Cleaning device for cleaning electroplating substrate holder

Patent metadata

Field	Value
Publication number	US-2017056934-A1
Application number	US-201514839625-A
Country	US
Kind code	A1
Filing date	Aug 28, 2015
Priority date	Aug 28, 2015
Publication date	Mar 2, 2017
Grant date	—

Abstract

A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.

First claim

What is claimed is:

1 . A cleaning device for removing contamination on a substrate holder used with an electroplating cell, comprising:
an arm; a cleaning agent supplier coupled to the arm and configured to supply a cleaning agent; a nozzle coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination; and a receiver coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.

2 . The cleaning device of claim 1 , wherein the receiver is connected to the arm.

3 . The cleaning device of claim 1 , wherein the cleaning agent supplier is embedded in the arm.

4 . The cleaning device of claim 1 , wherein the cleaning agent supplier is embedded in the receiver.

5 . The cleaning device of claim 1 , wherein the nozzle is on the receiver.

6 . The cleaning device of claim 1 , wherein the receiver comprises a vent on the receiver and configured to suck up the cleaning agent.

7 . The cleaning device of claim 6 , wherein the vent is on a bottom surface of the receiver.

8 . The cleaning device of claim 1 , wherein the substrate holder comprises a plurality of lip seals configured to form a seal between a substrate and the lip seals, and the nozzle is configured to spray the cleaning agent onto one of the lip seals.

9 . The cleaning device of claim 8 , wherein the receiver is configured to surround the one of the lip seals.

10 . The cleaning device of claim 8 , wherein the substrate holder further comprises a plurality of electrical contacts over the lip seals, and the nozzle is configured to further spray the cleaning agent onto one of the electrical contacts.

11 . The cleaning device of claim 10 , wherein the receiver surrounds the one of the lip seals and the one of the electrical contacts.

12 . The cleaning device of claim 1 , wherein the cleaning agent comprises acid, dry solvent, inert gas or a combination thereof.

13 . A cleaning device for removing contamination on a lip seal of a substrate holder used with an electroplating cell, comprising:
a receiver, comprising a bottom, a ceiling and a sidewall between the bottom and the ceiling; a cleaning agent supplier configured to supply a cleaning agent; a first nozzle on the ceiling of the receiver and coupled to the cleaning agent supplier to spray the cleaning agent onto the lip seal; a second nozzle on the sidewall of the receiver and coupled to the cleaning agent supplier to spray the cleaning agent onto the lip seal.

14 . The cleaning device of claim 13 , wherein the ceiling comprises a first portion and a second portion higher than the first portion, and the first nozzle is on the first portion of the ceiling.

15 . The cleaning device of claim 14 , wherein the lip seal comprises a lip portion configured to be against a substrate, and the first portion, the sidewall and the bottom surround the lip portion.

16 . The cleaning device of claim 14 , further comprising a third nozzle on the second portion of the ceiling.

17 . A method of removing contamination on a substrate holder in an electroplating cell using the cleaning device of claim 1 , the method comprising:
moving the arm to align the nozzle with a portion of the substrate holder; spraying the cleaning agent onto the portion of the substrate holder through the nozzle to remove the contamination; and receiving the cleaning agent through the receiver after the cleaning agent is sprayed onto the portion of the substrate holder.

18 . The method of claim 17 , further comprising rotating the substrate holder when spraying the cleaning agent onto the portion of the substrate holder.

19 . The method of claim 17 , wherein the receiver comprises a vent on the receiver, and the method further comprises sucking up the cleaning agent through the vent when receiving the cleaning agent through the receiver.

20 . The method of claim 17 , wherein spraying the cleaning agent onto the portion of the substrate holder comprises:
spraying an acid onto the portion of the substrate holder; spraying an dry solvent onto the portion of the substrate holder after spraying the acid onto the portion of the substrate holder; and spraying inert gas onto the portion of the substrate holder after spraying the dry solvent onto the portion of the substrate holder.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wang Yu-Young
• Kao Chung-En
• Lu Victor Y

Classifications

• B08B2203/0229

  Suction chambers for aspirating the sprayed liquid · CPC title

• C25D21/08

  Rinsing · CPC title

• C25D21/00

  Processes for servicing or operating cells for electrolytic coating · CPC title

• B08B3/02 Primary

  Cleaning by the force of jets or sprays · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title