with an alkylindium having an alkyl group having 2 to 4 carbon atoms, and oxidizing the organic polymer film infiltrated with the alkylindium.

First claim

What is claimed is:

1. A method for manufacturing an indium-containing organic polymer film comprising:
forming an organic polymer film on a base body;
infiltrating the organic polymer film with an alkylindium having an alkyl group having 2 to 4 carbon atoms; and
oxidizing the organic polymer film infiltrated with the alkylindium.

2. The method for manufacturing an indium-containing organic polymer film according to claim 1 ,
wherein the alkylindium is triethylindium.

3. The method for manufacturing an indium-containing organic polymer film according to claim 1 ,
wherein the organic polymer film contains a monomer containing at least one selected from the group consisting of an ester group, an amido group, and an imido group in one segment.

4. The method for manufacturing an indium-containing organic polymer film according to claim 3 ,
wherein the monomer in the organic polymer film further contains at least one aromatic ring in one segment.

5. The method for manufacturing an indium-containing organic polymer film according to claim 1 ,
wherein the organic polymer film is exposed to the alkylindium at a temperature of 60° C. to 120° C.

6. A patterning method comprising:
forming a pattern on an organic polymer film formed on a film to be processed;
infiltrating the organic polymer film having the pattern with an alkylindium having an alkyl group having 2 to 4 carbon atoms;
oxidizing the organic polymer film infiltrated with the alkylindium; and
processing the film to be processed using the oxidized organic polymer film.

7. The patterning method according to claim 6 ,
wherein the alkylindium is triethylindium.

8. The patterning method according to claim 6 ,
wherein the organic polymer film contains a monomer containing at least one selected from the group consisting of an ester group, an amido group, and an imido group in one segment.

9. The patterning method according to claim 8 ,
wherein the monomer in the organic polymer film further contains at least one aromatic ring in one segment.

10. The patterning method according to claim 6 ,
wherein the organic polymer film is exposed to the alkylindium at a temperature of 60° C. to 120° C.

11. A method for manufacturing a semiconductor device comprising:
preparing a semiconductor substrate having thereon a film to be processed;
forming an organic polymer film on the film to be processed;
forming a pattern on the organic polymer film;
infiltrating the organic polymer film having the pattern with an alkylindium having an alkyl group having 2 to 4 carbon atoms;
oxidizing the organic polymer film infiltrated with the alkylindium; and
processing the film to be processed using the oxidized organic polymer film.

12. The method according to claim 11 ,
wherein the alkylindium is triethylindium.

13. The method according to claim 11 ,
wherein the organic polymer film contains a monomer containing at least one selected from the group consisting of an ester group, an amido group, and an imido group in one segment.

14. The method according to claim 13 ,
wherein the monomer in the organic polymer film further contains at least one aromatic ring in one segment.

15. The method according to claim 11 ,
wherein the organic polymer film is exposed to the alkylindium at a temperature of 60° C. to 120° C.

16. The method according to claim 11 ,
wherein the film to be processed is a silicon oxide film or a stacked film including a silicon oxide film and a silicon nitride film.

17. The patterning method according to claim 6 , wherein the processing the film to be processed includes etching the film to be processed with an etchant gas including fluorine.

18. The patterning method according to claim 17 , wherein the etchant gas includes oxygen.

19. The method according to claim 11 , wherein the processing the film to be processed includes etching the film to be processed with an etchant gas including fluorine.

20. The method according to claim 19 , wherein the etchant gas includes oxygen.

Assignees

• Kioxia Corp

Inventors

• Asakawa Koji
• Sasao Norikatsu
• Sugimura Shinobu

Classifications

• G03F7/325

  Non-aqueous compositions · CPC title

• C08L85/00

  Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers · CPC title

• G03F7/70416

  2.5D lithography · CPC title

• G03F7/405

  Treatment with inorganic or organometallic reagents after imagewise removal · CPC title

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title