Photonic module and method of manufacture

Patent metadata

Field	Value
Publication number	US-12353003-B2
Application number	US-202117798525-A
Country	US
Kind code	B2
Filing date	Feb 10, 2021
Priority date	Feb 11, 2020
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

A photonic module, comprising a first waveguide; a second waveguide, disposed on an opposing side of the first waveguide to a substrate; and, a coupling section. One of the first waveguide and the second waveguide is formed of crystalline silicon. The other of the first waveguide and the second waveguide is formed of amorphous silicon. The coupling section is configured to couple light between the first waveguide and the second waveguide. Such a silicon photonic module has enhanced coupling and transmission properties in contrast to conventional modules.

First claim

The invention claimed is:

1. A photonic component comprising:
a photonic module, comprising:
a substrate defining a horizontal plane and comprising a silicon layer and a buried oxide (BOX) layer directly on the silicon layer;
a first waveguide above the substrate;
a second waveguide, disposed above the first waveguide on an opposing side of the first waveguide to the substrate;
a third waveguide above the substrate, the second waveguide being disposed above the third waveguide on an opposing side of the third waveguide to the substrate, the second waveguide being optically coupled between the first and third waveguides;
a first coupling section configured to couple light between the first waveguide and the second waveguide and comprising:
a tapered portion of the first waveguide, tapering from a first width to a second width along a first direction, and
a first tapered portion of the second waveguide, tapering from a first width to a second width along a second direction antiparallel to the first direction; and

a second coupling section configured to couple light between the second waveguide and the third waveguide and comprising:
a second tapered portion of the second waveguide, tapering from a first width to a second width along a third direction, and
a tapered portion of the third waveguide, tapering from a first width to a second width along a fourth direction antiparallel to the third direction; and

one or more crossing waveguides, a portion of the or each crossing waveguide being located between the second waveguide and the substrate,
wherein the or each crossing waveguide is optically insulated from the waveguides of the photonic module,
wherein:
the first waveguide and the third waveguide are each formed of crystalline silicon and the second waveguide is formed of amorphous silicon; or
the first waveguide and the third waveguide are each formed of amorphous silicon and the second waveguide is formed of crystalline silicon,

wherein the first and third waveguides are directly on the BOX layer, and the second waveguide is directly on the first and third waveguides, and
wherein the portion of a first crossing waveguide of the one or more crossing waveguides that extends between the second waveguide and the substrate extends along a direction that forms a non-zero and non-perpendicular angle relative to a longitudinal axis of the second waveguide.

2. The photonic component of claim 1 , further comprising a first cladding disposed so as to at least partially surround the first waveguide and a second cladding disposed so as to at least partially surround the second waveguide.

3. The photonic component of claim 2 , wherein the first cladding and the second cladding are formed of silicon dioxide.

4. The photonic component of claim 1 , wherein a length of the first coupling section is greater than:
a maximum transverse width of the first waveguide; and
a maximum transverse width of the second waveguide.

5. The photonic component of claim 4 , wherein the length of the first coupling section is at least 4 μm but no more than 10 μm, and the maximum transverse widths are at least 2 μm but not more than 4 μm.

6. The photonic component of claim 1 , wherein the first and third waveguides are formed of crystalline silicon and the second waveguide is formed of amorphous silicon.

7. The photonic component of claim 1 , wherein the first and third waveguides are formed of amorphous silicon and the second waveguide is formed of crystalline silicon.

8. A method of fabricating the photonic component of claim 1 , the method including:
performing a first etching process on a first layer to form the first waveguide;
depositing a second layer on an opposing side of the first waveguide to the substrate; and
performing a second etching process on the second layer to form the second waveguide, wherein:
the steps of performing the first etching process and/or the second etching process also form the first coupling section for coupling light between the first waveguide and the second waveguide,
one of the first layer and the second layer is formed of crystalline silicon, and
the other of the first layer and the second layer is formed of amorphous silicon.

9. The method of claim 8 , wherein the step of performing the first etching process forms the tapered portion of the first waveguide, the first coupling section comprising the tapered portion of the first waveguide.

10. The method of claim 8 , wherein the step of performing the second etching process forms the first tapered portion of the second waveguide, the first coupling section comprising the first tapered portion of the second waveguide.

11. The photonic component of claim 1 , wherein the third direction is parallel to the first direction, and the fourth direction is parallel to the second direction.

12. A Mach-Zehnder interferometer comprising:
the photonic component of claim 1 ;
a first arm comprising the photonic module; and
a second arm.

13. An arrayed waveguide grating comprising:
the photonic component of claim 1 ; and
a plurality of arms,
wherein an arm of the plurality of arms comprises the photonic module.

Assignees

• Rockley Photonics Ltd

Inventors

• Thomas Abu
• Trita Andrea
• Liu Yangyang
• Rickman Andrew George

Classifications

• G02B6/125

  Bends, branchings or intersections · CPC title

• G02B6/122

  Basic optical elements, e.g. light-guiding paths · CPC title

• G02B6/12

  of the integrated circuit kind (electric integrated circuits H10B, H10D84/00 - H10D89/00, H10F19/00, H10F39/00, H10H29/00, H10K19/00, H10K39/00, H10K59/00, H10N19/00, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00) · CPC title

• G02B6/12004

  Combinations of two or more optical elements · CPC title

• G02B2006/12176

  Etching · CPC title